2000 Reviewers for CAD

COMPUTER-AIDED DESIGN Computer-Aided Design 33 (2001) 421±423

www.elsevier.com/locate/cad

Announcement

2000 Reviewers for CAD

Abdel-Malek, K., University of Iowa, USA Al-Hakim, L., Monash University, AUSTRALIA Anderl, R., TU Darmstadt, GERMANY Anderson, D.C., Purdue University, USA Armstrong, C.G., Queen's University of Belfast, UK Au, C.K., Unigraphics Solutions Far East, HONG KONG Ballot, E., Ecole Nationale SupeÂrieure des Mines de Paris, FRANCE Barnes, C., University of Leeds, UK Barry, P.J., University of Minnesota, USA Bedi, S., University of Waterloo, CANADA Bercovier, M., Hebrew University of Jerusalem, ISRAEL Bidarra, R., Urinova-CRI, PORTUGAL Blackmore, D., New Jersey University of Technology, USA Bloor, M.I.G., University of Leeds, UK Bogacki, P., Old Dominion University, USA Bowyer, A., University of Bath, UK Bradley, C., University of Victoria, CANADA Britton, G.A., Nanyang Technological University, SINGAPORE Bronsvoort, W.F., Delft University of Technology, THE NETHERLANDS Brunet, P., Universitat PoliteÁcnica de Catalunya, SPAIN Cagan, J., Carnegie Mellon University, USA Chang, C.-T., National Chiao Tung University, TAIWAN Chen, K.-Z., The University of Hong Kong, HONG KONG Chen, Y., Ford Research Laboratory, USA Chen, Y.H., University of Hong Kong, HONG KONG Cheng, F., University of Kentucky, USA Chieng, W.-H., National Chiao Tung University, TAIWAN Cho, D., POSTECH, SOUTH KOREA Cho, W., Massachusetts Institute of Technology, USA Choi, B.K., KAIST, SOUTH KOREA Chou, J.J., Lawrence Livermore National Labs, USA Chou, S.-C., Wichita State University, USA Chu, C.N., Seoul National University, SOUTH KOREA Corney, J.R., Heriot-Watt University, UK CuillieÁre, J.C., Universite du QueÂbec aÁ Trois RivieÁres, CANADA Culley, S.J., University of Bath, UK Degen, W.L.F., UniversitaÈt Stuttgart, GERMANY Desrochers, A., Universite de Sherbrooke, CANADA PII: S 0010-448 5(00)00137-8

Ding, H., City University of Hong Kong, HONG KONG Dokken, T., SINTEF SI, NORWAY Dori, D., TECHNION, ISRAEL Durr, H., TU Chemnitz-Zwickau, GERMANY Dutta, D., University of Michigan, USA Eastman, C.M., Georgia Institute of Technology, USA Eberhardt, B., UniversitaÈt TuÈbingen, GERMANY Eck, M., ICEM Technologies GmbH, GERMANY Elber, G.,TECHNION, ISRAEL Farouki, R.T., University of California at Davis, USA Field, D.A., General Motors Research Labs, USA Finger, S.J., Carnegie Mellon University, USA Flutter, A., NC Graphics, UK Fuh, J.Y.H., National University of Singapore, SINGAPORE Gadh, R., University of Wisconsin-Madison, USA Gaines, D.M., Vanderbilt University, USA Gao, X.-S., Academica Sinica, P.R. CHINA Gavankar, P., Texas A&M University, USA Goldman, R.N., Rice University, USA Goshtasby, A., University of Illinois at Chicago, USA Goult, R.J., LMR Systems, UK Gupta, S.K., Carnegie Mellon University, USA Hahmann, S., Universite Joseph Fourier Grenoble 1, FRANCE Han, J.H., Sung Kyun Kwan University, SOUTH KOREA Hattangady, N.V., Aluminum Company of America, USA Hayes, C.C., University of Illinois at Urbana, USA Henson, B., University of Leeds, UK Hoffmann, C.M., Purdue University, USA HorvaÂth, I., Delft University of Technology, THE NETHERLANDS Hoschek, J., Technische Hochschule Darmstadt, GERMANY Hsu, W., National University of Singapore, SINGAPORE Hu, S.-M., Tsinghua University, P.R. CHINA Huband, J., Georgia Southern University, USA Hui, K.C., Chinese University of Hong Kong, HONG KONG

422

Announcement / Computer-Aided Design 33 (2001) 421±423

Hwang, J.S., Hyundai Motor Company, SOUTH KOREA Jensen, C.G., Brigham Young University, USA Jerard, R.B., University of New Hampshire, USA Joan-Arinyo, R., Universitat PoliteÁcnica de Catalunya, SPAIN Johnson, A.L., Cambridge University, UK Joskowicz, L., The Hebrew University, ISRAEL Juster, N.P., University of Strathclyde, UK JuÈttler, B., TH Darmstadt, GERMANY Kim, G.J., Pohang University of Science and Technology, SOUTH KOREA Kim, K.-S., Pohang University of Science and Technology, SOUTH KOREA Kim, M.-S., Seoul National University, SOUTH KOREA Kim, Y.S., University of Wisconsin, Milwaukee, USA Kurfess, T.R., Georgia Institute of Technology, USA Kruth, J.P., WTCM/CRIF, BELGIUM Kuo, M.H., National Defense Management College, TAIWAN Kusiak, A., University of Iowa, USA Laakko, T., Helsinki University of Technology, FINLAND Lee, I.-K., Pohang University of Science and Technology, SOUTH KOREA Lee, K., Seoul National University, SOUTH KOREA Lee, Y.S., North Carolina State University, USA LeÂon, J.-C., URA-CNRS 1511, FRANCE Li, B., Variation Systems Analysis, Inc., USA Lim, A., National University of Singapore, SINGAPORE Lin, A.C., National Taiwan University, TAIWAN Lin, Y.-J., University of Akron, USA Lo, C.-C., Feng Chia University, TAIWAN Long, A., University of Nottingham, UK Lopes, H., Catholic University of Rio de Janeiro, BRAZIL Lukacs, G., SDRC, USA Ma, W., City University of Hong Kong, HONG KONG Ma, Y., Ericsson, Inc., USA Maekawa, T., MIT, USA MaÈntylaÈ, M., Helsinki University of Technology, FINLAND Martin, R.R., University of Wales College of Cardiff, UK Medeiros, D.J., Pennsylvania State University, USA Meek, D.S., University of Manitoba, CANADA Menq, C.-H., Ohio State University, USA Middleditch, A.E., Brunel University, UK Mill, F.G., University of Edinburgh, UK Miller, J.R., University of Kansas, USA Mukerjee, A., IIT Kanpur, INDIA Murakami, T., University of Tokyo, JAPAN Nagasaka, I., University of Tokyo, JAPAN

Nee, A.Y.C., National SINGAPORE

University

of

Singapore,

O'Grady, P., University of Iowa, USA Ong, C.-J., National University of Singapore, SINGAPORE Owen, J., University of Bradford, UK Park, J.W., Yeungnam University, SOUTH KOREA Park, S., Chungnam National University, SOUTH KOREA Patrikalakis, N.M., MIT, USA Poliakoff, J., Nottingham Trent University, UK Pottmann, H., Technische UniversitaÈt Wien, AUSTRIA Pratt, M.J., NIST, USA Prautzsch, H., UniversitaÈt Karlsruhe, GERMANY Qamhiyah, A.Z., Iowa State University, USA Regli, W.C., Drexel University, USA Renner, G., Hungarian Academy of Sciences, HUNGARY Requicha, A.A.G., University of Southern California, USA Rezayat, M., SDRC, USA Roberts, C.A., Arizona State University, USA Rokne, J.G., University of Calgary, CANADA Roller, D., UniversitaÈt Stuttgart, GERMANY Rong, Y., Southern Illinois University at Carbondale, USA Rosen, D., Georgia Institute of Technology, USA Rosenman, M.A., University of Sydney, AUSTRALIA Roy, U., Syracuse University, USA Sacks, E.P., Purdue University, USA Sakurai, H., Colorado State University, USA SaÂnchez-Reyes, J., Polytecnic University of Catalonia, SPAIN Sapidis, N.S., National Technical University of Athens, GREECE Sarma, S.E., MIT, USA Sarraga, R., General Motors Research Labs, USA Schmidt, L.C., University of Maryland, USA Sederberg, T.W., Brigham Young University, USA Shah, J.J., Arizona State University, USA Sheffer, A., University of Illinois at Urbana Champaign, USA Shephard, M.S., RPI, USA Shimada, K., Carnegie Mellon University, USA Spence, A.D., McMaster University, USA Sriram, R.D., NIST, USA Stewart, N.F., Universite de MontreÂal, CANADA Tam, H.-Y., City University of Hong Kong, HONG KONG Tan, S.-T., University of Hong Kong, HONG KONG Tang, K., Applicon Inc., USA Tiller, W., GeomWare, Inc., USA Todd, J., NC Graphics, UK Tor, S.B., Nanyang Technological University, SINGAPORE Trochu, F., Ecole Politechnique, Montreal, CANADA Turkiyyah, G., University of Washington, USA

Announcement / Computer-Aided Design 33 (2001) 421±423

VaÂrady, T., Hungarian Academy of Sciences, HUNGARY Vergeest, J.S.M., Delft University of Technology, THE NETHERLANDS Vesterager, J., Technical University of Denmark, DENMARK Voelcker, H.B., Cornell University, USA Wallner, J., TU Wein, AUSTRIA Walton, D.J., University of Manitoba, USA Wang, Y., Georgia Institute of Technology, USA Wang, Y., NIST, USA West, M., Shell, UK Williams, R., University of Ohio, USA Wong, T.N., University of Hong Kong, HONG KONG Wong, Y.-S., National University of Singapore, SINGAPORE

423

Woo, T.C.-H., University of Washington, USA Xue, D., University of Calgary, USA Yang, D.C.H., University of California at Los Angeles, USA Yang, T., California Polytechnic State University, USA Yao, Y.X., Harbin Institute of Technology, P.R. CHINA Yokoyama, M., Tokyo Institute of Technology, JAPAN Yu, K.-M., The Hong Kong Polytechnic University, HONG KONG Zhang, Y.F., National University of SINGAPORE Zube, S., Vilnius University, LITHUANIA

Singapore,