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Choosing logic for microcircuits
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A B S T R A C T S ON 3 I I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
computer orgamzatlon enhances reliabihty of the basic nortredundant layout, achte~ m g a mean hfettme of 1500 hr (failure probabthty of 0-005 for an 8-hr mission). For art 8-hr mission, the redundant computer has an equivalent lifetime of 110 years (failure probab~ty of 10 -~) Reliability trends in s p a c e electronics. D. B. DL.~CA.X-,Electron Ind 22, 2-4 (t963) The ordmary performance parameters required of electronic systems can be obtained without pushmg the state of the art too far. The one parameter now most in need of improvement is retiabtht~, especially for critical space missions. To achieve this in small-quantity production, each part and s)stem must be made under controlled conditions. The conditions must be both rigid and flexible enough so that unless changes are explicitly ordered, none is made, but x~hen changes are ordered, thes should be readily and accurately assimilated. This requires strong management support and direction. MAINTENANCE Bureau of ships m a i n t a i n a b i l i t y specification. G. _3,IARGLLIESand J. SACKS,Proc. N~,lth .\-atl. Syrup on Reliab. and Qval. Control, San Francisco, California, pp 84--92 (Jan. 1963). This report describes the steps taken by the Navy in developmg a maintainability index procedure which could be used as a specification requirement. The report contains various tables which- give the average times for mmntenance actions based on fleet studies of maintenance function on radar, sonar and a communication transmitter used aboard destroyers. The proposed solution to a maintamabdity index requirement was validated by later studies on additional units of equipment and other units of the fleet
Routiner searches out line faults. Automat. Electr. Tech. J. 8, 222 (1963). A ne~ Automatic Routtner detects faults tip 1 megohm, requires no dtstrtbutor trunks, and has art integral prmter MICROELECTRONICS--GENERAL M i c r o e l e c t r o n i c components: capability and availability. Staff Report_ Electro-Techtlo[, p. 103 (Oct. 1963). A sur~ey of presently available microelectronic devices. Representative approaches to microelectronics are illustrated, and manufacturers' data ou modules, thin-film circuits and semiconductor integrated ctrcutts are tabulated. A laboratory for the development of m i c r o m o d u l e s . ~ W. HENSIG, Elektromk (German~') 11, 143-145 (1962). In German Describcs a micromodule laboratory containing all component parts and devices necessary for the electronic engineer to develop micromodules. The starting material is standardized wafers; components with desired values and terminal configurations are made from them by removing unwanted material with a fine sandblasting machine
Progress a n d pitfalls in m i c r o e l e c t r o n i c s . * J. J SrJRA~', Electronics (US,q) 35, 45-49 (1962). A review paper summarizing the technologies at present available in microelectronics Two of the most important problems are to resolve the difficulties of making transistors and diodes ~ith thin film deposition techmques developed for semiconductor work_ Choosing logic for m i c r o c i r c u i t s . A. E. SKOU~S, Electromcs, p. 23 (Oct. 1963)_ Six common logic ctrcmts are compared for microcircuit use- direct-coupled transistor logic (DCTL), resistor-transistor logic (RTL), resistor-capacitor-transistor logic (RCTL), transistor-coupled transistor logic (TTL), diode-transistor logic (DTL) and emitter coupled transistor logic (ECTL). Although no scheme is clearly superior each has its peculiar advantages and disadvantages. Worst-case operatmg conditions are considered. Flip chips easier to connect. E. Q. CARR, Electromcs, p. 82 (Oct. 1963). Flip-chip technique for raterconnecting integrated circuits, or functional electronic blocks, avoids several of the yield and interconnection reliability problems that now exist when the interconnections are made directly on the integrated circuit. In the flip-chip technique, interconnections are deposited separately as a separate thm-film circuit on an insulating substrate and the integrated circuit is bonded face down to the second substrateM i c r o c o m p u t e r comes off the line. Electronics, p. 14 (Nov. 1963). Last week, completion of the first of the microelectronic computers for the Improved Minuteman I C B M was announced by the Autonetlcs division of North American Aviation The programme, begun two years ago, is considered a pioneering
A B S T R A C T S ON 3 I I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
computer orgamzatlon enhances reliabihty of the basic nortredundant layout, achte~ m g a mean hfettme of 1500 hr (failure probabthty of 0-005 for an 8-hr mission). For art 8-hr mission, the redundant computer has an equivalent lifetime of 110 years (failure probab~ty of 10 -~) Reliability trends in s p a c e electronics. D. B. DL.~CA.X-,Electron Ind 22, 2-4 (t963) The ordmary performance parameters required of electronic systems can be obtained without pushmg the state of the art too far. The one parameter now most in need of improvement is retiabtht~, especially for critical space missions. To achieve this in small-quantity production, each part and s)stem must be made under controlled conditions. The conditions must be both rigid and flexible enough so that unless changes are explicitly ordered, none is made, but x~hen changes are ordered, thes should be readily and accurately assimilated. This requires strong management support and direction. MAINTENANCE Bureau of ships m a i n t a i n a b i l i t y specification. G. _3,IARGLLIESand J. SACKS,Proc. N~,lth .\-atl. Syrup on Reliab. and Qval. Control, San Francisco, California, pp 84--92 (Jan. 1963). This report describes the steps taken by the Navy in developmg a maintainability index procedure which could be used as a specification requirement. The report contains various tables which- give the average times for mmntenance actions based on fleet studies of maintenance function on radar, sonar and a communication transmitter used aboard destroyers. The proposed solution to a maintamabdity index requirement was validated by later studies on additional units of equipment and other units of the fleet
Routiner searches out line faults. Automat. Electr. Tech. J. 8, 222 (1963). A ne~ Automatic Routtner detects faults tip 1 megohm, requires no dtstrtbutor trunks, and has art integral prmter MICROELECTRONICS--GENERAL M i c r o e l e c t r o n i c components: capability and availability. Staff Report_ Electro-Techtlo[, p. 103 (Oct. 1963). A sur~ey of presently available microelectronic devices. Representative approaches to microelectronics are illustrated, and manufacturers' data ou modules, thin-film circuits and semiconductor integrated ctrcutts are tabulated. A laboratory for the development of m i c r o m o d u l e s . ~ W. HENSIG, Elektromk (German~') 11, 143-145 (1962). In German Describcs a micromodule laboratory containing all component parts and devices necessary for the electronic engineer to develop micromodules. The starting material is standardized wafers; components with desired values and terminal configurations are made from them by removing unwanted material with a fine sandblasting machine
Progress a n d pitfalls in m i c r o e l e c t r o n i c s . * J. J SrJRA~', Electronics (US,q) 35, 45-49 (1962). A review paper summarizing the technologies at present available in microelectronics Two of the most important problems are to resolve the difficulties of making transistors and diodes ~ith thin film deposition techmques developed for semiconductor work_ Choosing logic for m i c r o c i r c u i t s . A. E. SKOU~S, Electromcs, p. 23 (Oct. 1963)_ Six common logic ctrcmts are compared for microcircuit use- direct-coupled transistor logic (DCTL), resistor-transistor logic (RTL), resistor-capacitor-transistor logic (RCTL), transistor-coupled transistor logic (TTL), diode-transistor logic (DTL) and emitter coupled transistor logic (ECTL). Although no scheme is clearly superior each has its peculiar advantages and disadvantages. Worst-case operatmg conditions are considered. Flip chips easier to connect. E. Q. CARR, Electromcs, p. 82 (Oct. 1963). Flip-chip technique for raterconnecting integrated circuits, or functional electronic blocks, avoids several of the yield and interconnection reliability problems that now exist when the interconnections are made directly on the integrated circuit. In the flip-chip technique, interconnections are deposited separately as a separate thm-film circuit on an insulating substrate and the integrated circuit is bonded face down to the second substrateM i c r o c o m p u t e r comes off the line. Electronics, p. 14 (Nov. 1963). Last week, completion of the first of the microelectronic computers for the Improved Minuteman I C B M was announced by the Autonetlcs division of North American Aviation The programme, begun two years ago, is considered a pioneering