Corrigendum to: Biocompatibility evaluation of a thermoplastic rubber for wireless telemetric intracranial pressure sensor coating

Corrigendum to: Biocompatibility evaluation of a thermoplastic rubber for wireless telemetric intracranial pressure sensor coating

journal of the mechanical behavior of biomedical materials 53 (2016) 463 Available online at www.sciencedirect.com www.elsevier.com/locate/jmbbm Co...

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journal of the mechanical behavior of biomedical materials 53 (2016) 463

Available online at www.sciencedirect.com

www.elsevier.com/locate/jmbbm

Corrigendum to: Biocompatibility evaluation of a thermoplastic rubber for wireless telemetric intracranial pressure sensor coating Jun Yanga, Andrea C. Charifd,e, Judit E. Puskasd,e, Hannah Phillipsa, Kaitlyn J. Shanahana, Jessica Garseda, Aaron Fleischmanb, Ken Goldmanc, Shuvo Royf, Matthew T. Luebbersd, Stephen M. Dombrowskia, Mark G. Lucianoa,n a Department of Neurosurgery, Section of Pediatric and Congenital Neurological Surgery, CSF Physiology Laboratory, Neurological Institute, S60, Cleveland Clinic, 9500 Euclid Avenue, Cleveland, OH 44195, USA b Department of Biomedical Engineering, Lerner Research Institute, Cleveland Clinic, Cleveland, OH 44195, USA c H-Cubed, Inc., Olmsted Falls, OH 44138, USA d Department of Chemical and Biomolecular Engineering, The University of Akron, USA e Department of Polymer Science, The University of Akron, USA f Department of Bioengineering, The University of California San Francisco, San Francisco, CA, USA

The authors regret that name of an author was excluded by mistake in the above article. His name is Shuvo Roy and his affiliation is ‘The University of California San Francisco, San Francisco, CA, USA’ which could be designated as postscript letter ‘f’. His name would be listed after Ken Goldman. Thank you.

DOI of original article: http://dx.doi.org/10.1016/j.jmbbm.2015.01.018 n

Corresponding author. E-mail address: [email protected] (M.G. Luciano).

http://dx.doi.org/10.1016/j.jmbbm.2015.08.028 1751-6161/& 2015 Elsevier Ltd. All rights reserved.