Electrostatic deposition onto a dielectric substrate

structure; applying a continuous metallic fibrous reinforcing material onto the front surface in a plurality of revolutions; applying a coating of a first binder precursor onto the front surface; exposing to conditions effective to solidify the first binder precursor and bond the fibrous reinforcing m a t e r i a l to the front surface to form an endless spliceless reinforced backing; and applying an abrasive coating comprising abrasive particles and adhesive over the back surface or front surface of the endless spliceless reinforced backing. ELECTROSTATIC DEPOSITION ONTO A DIELECTRIC SUBSTRATE

U.S. Patent 5,830,274. Nov. 3, 1998 D.B. Jones et al., assignors to PPG Industries Inc., Pittsburgh

An apparatus for etectrostatically coating hollow containers made from a dielectric m a t e r i a l and having an opening leading into their interior.

the chamber and the power to the s u p p l e m e n t a l p l a s m a electrode at a level to ignite a plasma in the gas in the chamber; following ignition of the p l a s m a energizing the t a r g e t so as to initiate the s p u t t e r i n g of coating material from the t a r g e t with ions from the plasma; t h e n while the t a r g e t is energized, reducing the combined pressure and power to the s u p p l e m e n t a l p l a s m a electrode to a level below t h a t required for ignition of the p l a s m a but above a level required to sustain the plasma so as to s p u t t e r the coating m a t e r i a l from the target.

APPARATUS FOR LOW-PRESSURE SPUTTERING

U.S. Patent 5,830,330. Nov. 3, 1998 A.D. Lantsman, assignor to Tokyo Electron Ltd., Tokyo

A method of s p u t t e r i n g comprising supporting a s u b s t r a t e in a v a c u u m s p u t t e r i n g chamber facing a t a r g e t of a s p u t t e r coating m a t e r i a l m o u n t e d on a sputtering c a t h o d e a s s e m b l y in t h e chamber; establishing a v a c u u m pressure of gas w i t h i n the chamber; coupling RF energy from a s u p p l e m e n t a l p l a s m a electrode into gas in the chamber; controlling the combined pressure in

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U.S. Patent 5,830,327. Nov. 3, 1998 R.J. Kolenkow, assignor to Intevac Inc., Santa Clara, Calif.

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