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Embedded metallic deposits
CATHODE CARTRIDGE FOR ELECTROPLATING TESTER
OXIDE COATED CUTTING TOOL
US. 6673218 (Yamamoto MS Co Ltd) Yamamoto, W.
US. 6673393 (Sandvik AB) Ljungberg, B.
Plating device for silicon wafer.
A body is at least partially coated with one or more refractory layers of which at least one layer is of a finegrained kappa-alumina which has equiaxed grains with an average grain size of 0.5pro. The A1203 layer also has at least one sublayer containing A1, Si and O. The finegrained kappa-A1203 microstructure is obtained by periodically introducing a silicon halide, preferably SIC14, during the A1203-process.
VOLTAMMETRIC ANALYSIS OF HALIDE ION CONCENTRATION
US. 6673226 (ECI Technology (US.) Perpich, M.J.; Shalyt, E. The concentration of chloride ion in an acid copper electroplating b a t h is d e t e r m i n e d from the effect that chloride exerts on the copper electrodeposition rate in the presence of organic additives. A cyclic voltammetric stripping (CVS) rate p a r a m e t e r is measured, before and after standard addition of a plating bath sample, in an acid copper electrodeposition solution containing little or no chloride and at least one organic additive. Cross contamination and waste disposal issues associated with the reagents and reaction products involved in chloride titration analyses are avoided. The method m a y also be applied to analysis of other halides (bromide and iodide) and other solutions. PROCESS FOR PRODUCING THREE-DIMENSIONAL, SELECTIVELY METALLIZED PLASTIC PARTS
US. 6673227 (Siemens Production & Logistics) Boone, L. P a r t s are p r o d u c e d by t w o - c o m p o n e n t injection molding. Those regions t h a t are to be metallized consist of a first plastic and those regions that are not be be metallized consist of a second plastic. After the entire surface of the parts has been seed: ed, the seeding is selectively removed with the aid of a solvent in the regions which are not to be metallized. The first plastic is insoluble and the second plastic soluble in the solvent. The selective metallization then takes place by electroless metal deposition and, if a p p r o p r i a t e , electrodeposition of metal. ARRANGEMENT FOR CLEANING THE BOTTOM OF A N ELECTROLYTIC TANK
US. 6673228 Stenroos, J.; Kivistoe, T An arrangement for cleaning the bottom of an electrolytic t a n k of solids settled on the bottom of the tank, comprising elements to be moved along the bottom or at least in the vicinity t h e r e o f in order to detach solids from the bottom. The a r r a n g e m e n t comprises at least one moveable suction element, whereby at least part of the solids accumulated on the bottom is conducted out of the tank. 92
ARRANGEMENT FOR DECREASING GALVANIC CORROSION BETWEEN METAL COMPONENTS
US. 6673469 (Volvo Personvagnar AB) Andersen, S.; Hyttel, H. et al. Galvanic couple effect is minimised by application of insulative coating to screws or fasteners. METHOD FOR ASSEMBLING A N D HARDENING A BALL PLUG IN A COUNTERBORE OF A FUEL INJECTOR NOZZLE ASSEMBLY
US. 2004000357 Cheung, A.Y.; Jackson, S.C. et al. Core h a r d e n i n g & gas nitriding results in dimensional change to provide tight seal. CORROSION RESISTANT TRIVALENT CHROMIUM PHOSPHATED CHEMICAL CONVERSION COATINGS
US. 2004000358 Bhatia, P. An acidic aqueous solution containing a water soluble trivalent chromium compound is provided with a additive for improving corrosion resistance and reducing precipitation of trivalent chromium over time. A suitable additive is nitrilotris (methylene) triphosphonic acid (NTMP). EMBEDDED METALLIC DEPOSITS
US. 2004000371 Bhullar, R.; Fjelstad, J.C. A method of making a set of metallic deposits includes plastics injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip. METHODS IN ELECTROANALYTICAL TECHNICAL TO ANALYZE ORGANIC COMPONENTS IN PLATING BATHS
U.S. 2004000484 (Applied Materials Inc.) Metzger, B.; Sun, Z.W. et al. Metal Finishing
OXIDE COATED CUTTING TOOL
US. 6673218 (Yamamoto MS Co Ltd) Yamamoto, W.
US. 6673393 (Sandvik AB) Ljungberg, B.
Plating device for silicon wafer.
A body is at least partially coated with one or more refractory layers of which at least one layer is of a finegrained kappa-alumina which has equiaxed grains with an average grain size of 0.5pro. The A1203 layer also has at least one sublayer containing A1, Si and O. The finegrained kappa-A1203 microstructure is obtained by periodically introducing a silicon halide, preferably SIC14, during the A1203-process.
VOLTAMMETRIC ANALYSIS OF HALIDE ION CONCENTRATION
US. 6673226 (ECI Technology (US.) Perpich, M.J.; Shalyt, E. The concentration of chloride ion in an acid copper electroplating b a t h is d e t e r m i n e d from the effect that chloride exerts on the copper electrodeposition rate in the presence of organic additives. A cyclic voltammetric stripping (CVS) rate p a r a m e t e r is measured, before and after standard addition of a plating bath sample, in an acid copper electrodeposition solution containing little or no chloride and at least one organic additive. Cross contamination and waste disposal issues associated with the reagents and reaction products involved in chloride titration analyses are avoided. The method m a y also be applied to analysis of other halides (bromide and iodide) and other solutions. PROCESS FOR PRODUCING THREE-DIMENSIONAL, SELECTIVELY METALLIZED PLASTIC PARTS
US. 6673227 (Siemens Production & Logistics) Boone, L. P a r t s are p r o d u c e d by t w o - c o m p o n e n t injection molding. Those regions t h a t are to be metallized consist of a first plastic and those regions that are not be be metallized consist of a second plastic. After the entire surface of the parts has been seed: ed, the seeding is selectively removed with the aid of a solvent in the regions which are not to be metallized. The first plastic is insoluble and the second plastic soluble in the solvent. The selective metallization then takes place by electroless metal deposition and, if a p p r o p r i a t e , electrodeposition of metal. ARRANGEMENT FOR CLEANING THE BOTTOM OF A N ELECTROLYTIC TANK
US. 6673228 Stenroos, J.; Kivistoe, T An arrangement for cleaning the bottom of an electrolytic t a n k of solids settled on the bottom of the tank, comprising elements to be moved along the bottom or at least in the vicinity t h e r e o f in order to detach solids from the bottom. The a r r a n g e m e n t comprises at least one moveable suction element, whereby at least part of the solids accumulated on the bottom is conducted out of the tank. 92
ARRANGEMENT FOR DECREASING GALVANIC CORROSION BETWEEN METAL COMPONENTS
US. 6673469 (Volvo Personvagnar AB) Andersen, S.; Hyttel, H. et al. Galvanic couple effect is minimised by application of insulative coating to screws or fasteners. METHOD FOR ASSEMBLING A N D HARDENING A BALL PLUG IN A COUNTERBORE OF A FUEL INJECTOR NOZZLE ASSEMBLY
US. 2004000357 Cheung, A.Y.; Jackson, S.C. et al. Core h a r d e n i n g & gas nitriding results in dimensional change to provide tight seal. CORROSION RESISTANT TRIVALENT CHROMIUM PHOSPHATED CHEMICAL CONVERSION COATINGS
US. 2004000358 Bhatia, P. An acidic aqueous solution containing a water soluble trivalent chromium compound is provided with a additive for improving corrosion resistance and reducing precipitation of trivalent chromium over time. A suitable additive is nitrilotris (methylene) triphosphonic acid (NTMP). EMBEDDED METALLIC DEPOSITS
US. 2004000371 Bhullar, R.; Fjelstad, J.C. A method of making a set of metallic deposits includes plastics injection molding a substrate, where a pattern of channels is in a surface of the substrate, applying a metallic layer on the surface, to form metallic deposits in the pattern, and removing a portion of the metallic layer, to expose a portion of the surface. The set of metallic deposits can form an electrode set for an electrochemical sensor strip. METHODS IN ELECTROANALYTICAL TECHNICAL TO ANALYZE ORGANIC COMPONENTS IN PLATING BATHS
U.S. 2004000484 (Applied Materials Inc.) Metzger, B.; Sun, Z.W. et al. Metal Finishing