- Email: [email protected]
Etching
systems were also the subject of patents issued to Armstrong and Becker, to Goenka (II), and to Cryer et al. Shank et al. devised a differential pressure metering and dispensing system for abrasive media. Media control valves garnered patents for Shank (II), and for Spears and Shank. Thompson received a patent for a suction-type shot peening machine sensor. A blasting apparatus using fine, powderlike media was patented by Yoshikawa and Kobayashi. Yam et al. received a patent for a less aggressive blast media for use on very soft or sensitive substrates. Blasting processes utilizing sodium bicarbonate as a media were patented by Rubey and Taylor, and by Shank (I). Blast media were also the subject of patents granted to Schnelle and Thullen, to Winston et al., and to Rooney. References Armstrong, J., and J.R. Becker, U.S. Patent 5,365,699 Brooke, R.K., et al., U.S. Patent 5,415,584; assignors to TOMCO, Equipment Co. Cryer, M.A., et al., U.S. Patent 5,445,553; as-signers to Corporation of Mercer University Elliott. C.P. (I), US. Patent 5.360.486: assignor to Blast Cleaning Products Ltd. Elliott, C.P. (II), U.S. Patent 5,417,608; assignor to Blast Cleaning Products Ltd. Goenka, L.N. (I), U.S. Patent 5,390,450; assignor to Ford Motor Co. Goenka, L.N. (II), U.S. Patent 5,405,283; assignor to Ford Motor Co. Gramm, J.A., and G.L. Overby, U.S. Patent 5,445,557; assignors to Stripping Technologies Inc. Jezek, P.D., and J.E. Stachowiak, U.S. Patent 5,423,348; assignors to J. Edward Stachowiak Knudson, J.R., and T.H. Bunch, U.S. Patent 5,42 I,5 17; assignors to United Technologies Corp. McConkey, S.E., and G.N. Franzky, U.S. Patent 5,371,972; assignors to Shaw Industries Ltd. Mugge, H-J., et al., U.S. Patent 5,386,668; assignors to BMD Badische Maschinenfabrik Durlach GmbH Roberts, J.W., U.S. Patent 5,441,443; assignor to Nelco Mfg. Corp. Rooney, J.J., U.S. Patent 5,375,378 Rubey, A.C., and A.M. Taylor, U.S. Patent 5,366,560; assignors to Yelapa Enterprises Inc. Schnelle, A., and H. Thullen, U.S. Patent 5,373,047; assignors to Ems-Inventa AG Shank. J.D. (I), U.S. Patent 5.401,204: assienor to Church & Dwight Co. Inc. Shank, J.D. (II), U.S. Patent 5,401,205; assignor to Church & Dwight Co. Inc. Shank, J.D. (III), U.S. Patent 5.402.939; assignor to Church & Dwight Co. Inc. Shank, J.D. (IV), U.S. Patent 5,421,766; assignor to Church & Dwight Co. Inc. Shank, J.D., et al., U.S. Patent 5,407,379; assignors to Church & Dwight Co. Inc.
18
Smith, M.D., and G.F. Wells, U.S. Patent 5,367,841 Spears, W.E., U.S. Patent 5,384,990; assignor to Church & Dwight Co. Inc. Spears, W.E., and J.D. Shank, U.S. Patent 5,421,767; assignors to Church & Dwight Co. Inc. Swain, E.A., U.S. Patent 5,431,740; assignor to Xerox Corp. Thompson, R.A., U.S. Patent 5,365,762; assignor to General Electric Co. VanKuiken, L.L., et al., U.S. Patent 5,380,564 West, R.A., U.S. Patent 5,367,840 Winston, A.E., et al., U.S. Patent 5,380,347; assignors to Church & Dwight Co. Inc. Woodson, J.P., and L.M. Camarota, U.S. Patent 5,412,910; assignors to Whitemetal Inc. Yam, B.S., et al., U.S. Patent 5,376,157; assignors to Church & Dwight Co. Inc. Yoshikawa, T., and S. Kobayashi, U.S. Patent 5,443,412; assignors to Sony Corp.
Bianchi, M., U.S. Patent 5,354,383; assignor to ITB S.r.1. Branders, R., U.S. Patent 5449,447; assignor to Le Four Industriel Belge S.A. Carlson, L.R., and P.M. Johnson, U.S. Patent 5,393,447; assignors to Henkel Corp. Neese, E.D., and M.W. Botsford, U.S. Patent 5,412,966; assignors to WorldClass Ind. Inc. Nogues, M., U.S. Patent 5,441,062; assignor to Sollac Pedrazzini, C., U.S. Patent 5,417,775; assignor to ITB S.r.1. Peterson, J.C., U.S. Patent 5,384,064; assignor to Crown Technology Inc.
ETCHING
Opportunities in electrochemical micromachining featuring throughmask electrolytic etching were discussed by Datta. Selective etching processes were the subject of patents PICKLING AND DESCALING granted to Cywar et al., to Templin, to Asrar and Thakur compared differBladon et al., and to Rye et al. Hutchient acid mixtures and tested lining mason and Riddle patented a method and terials for pickling silicon steels. A hyapparatus for acid etching of metal drochloric acid pickling accelerator dies. An apparatus for etching round composition was patented by Peterson. templates won a patent for Achreiner. Bianchi obtained a patent for a process An electrolytic method of etching for pickling stainless steel, without the aluminum foil was patented by Goad. use of nitric acid, consisting of a forKohara et al. obtained a patent for an mulation based on sulfuric acid, ferric acid composition for etching alumiiron, hydrofluoric acid, hydrogen pernum. An alternating current electrooxide, and nonionic surfactant. A simlytic treatment process earned a patent ilar composition was patented by Pefor Kawasumi and Uesugi. Electrodrazzini for pickling and passivation of chemical roughening treatments for titanium. A nitric acid composition for aluminum sheet were the subject of desmutting and deoxidizing garnered a patents granted to Ward et al., and to patent for Carlson and Johnson. Amor et al. Saikawa et al. received a Baudrand described a process, using patent for a grained and anodized alua citrate-based pickle/conditioner, for minum lithographic plate. preparation of high-strength, low-alloy Boyko et al. patented a selective steels and other difficult-to-plate metal electroetching method for copper and alloys for plating. A method and device other metals. A method of etching copfor pickling the edge portions of hotper layers with an acid solution conrolled sheets incorporating ultrasonics taining ammonium and peroxydisulwas patented by Nogues. Neese and fate ions garnered a patent for Lytle et Botsford obtained a patent for a pushal. Richardson and Jordan received a pull pickle line to remove oxides from patent for an etching accelerator addisteel strip. A device for pickling and tive for an alkaline ammoniacal cupric galvanizing strip electrolytically won a chloride etching bath. A process for patent for Branders. Bessey received a electrolytic regeneration of acid cupric patent for a method of descaling metal chloride etchant won a patent for Oxstrip using a fused salt bath consisting ley. of potassium and sodium hydroxides A composition for removing a layer and an alkali metal nitrate. from the binder phase of inserts based on cobalt and/or nickel consisting of a mixture of concentrated sulfuric and phosphoric acids was patented by References Asrar, N., and C.P. Thakur, MetalFinishing, Svensson. Ashby and Ginley obtained 93(2):70; 1995 a patent for a process for etching Baudrand, D., 31st AESF Aerospace & Airline mixed metal oxides using a composiPlating Forum, Denver, Apr. 1995, p. 65 tion containing carboxylic acids. A Bessey, C.M., U.S. Patent 5,377,398; assignor to process for accelerated etching with an Kolene Corp. METAL FINISHING
??
FEBRUARY
1996
ammoniacal reagent consisting of enriching with nitrate up to 200 g/L was patented by Linhard. Hashimoto and Kawasaki patented a method for determining etching rate by monitoring hydrogen gas evolution. Noncontact etch monitoring devices were the subject of a pair of a patents granted to Barbee et al. (I and II). A pair of patents were also awarded to Thorns (I and II) for an etchant distribution apparatus and a spray etch control system. A workpiece holder for a electrochemical high-temperature etching apparatus won a patent for Hsieh and Chang.
References Achreiner, .I., U.S. Patent 5,443,676; assignor to Schblonentechnik Kufstein GmbH Amor, M.P., et al., U.S. Patent 5,449,441; assignors to Alcan International Ltd. Ashbv. C.I.H.. and D.S. Ginlev. U.S. Patent S.356,516; assignors to Sandia Corp. Barhee, S.G., et al. (I), U.S. Patent 5,445,705; assignors to IBM Corp. Barbee, S.G., et al. (II), U.S. Patent 5,451,289; axsignors to IBM Corp. Bladon, J.J., et al., U.S. Patent 5,374,346; assrgnors to Rohm and Haas Co. Boyko, C.M., et al., U.S. Patent 5,374,338; assignors to IBM Corp. Cywar, D., et al., U.S. Patent 5,352,326; assignors to IBM Corp. Datta, M., Interface, 4(2):32; 1995 Goad, D., U.S. Patent 5,405.493; assignor to KDK Corp. Hashimoto, S., and S. Kawasaki, U.S. Patent 5.393,369; assignors to C. Uyemura & Co. Ltd. Hsieh, M-H., and C-S. Chang, U.S. Patent 5.4055 18; assignors to Industrial Technology Research Institute Hutchison, G.E., and R.L. Riddle, U.S. Patent 5,364,494; assignors to Universal Engraving Inc. Kawasumi, S., and A. Uesugi, U.S. Patent 5.358,610; assignors to Fuji Photo Film Co. Ltd. Kohara, I., et al., U.S. Patent 5,387,361; assignors to Sharp KK and Oogi Chem.Ind. Co. Ltd. Linhard, A., U.S. Patent 5,417,818; assignor to Elo-Chem Atztechnik GmbH Lytle, W.H., et al., U.S. Patent 5,409,567; assignor\ to Motorola Inc. Oxley, J.E., U.S. Patent 5,421,966 Richardson, H.W., and C.F. Jordan, U.S. Patent 5.43 1,776; assignors to Phibro-Tech Inc. Rye, R.R., et al., U.S. Patent 5,380,474; assignors to Sandia Corp. Saikawa, M., et al., U.S. Patent 5,427,889; assignors to Mitsubishi Paper Mills Ltd. Svensson, R., U.S. Patent 5,380,408; assignor to Sandvik AB Templin, A.S., U.S. Patent 5,352,331; assignor to TRW Inc. Thorns, R.H. (I), U.S. Patent 5,378,308; assignor to BMC Ind. Inc. Thorns, R.H. (II), U.S. Patent 5,387,313; assignor to BMC Ind. Inc.
METAL FINISHING
.
FEBRUARY
1996
Ward, J.A., et al., U.S. Patent 5,395,489; ors to Alcan International Ltd.
assign-
STRIPPING A chemical stripping solution for solder or solder plate, which is practically inert to copper, was discussed by Sriveeraraghavan et al. Abys et al. obtained a patent for a method of stripping palladium and palladium alloys from copper substrates. Alternatives to nitric acid for stripping of rack tips from copper, nickel, chromium plating were addressed by Erwin et al. Mayo received a patent for a chromium plate removal device.
References Abys, J.A., et al., U.S. Patent 5,380,400; assignors to AT&T Corp. Erwin, S.W., et al., AESF SUR/FIN ‘95, Baltimore, June 1995, Session X, p. 875 Mayo, R.A., U.S. Patent 5,419,046 Sriveeraraghavan, S., et al., Metal Finishing, 93(1):34, 1995
POLISHING AND BUFFING Dickman provided an overview of buffing compounds for hand and automated buffing operations. Procedures for maintaining quality in mediumand high-production buffing operations were discussed by Schaffner. Katopodis described basic procedures for polishing aircraft exteriors. A laser disk buffing apparatus was patented by Born. A method for polishing a substrate, including monitoring of the disposable polishing material, was patented by Winebarger. Stowell obtained a patent for a polishing compound for plastics. A polishing composition won a patent for Yamada et al. Rhoades et al. obtained a patent for an abrasive flow machining and polishing apparatus. Gagliardi described a fine-grained, microstructured coated abrasive suitable for finishing stainless steel. A patterned abrasive material won a patent for Tselesin. Calhoun obtained a patent for an abrasive article having precise lateral spacing between abrasive composite members. An abrasive member comprising a nonwoven fabric garnered a patent for Ferronato and Ferronato. Harmon received a patent for a tear-resistant coated abrasive. Coated abrasive materials were the subject of a number of patents. These were awarded to Harmer et al., to Rowen-
horst and Berg, to Johnson, to Culler et al., to Follensbee, to Sampietro, to Beardsley, to Ohishi, to Stout et al., and to Spurgeon et al. Fujiwara et al. patented an abrasive cloth dresser. An abrasive belt life booster garnered a patent for Pugh and Pugh. Wood received a patent for an abrasive grinding wheel. A process for inducing porosity in an abrasive article earned a patent for Wu. Bigelow et al. patented a method for making a diamond grit abrasive. An abrasive tool covered with cubic boron nitride grits won a patent for Hinterman and Chattopadhyay. Cubic boron nitride abrasives were also featured in patents granted to Wiltshire and Rowen, and to Suzuki et al. Larmie obtained a patent for a method of preparing an abrasive grain containing alumina and ceria. Abrasive articles were also the subject of patents issued to Tamamaki et al., to Celikkaya, and to Bilkadi and Klun. A device for machining the contours of soft materials utilizing a deburring tool composed of abrasive-impregnated elastic cloths was patented by, Ferard et al. Tyler et al. obtained a patent for a rotary abrasive tool. A superabrasive tool won a patent for Frodin et al. Pihl et al. obtained a patent for an abrasive filament. A rotary brush garnered a patent for Lesiw. Bhushan et al. used a semidirect contact mode for chemical-mechanical polishing. Electrochemical potential measurements were taken by Steigerwald et al. during chemical-mechanical polishing of copper using ammonia-based slurries. Slurries for chemical-mechanical polishing of copper were the subject of a patent granted to Yu and Doan. Lustig et al., and also Meikle and Doan, received patents for methods of monitoring chemical-mechanical polishing processes.
References Beardsley, K.A., U.S. Patent 5,389,032; assignor to 3M Co. Bhushan, M., et al., Journal of the Electrochemical Society, 142(11):3845; 1995 Bigelow, L.K.. et al., U.S. Patent 5.364.423; assignors to Norton Co. Bilkadi, Z., and T.P. Klun, U.S. Patent 5,391,210; 3M Co. Born, J., U.S. Patent 5,423,103; assignor to Machine Research Corp. Calhoun, C.D., U.S. Patent 5,437,754; assignor to 3M Co.. Celikkaya, A., U.S. Patent 5,352,254; assignor to 3M Co.
19
18
Smith, M.D., and G.F. Wells, U.S. Patent 5,367,841 Spears, W.E., U.S. Patent 5,384,990; assignor to Church & Dwight Co. Inc. Spears, W.E., and J.D. Shank, U.S. Patent 5,421,767; assignors to Church & Dwight Co. Inc. Swain, E.A., U.S. Patent 5,431,740; assignor to Xerox Corp. Thompson, R.A., U.S. Patent 5,365,762; assignor to General Electric Co. VanKuiken, L.L., et al., U.S. Patent 5,380,564 West, R.A., U.S. Patent 5,367,840 Winston, A.E., et al., U.S. Patent 5,380,347; assignors to Church & Dwight Co. Inc. Woodson, J.P., and L.M. Camarota, U.S. Patent 5,412,910; assignors to Whitemetal Inc. Yam, B.S., et al., U.S. Patent 5,376,157; assignors to Church & Dwight Co. Inc. Yoshikawa, T., and S. Kobayashi, U.S. Patent 5,443,412; assignors to Sony Corp.
Bianchi, M., U.S. Patent 5,354,383; assignor to ITB S.r.1. Branders, R., U.S. Patent 5449,447; assignor to Le Four Industriel Belge S.A. Carlson, L.R., and P.M. Johnson, U.S. Patent 5,393,447; assignors to Henkel Corp. Neese, E.D., and M.W. Botsford, U.S. Patent 5,412,966; assignors to WorldClass Ind. Inc. Nogues, M., U.S. Patent 5,441,062; assignor to Sollac Pedrazzini, C., U.S. Patent 5,417,775; assignor to ITB S.r.1. Peterson, J.C., U.S. Patent 5,384,064; assignor to Crown Technology Inc.
ETCHING
Opportunities in electrochemical micromachining featuring throughmask electrolytic etching were discussed by Datta. Selective etching processes were the subject of patents PICKLING AND DESCALING granted to Cywar et al., to Templin, to Asrar and Thakur compared differBladon et al., and to Rye et al. Hutchient acid mixtures and tested lining mason and Riddle patented a method and terials for pickling silicon steels. A hyapparatus for acid etching of metal drochloric acid pickling accelerator dies. An apparatus for etching round composition was patented by Peterson. templates won a patent for Achreiner. Bianchi obtained a patent for a process An electrolytic method of etching for pickling stainless steel, without the aluminum foil was patented by Goad. use of nitric acid, consisting of a forKohara et al. obtained a patent for an mulation based on sulfuric acid, ferric acid composition for etching alumiiron, hydrofluoric acid, hydrogen pernum. An alternating current electrooxide, and nonionic surfactant. A simlytic treatment process earned a patent ilar composition was patented by Pefor Kawasumi and Uesugi. Electrodrazzini for pickling and passivation of chemical roughening treatments for titanium. A nitric acid composition for aluminum sheet were the subject of desmutting and deoxidizing garnered a patents granted to Ward et al., and to patent for Carlson and Johnson. Amor et al. Saikawa et al. received a Baudrand described a process, using patent for a grained and anodized alua citrate-based pickle/conditioner, for minum lithographic plate. preparation of high-strength, low-alloy Boyko et al. patented a selective steels and other difficult-to-plate metal electroetching method for copper and alloys for plating. A method and device other metals. A method of etching copfor pickling the edge portions of hotper layers with an acid solution conrolled sheets incorporating ultrasonics taining ammonium and peroxydisulwas patented by Nogues. Neese and fate ions garnered a patent for Lytle et Botsford obtained a patent for a pushal. Richardson and Jordan received a pull pickle line to remove oxides from patent for an etching accelerator addisteel strip. A device for pickling and tive for an alkaline ammoniacal cupric galvanizing strip electrolytically won a chloride etching bath. A process for patent for Branders. Bessey received a electrolytic regeneration of acid cupric patent for a method of descaling metal chloride etchant won a patent for Oxstrip using a fused salt bath consisting ley. of potassium and sodium hydroxides A composition for removing a layer and an alkali metal nitrate. from the binder phase of inserts based on cobalt and/or nickel consisting of a mixture of concentrated sulfuric and phosphoric acids was patented by References Asrar, N., and C.P. Thakur, MetalFinishing, Svensson. Ashby and Ginley obtained 93(2):70; 1995 a patent for a process for etching Baudrand, D., 31st AESF Aerospace & Airline mixed metal oxides using a composiPlating Forum, Denver, Apr. 1995, p. 65 tion containing carboxylic acids. A Bessey, C.M., U.S. Patent 5,377,398; assignor to process for accelerated etching with an Kolene Corp. METAL FINISHING
??
FEBRUARY
1996
ammoniacal reagent consisting of enriching with nitrate up to 200 g/L was patented by Linhard. Hashimoto and Kawasaki patented a method for determining etching rate by monitoring hydrogen gas evolution. Noncontact etch monitoring devices were the subject of a pair of a patents granted to Barbee et al. (I and II). A pair of patents were also awarded to Thorns (I and II) for an etchant distribution apparatus and a spray etch control system. A workpiece holder for a electrochemical high-temperature etching apparatus won a patent for Hsieh and Chang.
References Achreiner, .I., U.S. Patent 5,443,676; assignor to Schblonentechnik Kufstein GmbH Amor, M.P., et al., U.S. Patent 5,449,441; assignors to Alcan International Ltd. Ashbv. C.I.H.. and D.S. Ginlev. U.S. Patent S.356,516; assignors to Sandia Corp. Barhee, S.G., et al. (I), U.S. Patent 5,445,705; assignors to IBM Corp. Barbee, S.G., et al. (II), U.S. Patent 5,451,289; axsignors to IBM Corp. Bladon, J.J., et al., U.S. Patent 5,374,346; assrgnors to Rohm and Haas Co. Boyko, C.M., et al., U.S. Patent 5,374,338; assignors to IBM Corp. Cywar, D., et al., U.S. Patent 5,352,326; assignors to IBM Corp. Datta, M., Interface, 4(2):32; 1995 Goad, D., U.S. Patent 5,405.493; assignor to KDK Corp. Hashimoto, S., and S. Kawasaki, U.S. Patent 5.393,369; assignors to C. Uyemura & Co. Ltd. Hsieh, M-H., and C-S. Chang, U.S. Patent 5.4055 18; assignors to Industrial Technology Research Institute Hutchison, G.E., and R.L. Riddle, U.S. Patent 5,364,494; assignors to Universal Engraving Inc. Kawasumi, S., and A. Uesugi, U.S. Patent 5.358,610; assignors to Fuji Photo Film Co. Ltd. Kohara, I., et al., U.S. Patent 5,387,361; assignors to Sharp KK and Oogi Chem.Ind. Co. Ltd. Linhard, A., U.S. Patent 5,417,818; assignor to Elo-Chem Atztechnik GmbH Lytle, W.H., et al., U.S. Patent 5,409,567; assignor\ to Motorola Inc. Oxley, J.E., U.S. Patent 5,421,966 Richardson, H.W., and C.F. Jordan, U.S. Patent 5.43 1,776; assignors to Phibro-Tech Inc. Rye, R.R., et al., U.S. Patent 5,380,474; assignors to Sandia Corp. Saikawa, M., et al., U.S. Patent 5,427,889; assignors to Mitsubishi Paper Mills Ltd. Svensson, R., U.S. Patent 5,380,408; assignor to Sandvik AB Templin, A.S., U.S. Patent 5,352,331; assignor to TRW Inc. Thorns, R.H. (I), U.S. Patent 5,378,308; assignor to BMC Ind. Inc. Thorns, R.H. (II), U.S. Patent 5,387,313; assignor to BMC Ind. Inc.
METAL FINISHING
.
FEBRUARY
1996
Ward, J.A., et al., U.S. Patent 5,395,489; ors to Alcan International Ltd.
assign-
STRIPPING A chemical stripping solution for solder or solder plate, which is practically inert to copper, was discussed by Sriveeraraghavan et al. Abys et al. obtained a patent for a method of stripping palladium and palladium alloys from copper substrates. Alternatives to nitric acid for stripping of rack tips from copper, nickel, chromium plating were addressed by Erwin et al. Mayo received a patent for a chromium plate removal device.
References Abys, J.A., et al., U.S. Patent 5,380,400; assignors to AT&T Corp. Erwin, S.W., et al., AESF SUR/FIN ‘95, Baltimore, June 1995, Session X, p. 875 Mayo, R.A., U.S. Patent 5,419,046 Sriveeraraghavan, S., et al., Metal Finishing, 93(1):34, 1995
POLISHING AND BUFFING Dickman provided an overview of buffing compounds for hand and automated buffing operations. Procedures for maintaining quality in mediumand high-production buffing operations were discussed by Schaffner. Katopodis described basic procedures for polishing aircraft exteriors. A laser disk buffing apparatus was patented by Born. A method for polishing a substrate, including monitoring of the disposable polishing material, was patented by Winebarger. Stowell obtained a patent for a polishing compound for plastics. A polishing composition won a patent for Yamada et al. Rhoades et al. obtained a patent for an abrasive flow machining and polishing apparatus. Gagliardi described a fine-grained, microstructured coated abrasive suitable for finishing stainless steel. A patterned abrasive material won a patent for Tselesin. Calhoun obtained a patent for an abrasive article having precise lateral spacing between abrasive composite members. An abrasive member comprising a nonwoven fabric garnered a patent for Ferronato and Ferronato. Harmon received a patent for a tear-resistant coated abrasive. Coated abrasive materials were the subject of a number of patents. These were awarded to Harmer et al., to Rowen-
horst and Berg, to Johnson, to Culler et al., to Follensbee, to Sampietro, to Beardsley, to Ohishi, to Stout et al., and to Spurgeon et al. Fujiwara et al. patented an abrasive cloth dresser. An abrasive belt life booster garnered a patent for Pugh and Pugh. Wood received a patent for an abrasive grinding wheel. A process for inducing porosity in an abrasive article earned a patent for Wu. Bigelow et al. patented a method for making a diamond grit abrasive. An abrasive tool covered with cubic boron nitride grits won a patent for Hinterman and Chattopadhyay. Cubic boron nitride abrasives were also featured in patents granted to Wiltshire and Rowen, and to Suzuki et al. Larmie obtained a patent for a method of preparing an abrasive grain containing alumina and ceria. Abrasive articles were also the subject of patents issued to Tamamaki et al., to Celikkaya, and to Bilkadi and Klun. A device for machining the contours of soft materials utilizing a deburring tool composed of abrasive-impregnated elastic cloths was patented by, Ferard et al. Tyler et al. obtained a patent for a rotary abrasive tool. A superabrasive tool won a patent for Frodin et al. Pihl et al. obtained a patent for an abrasive filament. A rotary brush garnered a patent for Lesiw. Bhushan et al. used a semidirect contact mode for chemical-mechanical polishing. Electrochemical potential measurements were taken by Steigerwald et al. during chemical-mechanical polishing of copper using ammonia-based slurries. Slurries for chemical-mechanical polishing of copper were the subject of a patent granted to Yu and Doan. Lustig et al., and also Meikle and Doan, received patents for methods of monitoring chemical-mechanical polishing processes.
References Beardsley, K.A., U.S. Patent 5,389,032; assignor to 3M Co. Bhushan, M., et al., Journal of the Electrochemical Society, 142(11):3845; 1995 Bigelow, L.K.. et al., U.S. Patent 5.364.423; assignors to Norton Co. Bilkadi, Z., and T.P. Klun, U.S. Patent 5,391,210; 3M Co. Born, J., U.S. Patent 5,423,103; assignor to Machine Research Corp. Calhoun, C.D., U.S. Patent 5,437,754; assignor to 3M Co.. Celikkaya, A., U.S. Patent 5,352,254; assignor to 3M Co.
19