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I2L: A comprehensive review of techniques and technology
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World Abstracts on Microelectronics and Reliability
is facecl with something of an enigma. Any designer attempts to optimise the conflicting constraints such as cost. timescale, performance, producibility, serviceability and of course reliability. The emphasis within this article is lhe application of reliability methods in design, so the reader is referred to other texts for tidier discussions on the procedures themselves. Sprint missile subsystem reliability achievements. ALAN R. CLARKE. Proc. IEEE Reliab. Maintainab, Syrup., Philadelphia, Jan. 18 20, 1977. p. 367. This paper discusses the reliability of the SPRINT Subsystem with emphasis on techniques employed to achieve that reliability. Two key aspects of reliability are examined: 1. Launch and flight performance 2. Long term storage survivability. The techniques that proved of major importance in achieving the reliability goals are explained and results of each are summarized. The major techniques are use of: 1. High reliability parts 2. One-shot device redundancy 3. Derating 4. Testability 5. Production environmental testing 6. Lot sampling, dissection analysis, and storage 7. Certified lines 8. Clean room assembly area 9. Reliability growth test 10. Preflight management review and inspection 11. No change policy between R & D and production 12. Production line sampling and environmental test 13. Overstress qualification testing.
XM-712 C O P P E R H E A D (CLGP) projectile storage reliability verification test program. THOMAS R. GAGNIER. Proc. IEEE Reliab. Maintainah. Syrup., Philadelphia, Jan. 18-20, 1977. p. 353. The cannon fired C O P P E R H E A D projectile promises to revolutionize the concept of tieldartillery employment. Moreover, terminal homing with indirect fire. at a fraction of the cost of a comparable guided missile, makes C O P P E R H E A D a cost-effective weapon. During the projectile's Advanced Development lAD) phase, the ability of precision guidance parts, components, and assemblies to successfully operate after surviving a cannon-launched environment was dramatically proven at White Sands Missile Range during a competitive shootoff. These firings were against a variety of stationary and moving targets that were illuminated by ground and airborne lasers. Martin Marietta attained an unusually high number of successful hits during the test. Following a competitive procurement and Source Selection Evaluation Board approval, the U.S. Army awarded Martin Marietta the C O P P E R H E A D Engineering Development (ED) phase. During the ED phase, in addition to surviving cannon launch, the projectile will be required to maintain a high reliability after undergoing storage periods of up to 10 years. Designing to meet this storage requirement is many times more severe than designing to meet the launch environment. Hence, the major challenge will be to provide meaningful aging tests to either validate attainment of the storage life requirements or to detect any nonoperating failure mechanisms early in the ED phase. Early detection will permit timely corrective action. The XM-712 COPP E R H E A D projectile Storage Reliability Verification Test [SRVT) Program is discussed in this paper.
4. MICROELECTRONICS--GENERAL Demands of LSI are turning chip makers towards automation, production innovations. JERRY LYMAN. Electronics p. 81 (July 21, 1977). While there are significant improvements under way in the chip layout and wafer-production processes, the most radical advances are taking place in the process that turns a raw wafer into finished IC chips. There are four major changes occurring. (I) The beginning of microprocessor-controlled conveyor-belt operation of the lithographic steps. (2) Replacement of contact pattern printing by projection printing and even more advanced methods. (3) Substitution of plasma dry etching for acid wet etching when removing protective layers. (4) Automation by minicomputer and microprocessor of the diffusion process and related activities. Where and when to use which data converter. EUGENE L. ZUCH. IEEE Spectrum p. 39 (June 1977). With the commercial availability of data-converter products--the result of both hybrid (multichip) and monolithic (single-chip) technologies-users of analog-to-digital (A/D) and digital-toanalog (D/A) converters now have an impressive array of designs from which to choose. In addition, the older discrete-component designs still remain a viable choice for many high-performance applications, particularly those where broad operating characteristics and specialized features are important. Unfortunately, rather than helping the users to match the proper products to their needs, dataconverter manufacturers confuse the issue by arguments over the relative merits of the different technologies, A closer look at the various types of data converters may help to clear up some of this confusion. Process refinements bring C-MOS on sapphire into commercial use. ALAN CAPELL, DARYL KNOBLOCK, LARRY MATHER and LARRY LOPP. Electronics p. 99 (May 26, 1977). First 16-bit microcomputer chip set attains speed of 125 nanoseconds, dissipates 100 milliwatts per chip.
International vacuum standardisation. J. YARWOOD. Vacuum 27, (3) 87. An account of the activity of the International Standards Organization (ISO) since the early 1960s towards setting up agreed standards in vacuum science and technology. This has involved 19 countries in all, but chiefly Belgium, Britain (who run the secretariat), France, Germany, Holland and the USA. Reference is also made to work by other Standards organizations in this connection. The main topics have been terminology, subject classification, the measurement of the performance characteristics of the main types of vacuum pump, the calibration of vacuum gauges, vacuum flange dimensions, vacuum couplings, graphical symbols and leak detection. A critical review stresses some of the basic technical problems and considers present and future progress.
IaL: A comprehensive review of techniques and technology. J. L. STONE Solid St. Technol. p. 42 (June 1977). The history and continuing development of the techniques and technology of integrated injection logic/merged transistor logic are discussed. Various techniques used to extend the performance characteristics such as substrate fed logic, Schottky I2L, ion implantation, and double base processes are detailed in separate sections and new concepts and applications are briefly noted. An exhaustive bibliography from both the technical journals and the application's literature is included. The multifacets of 12L. EDWARD A. TORRERO. IEEE Spectrum p. 29 (June 1977). What once was regarded largely as a potentially troublesome parasitic problem--allowing devices to merge into the same semiconductor region of an integrated circuit tiC) has blossomed into integratedinjection logic (I2L), a full-fledged bipolar technology able to compete with older, established technologies in the marketplace.
World Abstracts on Microelectronics and Reliability
is facecl with something of an enigma. Any designer attempts to optimise the conflicting constraints such as cost. timescale, performance, producibility, serviceability and of course reliability. The emphasis within this article is lhe application of reliability methods in design, so the reader is referred to other texts for tidier discussions on the procedures themselves. Sprint missile subsystem reliability achievements. ALAN R. CLARKE. Proc. IEEE Reliab. Maintainab, Syrup., Philadelphia, Jan. 18 20, 1977. p. 367. This paper discusses the reliability of the SPRINT Subsystem with emphasis on techniques employed to achieve that reliability. Two key aspects of reliability are examined: 1. Launch and flight performance 2. Long term storage survivability. The techniques that proved of major importance in achieving the reliability goals are explained and results of each are summarized. The major techniques are use of: 1. High reliability parts 2. One-shot device redundancy 3. Derating 4. Testability 5. Production environmental testing 6. Lot sampling, dissection analysis, and storage 7. Certified lines 8. Clean room assembly area 9. Reliability growth test 10. Preflight management review and inspection 11. No change policy between R & D and production 12. Production line sampling and environmental test 13. Overstress qualification testing.
XM-712 C O P P E R H E A D (CLGP) projectile storage reliability verification test program. THOMAS R. GAGNIER. Proc. IEEE Reliab. Maintainah. Syrup., Philadelphia, Jan. 18-20, 1977. p. 353. The cannon fired C O P P E R H E A D projectile promises to revolutionize the concept of tieldartillery employment. Moreover, terminal homing with indirect fire. at a fraction of the cost of a comparable guided missile, makes C O P P E R H E A D a cost-effective weapon. During the projectile's Advanced Development lAD) phase, the ability of precision guidance parts, components, and assemblies to successfully operate after surviving a cannon-launched environment was dramatically proven at White Sands Missile Range during a competitive shootoff. These firings were against a variety of stationary and moving targets that were illuminated by ground and airborne lasers. Martin Marietta attained an unusually high number of successful hits during the test. Following a competitive procurement and Source Selection Evaluation Board approval, the U.S. Army awarded Martin Marietta the C O P P E R H E A D Engineering Development (ED) phase. During the ED phase, in addition to surviving cannon launch, the projectile will be required to maintain a high reliability after undergoing storage periods of up to 10 years. Designing to meet this storage requirement is many times more severe than designing to meet the launch environment. Hence, the major challenge will be to provide meaningful aging tests to either validate attainment of the storage life requirements or to detect any nonoperating failure mechanisms early in the ED phase. Early detection will permit timely corrective action. The XM-712 COPP E R H E A D projectile Storage Reliability Verification Test [SRVT) Program is discussed in this paper.
4. MICROELECTRONICS--GENERAL Demands of LSI are turning chip makers towards automation, production innovations. JERRY LYMAN. Electronics p. 81 (July 21, 1977). While there are significant improvements under way in the chip layout and wafer-production processes, the most radical advances are taking place in the process that turns a raw wafer into finished IC chips. There are four major changes occurring. (I) The beginning of microprocessor-controlled conveyor-belt operation of the lithographic steps. (2) Replacement of contact pattern printing by projection printing and even more advanced methods. (3) Substitution of plasma dry etching for acid wet etching when removing protective layers. (4) Automation by minicomputer and microprocessor of the diffusion process and related activities. Where and when to use which data converter. EUGENE L. ZUCH. IEEE Spectrum p. 39 (June 1977). With the commercial availability of data-converter products--the result of both hybrid (multichip) and monolithic (single-chip) technologies-users of analog-to-digital (A/D) and digital-toanalog (D/A) converters now have an impressive array of designs from which to choose. In addition, the older discrete-component designs still remain a viable choice for many high-performance applications, particularly those where broad operating characteristics and specialized features are important. Unfortunately, rather than helping the users to match the proper products to their needs, dataconverter manufacturers confuse the issue by arguments over the relative merits of the different technologies, A closer look at the various types of data converters may help to clear up some of this confusion. Process refinements bring C-MOS on sapphire into commercial use. ALAN CAPELL, DARYL KNOBLOCK, LARRY MATHER and LARRY LOPP. Electronics p. 99 (May 26, 1977). First 16-bit microcomputer chip set attains speed of 125 nanoseconds, dissipates 100 milliwatts per chip.
International vacuum standardisation. J. YARWOOD. Vacuum 27, (3) 87. An account of the activity of the International Standards Organization (ISO) since the early 1960s towards setting up agreed standards in vacuum science and technology. This has involved 19 countries in all, but chiefly Belgium, Britain (who run the secretariat), France, Germany, Holland and the USA. Reference is also made to work by other Standards organizations in this connection. The main topics have been terminology, subject classification, the measurement of the performance characteristics of the main types of vacuum pump, the calibration of vacuum gauges, vacuum flange dimensions, vacuum couplings, graphical symbols and leak detection. A critical review stresses some of the basic technical problems and considers present and future progress.
IaL: A comprehensive review of techniques and technology. J. L. STONE Solid St. Technol. p. 42 (June 1977). The history and continuing development of the techniques and technology of integrated injection logic/merged transistor logic are discussed. Various techniques used to extend the performance characteristics such as substrate fed logic, Schottky I2L, ion implantation, and double base processes are detailed in separate sections and new concepts and applications are briefly noted. An exhaustive bibliography from both the technical journals and the application's literature is included. The multifacets of 12L. EDWARD A. TORRERO. IEEE Spectrum p. 29 (June 1977). What once was regarded largely as a potentially troublesome parasitic problem--allowing devices to merge into the same semiconductor region of an integrated circuit tiC) has blossomed into integratedinjection logic (I2L), a full-fledged bipolar technology able to compete with older, established technologies in the marketplace.