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IEC news
41 North-Holland Microprocessing and Microprogramming 13 (1984) 41-49
BCEF GHIJK L M OPQ UV WXYZ
Standards Section Editor: Harald Schumny
IEC News Designers, manufacturers and end users could be the destination addresses for a number of standards published by the International Electrotechnical Commission (IEC) and dealing with batteries, semiconductors, wires and connectors.
electrochemical system of performance variant. A principal editorial improvement of the fifth edition of both world standards is the omission of the former four-digit sheet reference code, which allows the battery specification sheets to be filed in order of battery designation.
IEC 147-0F: IEC 86-1:
Primary batteries. Part 1: General This is the fifth edition of the well known IEC standard for batteries. It specifies information that generally applies to all primary batteries independent of their size including basic definitions, nomenclature, marking, conditions of test and storage. The 5th edition of IEC 86-1 has been completed by a revised edition of
IEC 86-2:
Primary cells and batteries. Part 2: Specification sheets In order to have the specifications clearly arranged, a physical specification sheet and a system specification sheet will be issued for each individual battery. While the physical specification will give the dimensional and terminal arrangement details together with any other physical requirements for each size of battery, the system specification will give the voltage, discharge tests and performance requirements of each particular
Sixth supplement to Publication 147-0 (1966). Essential ratings and characteristics of semiconductor devices and general principles of measuring methods. Part O: General and terminology. This publication standardizes the storing, transport, handling and testing of electrostatic sensitive semiconductor devices and integrated circuits. It provides a distinctive symbol and label to be used for those electrostatic sensitive devices that require special handling. The symbol or label should be used at the innermost practical level of packaging and on the device itself if space permits. It may also be used on device data sheets, or storage bins, and on special protective wrapping materials. The symbol is intended for use where available space does not permit the use of a label. Publication 147-0F also introduces terms and definitions for current-regulator diodes, terms and definitions for integrated circuit current and voltage regulators, for low-power signal diodes, bipolar transistors, thyristors, and gives further general terms and definitions for integrated microcircuits, digital integrated circuits, integrated circuit memories and optoelectronic devices.
42 IEC
H. Schumny/Standards 189-7:
Low-frequency cables and wires with p. v.c. insulation and p.v.c, sheath. Part 7: Distribution wires with solid conductors, p.v.c, insulated, polyamide coated, in singles, pairs, triples, quads and quintuples. This publication is specifically concerned with wires that are p.v.c, insulated and polyamide coated in singles, pairs, triples, quads and quintuples. These particular wires are widely used for connecting terminals on equipment frames or apparatus to one another or to distribution frames; for interconnection between subscribers' lines and exchange equipment in telegraph or telephone exchanges; and for temporary installations. These wires are generally used under adverse conditions. New requirements laid down in the second edition of IEC 189-7 cover: quality assurance dimensions and test requirements for 0,4 mm and 0,8 mm conductors - a value for the maximum diameter for insulated conductors a single method to calculate the maximum diameter of insulated conductors.
IEC 603-1A: First supplement to Publication 603-1 (1981). Connectors for frequencies below 3 MHz for use with printed boards. Part 1: General rules and guide for the preparation of detail specifications. Appendix B: 'Example of detail specification. Group of related two-part connectors for printed boards for basic grid 2,54 mm (0.1 in), with common mounting features.
This world standard was published to clarify widespread confusion that exists when engineers are called upon to specify two-part connectors for printed boards. The standard covers a group of
related two-part connectors which extends from high-density connectors for low-voltage applications to connectors for relatively high voltages and currents having fewer contacts. All connectors are required to have the same common mounting features irrespective of their different application characteristics. The boardmounted connectors should be provided with terminations suitable for printed boards in accordance with IEC Publication 326 and using a grid of 2,54 mm (0.1 in) as laid down in IEC Publication 97. The standard calls for the fixed connectors to be provided either to be solder contacts or with wrap or crimp contacts. The terminations of the fixed connectors are located in such a way as to be suitable for use with mother boards using a grid as laid down in IEC Publication 97 as well as for automatic wiring techniques. This standard shall be used in conjuntion with the following IEC Publications: 50(581): International Electrotechnical Vocabulary (I.E.V.), Chapter 581: Electromechanical Components for Electronic Equipment. 97 : Grid System for printed circuits. 194 : Terms and definitions for printed circuits. 326 : Printed boards 512 : Electromechanical components for electronic equipment: Basic testing procedure and measuring methods. 603-1 : Connectors for frequencies below 3 MHz for use with printed boards, Part 1: General rules and guide for the preparation of detail specifications. More details can be obtained from the Information Officer Central Office of IEC 1, rue de Varemb6 CH-1211 Geneva 20 Switzerland Tel. 34 01 50
BCEF GHIJK L M OPQ UV WXYZ
Standards Section Editor: Harald Schumny
IEC News Designers, manufacturers and end users could be the destination addresses for a number of standards published by the International Electrotechnical Commission (IEC) and dealing with batteries, semiconductors, wires and connectors.
electrochemical system of performance variant. A principal editorial improvement of the fifth edition of both world standards is the omission of the former four-digit sheet reference code, which allows the battery specification sheets to be filed in order of battery designation.
IEC 147-0F: IEC 86-1:
Primary batteries. Part 1: General This is the fifth edition of the well known IEC standard for batteries. It specifies information that generally applies to all primary batteries independent of their size including basic definitions, nomenclature, marking, conditions of test and storage. The 5th edition of IEC 86-1 has been completed by a revised edition of
IEC 86-2:
Primary cells and batteries. Part 2: Specification sheets In order to have the specifications clearly arranged, a physical specification sheet and a system specification sheet will be issued for each individual battery. While the physical specification will give the dimensional and terminal arrangement details together with any other physical requirements for each size of battery, the system specification will give the voltage, discharge tests and performance requirements of each particular
Sixth supplement to Publication 147-0 (1966). Essential ratings and characteristics of semiconductor devices and general principles of measuring methods. Part O: General and terminology. This publication standardizes the storing, transport, handling and testing of electrostatic sensitive semiconductor devices and integrated circuits. It provides a distinctive symbol and label to be used for those electrostatic sensitive devices that require special handling. The symbol or label should be used at the innermost practical level of packaging and on the device itself if space permits. It may also be used on device data sheets, or storage bins, and on special protective wrapping materials. The symbol is intended for use where available space does not permit the use of a label. Publication 147-0F also introduces terms and definitions for current-regulator diodes, terms and definitions for integrated circuit current and voltage regulators, for low-power signal diodes, bipolar transistors, thyristors, and gives further general terms and definitions for integrated microcircuits, digital integrated circuits, integrated circuit memories and optoelectronic devices.
42 IEC
H. Schumny/Standards 189-7:
Low-frequency cables and wires with p. v.c. insulation and p.v.c, sheath. Part 7: Distribution wires with solid conductors, p.v.c, insulated, polyamide coated, in singles, pairs, triples, quads and quintuples. This publication is specifically concerned with wires that are p.v.c, insulated and polyamide coated in singles, pairs, triples, quads and quintuples. These particular wires are widely used for connecting terminals on equipment frames or apparatus to one another or to distribution frames; for interconnection between subscribers' lines and exchange equipment in telegraph or telephone exchanges; and for temporary installations. These wires are generally used under adverse conditions. New requirements laid down in the second edition of IEC 189-7 cover: quality assurance dimensions and test requirements for 0,4 mm and 0,8 mm conductors - a value for the maximum diameter for insulated conductors a single method to calculate the maximum diameter of insulated conductors.
IEC 603-1A: First supplement to Publication 603-1 (1981). Connectors for frequencies below 3 MHz for use with printed boards. Part 1: General rules and guide for the preparation of detail specifications. Appendix B: 'Example of detail specification. Group of related two-part connectors for printed boards for basic grid 2,54 mm (0.1 in), with common mounting features.
This world standard was published to clarify widespread confusion that exists when engineers are called upon to specify two-part connectors for printed boards. The standard covers a group of
related two-part connectors which extends from high-density connectors for low-voltage applications to connectors for relatively high voltages and currents having fewer contacts. All connectors are required to have the same common mounting features irrespective of their different application characteristics. The boardmounted connectors should be provided with terminations suitable for printed boards in accordance with IEC Publication 326 and using a grid of 2,54 mm (0.1 in) as laid down in IEC Publication 97. The standard calls for the fixed connectors to be provided either to be solder contacts or with wrap or crimp contacts. The terminations of the fixed connectors are located in such a way as to be suitable for use with mother boards using a grid as laid down in IEC Publication 97 as well as for automatic wiring techniques. This standard shall be used in conjuntion with the following IEC Publications: 50(581): International Electrotechnical Vocabulary (I.E.V.), Chapter 581: Electromechanical Components for Electronic Equipment. 97 : Grid System for printed circuits. 194 : Terms and definitions for printed circuits. 326 : Printed boards 512 : Electromechanical components for electronic equipment: Basic testing procedure and measuring methods. 603-1 : Connectors for frequencies below 3 MHz for use with printed boards, Part 1: General rules and guide for the preparation of detail specifications. More details can be obtained from the Information Officer Central Office of IEC 1, rue de Varemb6 CH-1211 Geneva 20 Switzerland Tel. 34 01 50