- Email: [email protected]
Process for through-hole plating
particulate abrasive material, which is soluble in the carrier liquid.
Chemical Cleaning Components
of Metal
U.S.Patent 5'575,863.Nov.19, 1996 5. Sala and A. Gelpi, assignors Courbevoie, France
to Framatome,
A process for chemical cleaning of metal components having an iron oxide deposit upon a layer of compounds having a high silica content, comprising preparing an aqueous mixture including an agent for complexing Si(OH), and at least one compound for dissolving the layer of compounds having a high silica content selected from the group consisting of compounds for inserting OH or F ions selected from the group consisting of conjugated unsaturated systems and unsaturated N-oxide compounds, and OH-containing compounds selected from the group consisting of organic compounds having at least one alcohol function, aromatic amines, soluble salts of tertiary amines, and aromatic amines causing condensation of OH radicals onto silica.
Coated Abrasive
Article
U.S. Patent 5,575,873. Nov. 19, 1996 J.FI. Pieper et al., assignors to 3M Co., St. Pau/, Minn.
Method of preparing an endless coated abrasive article having a butt splice comprising providing a sheet bearing abrasive grains on one major surface thereof; cutting to a desired length in such a manner that the sheet has two ends; abutting the cut ends to form a joint; applying a layer of radiation-curable adhesive onto a portion of each of the cut ends on the major surface thereof not bearing abrasive grains; placing a splice medium over the joint so that the splice medium is in contact with the layers of radiation-curable adhesive; and curing by means of radiation energy.
Process Plating
for Through-Hole
U.S. Patent 5,575,898. Nov. 19, 1996 G-D. Wolf et al, assignors to Bayer AG, Leverkusen, Germany
A process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through holes and electrodepositing copper onto the walls of the through holes, comprising the use of a microemulsion of a monomeric thiophene to form the conductive polythiophene layer.
Zinc-Nickel
Alloy Plating
U.S. Patent 5,575,899. Nov. 79, 7996 M Nakakoji ef al., assignors to Kawasaki Corp., Hyogo, Japan
METAL
FINISHING
l
AUGUST
She/
1997
Reliability, knovation and basic American ingenuity have made Kocour l%ickness Testers tbe choice of progresske plate?s for over 50 years. So, doesn’t it make sense to rely on eitber a Model 6000 with micro-processor based chcuitry providing access to over 300 coating/ substrate applications or tbe compact Series 10 Handheld unit available In both bask and enhanced models. TheModel6000 features:H Versatility- measuresanythingfrom a #2 screwto the largest coil. n Multi-layer coatingsand alloy layers n Wire Capabilityn Digital calibration, 98% Accuracyn Easyto Read Direct Readout n STEPn Print
Kocour’sThicknessTesters
MEASURFA Series IO has 12 models.Choosethe one just right for your application. They are all lightweight, durable and feature easy-to-readLCDdisplays.And, all are designed and manufacturedwith Kocour’s total commitmentto quality. Basicmodels measurenon-magneticcoatingson steel, or on non-conductivecoatingson non-ferrous metals. Aqtbing from plating to paint, or anodizing, galvanizingand powder coatings.Enhancedmodels feature theseadditional capabilities: B Printer Capability/ RS232Interface n Multiple Calibration Memories and Batch statisticsB Instantaneously DisplaysFull MeasurementStatistics
4600 South S1. Louis Avenue, Chicago, Illinois 60632 U.S.A. Telephone: (773) 647-l 111 . . .I FAX: (773) 647-3399 nttp://ww.lcocoumet.com
Circle
036 on reader
information
card
An electrolytic zinc-nickel alloy plating solution, comprising zinc chloride, nickel chloride, and potassium chloride; polyethylene glycol having a molecular weight of 400-800 as a nonionic surfactant in an amount of 0.01-1.0 g/L; and at least one compound selected from the group consisting of nicotinic acid, urea, thiourea, nicotinamide, thioglycolic acid, and sodium thiosulfate as a compound having a lone pair of electrons in an amount of 0.001-l .O g/L.
plating of gold comprising a soluble alkali complex gold cyanide salt wherein the gold concentration is in the range of OS-l.0 pennyweights per gallon; a primary buffer salt in the pH range from one to seven having the molecular structure RCH,COOX, where R is either H, OH, OHCH,, or alpha hydroxy structure analogous to the latter, and where X is either H, Na, or K; and a secondary buffer of a phosphoric acid soluble salt.
Gold Plating Solutions
Metallizing Apertures
U.S. Patent 5,575,900. Nov.19,7996 M.S. Ante/man and t? W. Ante/man, assignors to Ante/man Technologies Ltd., Providence, R.1, and Tivian industries Ltd., East Providence, RI.
A plating bath electrolyte for the large scale mass production decorative electro-
High Aspect
Ratio
U.S. Patent 5,576,052. Nov. 19, 1996 J.K. Arledge et al., assignors to Motoro/a Inc., Schaumburg, 111.
A method of manufacturing a circuit carrying substrate, comprising providing a 83
Chemical Cleaning Components
of Metal
U.S.Patent 5'575,863.Nov.19, 1996 5. Sala and A. Gelpi, assignors Courbevoie, France
to Framatome,
A process for chemical cleaning of metal components having an iron oxide deposit upon a layer of compounds having a high silica content, comprising preparing an aqueous mixture including an agent for complexing Si(OH), and at least one compound for dissolving the layer of compounds having a high silica content selected from the group consisting of compounds for inserting OH or F ions selected from the group consisting of conjugated unsaturated systems and unsaturated N-oxide compounds, and OH-containing compounds selected from the group consisting of organic compounds having at least one alcohol function, aromatic amines, soluble salts of tertiary amines, and aromatic amines causing condensation of OH radicals onto silica.
Coated Abrasive
Article
U.S. Patent 5,575,873. Nov. 19, 1996 J.FI. Pieper et al., assignors to 3M Co., St. Pau/, Minn.
Method of preparing an endless coated abrasive article having a butt splice comprising providing a sheet bearing abrasive grains on one major surface thereof; cutting to a desired length in such a manner that the sheet has two ends; abutting the cut ends to form a joint; applying a layer of radiation-curable adhesive onto a portion of each of the cut ends on the major surface thereof not bearing abrasive grains; placing a splice medium over the joint so that the splice medium is in contact with the layers of radiation-curable adhesive; and curing by means of radiation energy.
Process Plating
for Through-Hole
U.S. Patent 5,575,898. Nov. 19, 1996 G-D. Wolf et al, assignors to Bayer AG, Leverkusen, Germany
A process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through holes and electrodepositing copper onto the walls of the through holes, comprising the use of a microemulsion of a monomeric thiophene to form the conductive polythiophene layer.
Zinc-Nickel
Alloy Plating
U.S. Patent 5,575,899. Nov. 79, 7996 M Nakakoji ef al., assignors to Kawasaki Corp., Hyogo, Japan
METAL
FINISHING
l
AUGUST
She/
1997
Reliability, knovation and basic American ingenuity have made Kocour l%ickness Testers tbe choice of progresske plate?s for over 50 years. So, doesn’t it make sense to rely on eitber a Model 6000 with micro-processor based chcuitry providing access to over 300 coating/ substrate applications or tbe compact Series 10 Handheld unit available In both bask and enhanced models. TheModel6000 features:H Versatility- measuresanythingfrom a #2 screwto the largest coil. n Multi-layer coatingsand alloy layers n Wire Capabilityn Digital calibration, 98% Accuracyn Easyto Read Direct Readout n STEPn Print
Kocour’sThicknessTesters
MEASURFA Series IO has 12 models.Choosethe one just right for your application. They are all lightweight, durable and feature easy-to-readLCDdisplays.And, all are designed and manufacturedwith Kocour’s total commitmentto quality. Basicmodels measurenon-magneticcoatingson steel, or on non-conductivecoatingson non-ferrous metals. Aqtbing from plating to paint, or anodizing, galvanizingand powder coatings.Enhancedmodels feature theseadditional capabilities: B Printer Capability/ RS232Interface n Multiple Calibration Memories and Batch statisticsB Instantaneously DisplaysFull MeasurementStatistics
4600 South S1. Louis Avenue, Chicago, Illinois 60632 U.S.A. Telephone: (773) 647-l 111 . . .I FAX: (773) 647-3399 nttp://ww.lcocoumet.com
Circle
036 on reader
information
card
An electrolytic zinc-nickel alloy plating solution, comprising zinc chloride, nickel chloride, and potassium chloride; polyethylene glycol having a molecular weight of 400-800 as a nonionic surfactant in an amount of 0.01-1.0 g/L; and at least one compound selected from the group consisting of nicotinic acid, urea, thiourea, nicotinamide, thioglycolic acid, and sodium thiosulfate as a compound having a lone pair of electrons in an amount of 0.001-l .O g/L.
plating of gold comprising a soluble alkali complex gold cyanide salt wherein the gold concentration is in the range of OS-l.0 pennyweights per gallon; a primary buffer salt in the pH range from one to seven having the molecular structure RCH,COOX, where R is either H, OH, OHCH,, or alpha hydroxy structure analogous to the latter, and where X is either H, Na, or K; and a secondary buffer of a phosphoric acid soluble salt.
Gold Plating Solutions
Metallizing Apertures
U.S. Patent 5,575,900. Nov.19,7996 M.S. Ante/man and t? W. Ante/man, assignors to Ante/man Technologies Ltd., Providence, R.1, and Tivian industries Ltd., East Providence, RI.
A plating bath electrolyte for the large scale mass production decorative electro-
High Aspect
Ratio
U.S. Patent 5,576,052. Nov. 19, 1996 J.K. Arledge et al., assignors to Motoro/a Inc., Schaumburg, 111.
A method of manufacturing a circuit carrying substrate, comprising providing a 83