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Shaping up particles
TOOLS & TECHNIQUES UPDATE
Cleaner sample holders A plasma cleaner suitable for removing contamination from transmission electron microscope (TEM) holders and samples has been launched by ISS Group Services. The system is based on a standard PP5 Barrel Plasma Asher from Gala Instruments and offers a cheaper alternative to dedicated ion cleaners. The instrument has been adapted to take a TEM sample holder, either through a frontloading door or at a rear side port, and rapidly cleans the holder and/or sample. The rear port provides a lower power clean for crystallographic analysis, where sample damage needs to be minimized. Contact: www.iss-group.co.uk
Shaping up particles Malvern Instruments has launched two automated imaging systems for determining particle shapes to link particle form to final product performance. Both systems use novel approaches to control particle orientation, allowing accurate and reliable measurements. The Sysmex FPIA-2100 analyzer for measurements on wet suspensions and emulsions is based on flow cytometry. Applications include ceramics, graphite abrasives, metal powders, and polymers. The instrument measures particles from 0.7-160 µm. It calculates diameter and circularity parameters for each particle and displays the results as a scattergram. The sheath flow mechanism aligns particles with their major axis in the direction of flow. This ensures that every particle is held in focus and oriented with its largest surface area facing the camera. The PharmaVision 830 system is based on automated microscopy and measures dry powders 0.7-2000 µm in size. Compressed air is used to disperse the material into a sealed chamber. Particles settle onto a glass plate with the largest surface area facing the camera. The tool calculates a series of morphological parameters and rapidly analyzes hundreds of thousands of particles for statistical significance. Contact: www.malvern.co.uk
removes some of the difficult and time-consuming steps in focused ion beam (FIB)-based preparation of samples in materials research and semiconductor manufacturing. The approach uses Ascend’s Extreme Access® nanomanipulator tool, which extracts relatively thick, site-specific sample ‘biopsies’. This biopsy can then be positioned for final FIB thinning or scanning transmission electron microscopy evaluations away from the bulk sample. Since final thinning occurs after lift-out, no cutting, redeposition of metal, or stage-drift problems are encountered.
Microscope offers high resolution JEOL has introduced a new LaB6 transmission electron microscope (TEM) for high-resolution imaging and analysis. The JEM-2100 offers a resolution of 0.19 nm at an acceleration voltage of 200 kV. High peak-to-background ratios can be obtained in energy dispersive X-ray spectroscopy (EDS) using an ultrahigh resolution pole piece and a large surface area detector. The TEM includes an advanced control system that can integrate any combination of scanning transmission electron microscopy, EDS, and electron energy loss spectroscopy capabilities. Three independent condenser lenses provide high probe currents at any given probe size. This enables the optimum illumination to be achieved for highresolution imaging. A new goniometer stage offers precise specimen movement. Samples can be positioned to within 0.05 nm and drift rates in hightilt tomographic applications are smaller than 0.5 nm/minute. JEOL has also launched a cross section polisher (CSP) for preparing large-area cross sections of specimens for the scanning electron microscope. The compact SM-09010 benchtop device uses an Ar ion beam to prepare soft or hard material samples up to 11 mm x 10 mm x 2 mm in size in a single step. The CSP is suitable for preparing multilayer structures, interfaces, composites of soft and hard materials, polymers, powder grains, and crystalline structures of metals and ceramics. Internal structures, voids between interfaces, adhesions between layers, and precipitates are preserved. Deformation of the polished surface is minimized, enabling clear observation of crystalline structures. Contact: www.jeol.com
Biopsies for sample preparation A new process developed by Ascend Instruments reduces the time, cost, and difficulty of preparing site-specific, ultrathin samples for transmission electron microscopy. The Extreme Magic technique
Contact: www.ascendinstruments.com
Imaging samples under pressure The S-3400N variable pressure scanning electron microscope from Hitachi High-Technologies has new electron optics, detector, pumping system, and improved sample handling and analysis capabilities. With a variable pressure range of 6-270 Pa, oily, wet, or insulating samples can be imaged without preparation. The electron optics use a quadrant bias system to give greater beam current and achieve a resolution of 10 nm at a low accelerating voltage of 3 kV. An automatic beam alignment feature ensures that sharp images are obtained. A new semiconductor backscattered electron detector has high sensitivity and fast response rates. The detector can be switched to give atomic number contrast, topographic, or three-dimensional images. A turbomolecular pumping system, which does not require cooling water, produces a cleaner vacuum and has a fast pumpdown time. The chamber design allows mounting of both energyand wavelength-dispersive X-ray spectroscopy detectors. Enhanced scanning facilities increase the field of view at the lowest magnification so that it is easier to locate features of interest. Contact: www.hitachi-hitec-uk.com
December 2004
69
Cleaner sample holders A plasma cleaner suitable for removing contamination from transmission electron microscope (TEM) holders and samples has been launched by ISS Group Services. The system is based on a standard PP5 Barrel Plasma Asher from Gala Instruments and offers a cheaper alternative to dedicated ion cleaners. The instrument has been adapted to take a TEM sample holder, either through a frontloading door or at a rear side port, and rapidly cleans the holder and/or sample. The rear port provides a lower power clean for crystallographic analysis, where sample damage needs to be minimized. Contact: www.iss-group.co.uk
Shaping up particles Malvern Instruments has launched two automated imaging systems for determining particle shapes to link particle form to final product performance. Both systems use novel approaches to control particle orientation, allowing accurate and reliable measurements. The Sysmex FPIA-2100 analyzer for measurements on wet suspensions and emulsions is based on flow cytometry. Applications include ceramics, graphite abrasives, metal powders, and polymers. The instrument measures particles from 0.7-160 µm. It calculates diameter and circularity parameters for each particle and displays the results as a scattergram. The sheath flow mechanism aligns particles with their major axis in the direction of flow. This ensures that every particle is held in focus and oriented with its largest surface area facing the camera. The PharmaVision 830 system is based on automated microscopy and measures dry powders 0.7-2000 µm in size. Compressed air is used to disperse the material into a sealed chamber. Particles settle onto a glass plate with the largest surface area facing the camera. The tool calculates a series of morphological parameters and rapidly analyzes hundreds of thousands of particles for statistical significance. Contact: www.malvern.co.uk
removes some of the difficult and time-consuming steps in focused ion beam (FIB)-based preparation of samples in materials research and semiconductor manufacturing. The approach uses Ascend’s Extreme Access® nanomanipulator tool, which extracts relatively thick, site-specific sample ‘biopsies’. This biopsy can then be positioned for final FIB thinning or scanning transmission electron microscopy evaluations away from the bulk sample. Since final thinning occurs after lift-out, no cutting, redeposition of metal, or stage-drift problems are encountered.
Microscope offers high resolution JEOL has introduced a new LaB6 transmission electron microscope (TEM) for high-resolution imaging and analysis. The JEM-2100 offers a resolution of 0.19 nm at an acceleration voltage of 200 kV. High peak-to-background ratios can be obtained in energy dispersive X-ray spectroscopy (EDS) using an ultrahigh resolution pole piece and a large surface area detector. The TEM includes an advanced control system that can integrate any combination of scanning transmission electron microscopy, EDS, and electron energy loss spectroscopy capabilities. Three independent condenser lenses provide high probe currents at any given probe size. This enables the optimum illumination to be achieved for highresolution imaging. A new goniometer stage offers precise specimen movement. Samples can be positioned to within 0.05 nm and drift rates in hightilt tomographic applications are smaller than 0.5 nm/minute. JEOL has also launched a cross section polisher (CSP) for preparing large-area cross sections of specimens for the scanning electron microscope. The compact SM-09010 benchtop device uses an Ar ion beam to prepare soft or hard material samples up to 11 mm x 10 mm x 2 mm in size in a single step. The CSP is suitable for preparing multilayer structures, interfaces, composites of soft and hard materials, polymers, powder grains, and crystalline structures of metals and ceramics. Internal structures, voids between interfaces, adhesions between layers, and precipitates are preserved. Deformation of the polished surface is minimized, enabling clear observation of crystalline structures. Contact: www.jeol.com
Biopsies for sample preparation A new process developed by Ascend Instruments reduces the time, cost, and difficulty of preparing site-specific, ultrathin samples for transmission electron microscopy. The Extreme Magic technique
Contact: www.ascendinstruments.com
Imaging samples under pressure The S-3400N variable pressure scanning electron microscope from Hitachi High-Technologies has new electron optics, detector, pumping system, and improved sample handling and analysis capabilities. With a variable pressure range of 6-270 Pa, oily, wet, or insulating samples can be imaged without preparation. The electron optics use a quadrant bias system to give greater beam current and achieve a resolution of 10 nm at a low accelerating voltage of 3 kV. An automatic beam alignment feature ensures that sharp images are obtained. A new semiconductor backscattered electron detector has high sensitivity and fast response rates. The detector can be switched to give atomic number contrast, topographic, or three-dimensional images. A turbomolecular pumping system, which does not require cooling water, produces a cleaner vacuum and has a fast pumpdown time. The chamber design allows mounting of both energyand wavelength-dispersive X-ray spectroscopy detectors. Enhanced scanning facilities increase the field of view at the lowest magnification so that it is easier to locate features of interest. Contact: www.hitachi-hitec-uk.com
December 2004
69