The Surface Composition of Nickel-Zirconium Intermetallic Compound Catalysts

The Surface Composition of Nickel-Zirconium Intermetallic Compound Catalysts

811 .J.W. Ward (Editor), Catalysis 1987 © 1988 Elsevier Science Publishers B.Y., Amsterdam - Printed in The Netherlands THE SURFACE COMPOSITION OF N...

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811

.J.W. Ward (Editor), Catalysis 1987 © 1988 Elsevier Science Publishers B.Y., Amsterdam - Printed in The Netherlands

THE SURFACE COMPOSITION OF NICKEL-ZIRCONIUM INTERMETALLIC COMPOUND CATALYSTS M. C. Deibert l and R. B. Wright 2 IDepartment of Chemical Bozeman, Montana 59717

Engineering,

Montana

State

University,

2Idaho National Engineering Laboratory/EG&G Idaho, Inc., P.O. Box 1625, Idaho Falls, Idaho 83415

ABSTRACT The compositions of the surface and subsurface strata of uniquely active zirconium-nickel alloy hydrogenation catalysts have been investigated by high resolution Auger spectroscopy and Ar ion sputter ing. Sequential 400 0C pretreatments of the intermetallic compounds ZrNi3 and Zr2Ni7 with H2, 02 and finally H2 are shown to produce an essentially pure reduced Ni surface supported on a sublayer of oxidized zirconium, which in turn is supported on the unaltered alloy. This reduced nickel constitutes the highly active catalyst surface. Evidence is developed related to the thickness of the reduced nickel surface layer and its morphology. INTRODUCTION Recent

studies

structure of (ref.

2)

actinide

(ref.

1)

of

the

surface

composition

and

intermetallic alloys have been prompted by earlier

findings

that certain alloys consisting of

and

earth

rare

metals

are

good

catalysts

transition, for

various

reactions of possible industrial relevance. These surface analysis studies observed structure

have

established

catalytic of

the

a

activity alloy.

definite and

the

Generally,

correlation surface the

between

the

composition

and

catalytically

active

surface is the result of a chemically induced decomposition of the alloy into a reduced metal surface phase consisting of one of the alloy components that in turn is dispersed on a second subsurface phase composed of an oxide of the second alloy component. Thus, in a general sense,

the active catalyst consists of a reduced metal

dispersed on a metal oxide, which acts as a support, both of which in turn reside on the underlying bulk intermetallic alloy. Previous catalytic activity studies (ref. 2)

have demonstrated

that the Zr/Ni alloy system exhibits high hydrogenation activity

812

if the alloy is treated in oxygen gas to temperatures up to 550 0C prior

to

a

reducing

treatment

in

hydrogen

of

earlier

at

temperatures

exceeding 200 oC, both of which precede the catalytic testing. The

present

study

is

a

continuation

(ref.

1)

surface

characterization work which used x-ray photoelectron spectroscopy (XPS) to investigate the influence of various elevated temperature oxygen and

hydrogen

treatments on

the surface composition of

a

number of Zr/Ni alloys. The earlier XPS studies showed that even in their as-prepared state, the surface of the alloys are depleted in nickel and consist mainly of Zr02' Upon exposure to oxygen at temperatures exceeding 200 oC, the surface becomes enriched in nickel, as NiO, which upon reduction in hydrogen produces a nickel rich surface, as Ni,

that is supported on a thin layer of Zr02'

The Auger studies presented in the current paper were conducted to elucidate

in

a

more

quantitative

manner

the

compositional

stratification that occurs in this alloy system as a result of the oxidation/reduction pretreatments. EXPERIMENTAL PROCEDURE The Zr-Ni alloys used in this study were prepared by the direct arc melting of the appropriate stoichiometric amounts of pure Ni (99.9%)

and

Zr

(99.9%)

powders.

The

arc melted

specimens

were

sliced and polished using 0.05 micron alumina abrasive to obtain the

final

surface

purity Ni ZrNi3,

and Zr

ZrNi,

reagent

and

finish. foils,

The

samples analyzed

included

as well as polished samples of

Zr2Ni.

All

samples

were

grade acetone and methanol prior

to

solvent

99.99% zr2Ni7,

cleaned

insertion

into

in the

analysis system. The analyzer was a PHI 595 scanning Auger microprobe with Ar+ sputter profiling capability. The 200 nA, 3.0 keV primary electron

beam was rastered over a 0.02xO.02 mm 2 area. This area was central to a 1. 8x1. 8 mm 2 area impacted by a rastered 1. 0 keV Ar+ beam during ion milling. The Ar+ beam current was approximately 0.6 uA or about 18.5 uA/cm 2 over the area of the rastered beam. The E*N(E)

vs.

E data collected during the AES scans were stored on

magnetic disks for software

was

later display, manipulation and analysis.

utilized

to

process

the

E*N(E)

vs.

E

data

PHI as

required. After

characterization

of

the

Auger

spectra

of

a

sputter

cleaned area on each sample in the untreated condition, the sample was withdrawn

to the preparation chamber of

the PHI

595

system

813

which was then backfilled to atmospheric pressure with ultra-high purity H2' The temperature of the sample was then raised to 400 0C for

30

minutes.

A slow purge of

H2 was maintained

through

the

preparation chamber during the high temperature treatment. After cooling,

the

procedure

repeated

using

spectra

were

gas.

Auger

preparation

chamber

was

ultra-high measured

re-evacuated

purity 02

on

the

as

sample

the in

and

the

treatment

the

treated

condition and then after each of a sequence of surface sputters with 1 keV Ar+ to develop a high temporal resolution depth profile of the sample. After

the

first

sputter

depth

profile

was

completed

on

the

sample treated in H2 and then 02, the sample was withdrawn to the preparation chamber and treated for 30 minutes with H2' A second high

resolution

sputter

depth

profile

was

then

conducted

on

a

previously unsputtered portion of the sample surface. EXPERIMENTAL RESULTS Examples this

of

study

the

are

principal AES spectra which are

presented

in

Figures

1

for

the

utilized

energy

in

region

between 80 and 180 eV within which many principal Zr Auger peaks occur and in Figure 2 for the energy regions between 45 and 75 eV and between 816 and 856 eV within which two major Ni Auger peaks occur.

Spectrum

(a)

in Figure 1 is

for

sputter

cleaned pure Zr

foil and exhibits peaks near 91 eV, 116 eV, 124 eV, 146 eV and 173 eV.

After

is oxidized by exposure to 1000 L (lL=l Langmuir=exposure of 10- 6 torr of gas for 1 sec) of 02 at 20 oC, spectrum

the

(b)

Zr

foil

is observed.

The 146 eV peak

is diminished by the

surface oxidation of the Zr and is partially replaced by a new peak at 140 eV. The peak at 173 eV is strongly diminished. These changes provide convenient indications of the oxidation state of Zr

from its Auger spectra. Spectrum (c)

in Figure 2 was measured

on

a

a

sputter

cleaned

ZrNi3

surface

on

sample

which

had

not

received high temperature H2 or 02 treatments. The Auger peaks are essentially the same as spectrum (a)

except for the introduction

of a weak Ni peak near 101 eV. The intensity of the Zr peaks are diminished due to the dilution effect of the Ni. Spectrum (d)

in

Figure 1 was measured on the same ZrNi3 surface after exposure to 1000 L of 02 at 2l oC. Essentially the same influences of the surface oxidation of evident.

The Ni

several

of

the

Zr

peak at Zr

that were observed 101 eV is

peaks

are

in spectrum

(b)

are

substantially eliminated and

stronger

due

to

the

selective

814

segregation of

the

Zr

to

the surface to form Zr02 by

the

room

temperature surface oxidation process.

-

>-

-...

'iii c::

Z'

'Cii

Q)

t::

...

c::

Q)

5... Q)

Cl :::l

,

''' \

,...

/ ' Zr + \... 'b)

« W 1 \\ ..",J

Z «

l'--

W

II

1000 L 02 /

f, __


W

\

LLJ

d) ZrNi3

1000 L

\.

' ..... ....

--

\b) Ni

+--

\ 1000 L 02

\

c) Sputter cleaned

+.

ZrNi3

02\.,

+ 1000 L02

. ,./

120

80

\.

.\

oO

c) Sputter cleaned '-"" ZrNi3 ( , _ . J d ) ZrNi3

r-'

,

"-'\

Z-

,r'

1\."

A

Q)

C'l ::l

\ ......... /

/\.--/.'\

................. ,

140

180

Electron Energy (eV)

Electron Energy (eV)

Figure 1 80 to 180 eV region of E*N(E) Auger spectrum for a) sputter cleaned Zr; b) Zr after 1000 L 02 exposure; c) sputter cleaned ZrNi3; and d) ZrNi3 after 1000 L 02 exposure. Figure 2 45 to 75 eV and 816 to 860 eV regions of E*N(E) Auger spectrum for a) sputter cleaned Ni; b) Ni after 1000 L 02 exposure; c) sputter cleaned ZrNi3; and d) ZrNi3 after 1000 L 02 exposure. Spectrum (a)

in Figure 2 was measured on a sputter cleaned Ni

foil surface and spectrum (b) is this same surface after a 1000 L exposure at 2l oC. The peak at 841 eV is not significantly

02

changed by the surface oxidation process, but the energy level of the low energy Ni peak is shifted from about 57 eV to about 55 eV. This shift of the low energy Ni Auger peak provides an indication of the oxidation state of Ni. Spectra (e) and (d) in Figure 2 were measured on a

sputer

cleaned and an oxidized surface of

ZrNi3,

respectively, The same influences of surface oxidation observed on the pure Ni

foil are evident

in the Auger

spectra of Ni

on the

surface of the alloy, The

measured

AES

Zr,

Ni,

oxygen

and

carbon

spectra

were

quantified by measuring the integrated counts under the E*N(E) vs,

815

E

spectral

curves

procedure.

The

between a

using

program

straight

spectral curve.

the

PHI

provides

software the

designed

area

for

(integrated

this

counts)

line connecting selected end points and

the

These peak area intensities are measures of the

surface abundance of the respective elements. The intensity of the combined Zr 146 eV and 140 eV peaks (when the latter is present) was utilized for

the Zr surface concentration measurements.

integration utilized

end points at

the minimum of

the

This

spectral

curves between 129 and 133 on one end and 150 to 153 on the other. The authors have previously established that this measure of zr Auger

intensity varies proportionately with the area

(intensity)

under the 90 eV peak and that under the combined 116 eV and 124 eV peaks for pure Zr (ref. 3). The combined 146-140 eV peak intensity is utilize6 in this work since it is not interfered with by the 101 eV Ni Auger peak. The Ni peak intensity was measured for the 841 eV transition by integrating from the minimum of the spectra near 850 eV to the point of intersection of a horizontal (constant count rate) line from that minimum on the low energy side of the peak. the

The oxygen Auger spectra

between

intensities

(not

between

eV and

243

intensities were measured by integrating 500

eV

reported 278

and

here)

eV.

515 were

eV,

while

measured

The major

oxygen

the

by

and

carbon

integration carbon

Auger

transitions occur within these energy windows. The spectral alloys

are

intensities of

normalized

by

zr and Ni

dividing

reported here

each

by

the

intensities

therefore

are

a

measure

the

corresponding

intensity measured on pure, sputter cleaned Zr and Ni reported

for

of

foils.

the

The

surface

abundance of Zr or Ni

relative to that determined on the surface

of

The

the

pure

metals.

oxygen

spectral

intensities

measured

between 500 and 515 eV are normalized by division by a consistent factor profile

which

brings

plots.

There

them is

to no

a

reasonable

specific

scale

on

the

depth

surface concentration

with

which these normalized oxygen intensities can be referenced. The depth profile treatment at

400 0C

results obtained on ZrNi3 after

sequential

with H2 and then 02 are presented in Figure 3a.

The near surface regionis shown to be essentially pure oxidized Ni. After somewhat more than 10 minutes of sputtering (log of the sputter maximum

time slightly above 1.0) simultaneously

with

a

the Ni minimum

concentration reaches a in

the

surface

oxygen

concentration. The Ni is in the reduced state after the maximum is passed.

The

concentration

of

reduced

Ni

then

decreases

as

the

816

>-+Ul

c

Q)

-+-

c

L

Q)

m

:J


Q)

N

0

E I.a

z

1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 START

0-0

Sputter cleaned values

lJ-D 0-0

-1.0

0.0

1.0

log 1O(Sputter time, min)

Zr(reduced); e- - e Zr(oxidized); A-A

0-0

Oxygen

2.0

Ni

Zr

3.0

Ni(reduced); . - - . Ni(oxidized)

Figure 3a. Sputter depth profiles of Zr, Ni, and oxygen for ZrNi3 after two 400 0C treatments; H2 for 30 minutes and then 02 for 30 minutes. Auger intensities of Ni and Zr for sputter cleaned, unreacted ZrNi3 are shown on the right.

>-+Ul

c

Q)

-+-

c

L Q)

m :J

-c -0

Q)

N

0

E

L

a

z

1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 START

Sputter cleaned values 0-0

0-0

-1.0

0.0

1.0

2.0

Ni Zr

3.0

log 1O(Sputter time, min) 0-0

Zr(reduced); e- - e Zr(oxidized);

0-0

Ni(reduced);

A-A

Oxygen

Figure 3b. Sputter depth profiles of Zr, Ni, and oxygen for ZrNi3; sample from Figure 3a after an additional 400 0C treatment with H2 for 30 minutes. Auger intensities of Ni and Zr for sputter cleaned, unreacted ZrNi3 are shown on the right.

817

concentration

of

oxidized

Zr

and

of

oxygen

increases.

Finally

there is a transition to near the bulk concentrations of Ni and Zr in

the

unoxidized

ZrNi3'

with

the

concentration

of

reduced

Ni

increasing and the oxygen concentration falling within a matrix of reduced Zr. The spectral intensities of Ni and Zr as measured on the surface of pure sputter cleaned ZrNi3 are shown on the right of Figures 3a and 3b. The depth profile results determined on a different section of the

surface of

with

H2

are

the

ZrNi3 after a

presented

in

Figure

essentially pure reduced Ni slightly

more

concentration

than of

10

subsequent 3b.

The

surface

400 0C

region

is

(normalized intensity near 1.0) After minutes

reduced

treatment at

Ni

of

sputtering

decreases

as

the

the

surface

concentration

of

oxygen and oxidized Zr increase. The depth profiles of zr2Ni7 after 400 0C treatments with H2 and then 02' Figure

Figure

4b,

observed

for

time were treated

4a,

zrNi3'

a

subsequent

essentially

Again,

treatment

equivalent

approximately

10

wi th

results

minutes

as

of

H2'

those

sputter

required to penetrate both the oxidized Ni on the 02

sample and

treated sample. point

and after

demonstrate

of

the

nearly pure

The concentrations of Ni

penetration

approximate

reduced Ni

that of a

of

the

and

oxidized

sputter cleaned,

on the Zr

at

final

H2

the deepest

sample,

Figure

untreated Zr2Ni7

4a,

sample.

The increasing surface concentration of reduced Ni observed in the initial portion of the profile,

Figure 4b, most probably results

from

to

a

surface

simultaneous carbon

decrease,

concentration.

near

The

zero,

surface

of

the

becomes

observed partially

carbonated either during the reduction process or while evacuating the preparation chamber and transferring the sample into the main analysis chamber. The depth profile of the ZrNi sample after treatment at 400 0C in H2 and oxygen was

then 02

is presented in Figure

incorporated

into

this

sample

5.

Significantly more

than was

observed

for

ZrNi3 or Zr2Ni7' The concentration of oxidized Zr near the surface was also not reduced to near zero, as had been noted for ZrNi3 and zr2Ni7'

This

is

certainly

the

result

of

the

higher

Zr

concentration in the bulk alloy which forms Zr02 upon oxidation. Correspondingly, the concentration of oxidized Ni near the surface and of reduced Ni further within the sample did not reach the high levels sample

noted

on

received

the its

alloys final

which

are

treatment

richer with

in H2

Ni. at

When 400 0C

this it

818

>-

;!::

1.1 1.0

Sputter cleaned values

0.9 0.8

Ul

c

....c Ql

0.7

LQl

0.6 0.5

OJ :::J

4:

0-0 0--0

0.4 0.3 0.2 0.1

"U

Ql

N

o

E Lo

Z

Ni Zr

0.0

START 0-0

-1.0

0.0 1.0 2.0 log 1O(Sputter time, min)

3.0

Zr(reduced); .- - . Zr(oxidized); 0 - 0 Ni(reduced); .- - . Ni(oxidized) .. - .. Oxygen

Figure 4a. Sputter depth profiles of Zr, Ni, and oxygen for zr2Ni7 after two 400 0C treatments: H2 for 30 minutes and then 02 for 30 minutes. Auger intensities of Ni and Zr for sputter cleaned, unreacted Zr2Ni7 are shown on the right.

....>Ul

c:

....c: Ql

LQl

OJ :::J

4:

"U

Ql

N

o

E

L-

°

Z

1.1 1.0

0.9 0.8

Sputter cleaned values

0.7

0.6 0.5

0--0 0--0

0.4 0.3 0.2 0.1

Ni Zr

0.0

START 0-0

-1.0

0.0

1.0

1091 O(Sputter time, min)

Zr(reduced); .- - . Zr(oxidized);

0-0

2.0

Ni(reduced); .. -

3.0 .. Oxygen

Figure 4b. Sputter depth profiles of Zr, Ni, and oxygen for Zr2Ni7: sample from Figure 4a after an additional 4000C treatment with H2 for 30 minutes. Auger intensities of Ni and Zr for sputter cleaned, unreacted Zr2Ni7 are shown on the right.

819

disintegrated

into

a

fine

powder

which

could

not

be

further

analyzed by the methods utilized in this study. The Zr2Ni sample

1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0

>-

+-

1Il

c

Q)

+-

c

LQ)

OJ :J

<{

l:J Q)

N

0

E

L

a

z

ZrNi

0-0

-1.0

START 0-0

Sputter cleaned values

3.0

0.0 1.0 2.0 log 1O(Sputter time, min)

Zr(reduced); e- - e Zr(oxidized); ~-~

0-0

Oxygen

Ni

Ni(reduced); . - - . Ni(oxidized)

Figure 5. Sputter depth profiles of Zr, Ni, and oxygen for ZrNi after two 400 0C treatments; H2 for 30 minutes and then 02 for 30 minutes. Auger intensities of Ni and Zr for sputter cleaned, unreacted ZrNi are shown on the right. disintegrated during its initial treatment at 400 0C in H2. Both of the

Zr

rich

alloys,

ZrNi

and

Zr2Ni,

apparently

react

with

or

absorb the treatment gases with sufficient intensity to break down their structures,

presumably due to the formation of a

hydride phase upon hydrogen treatment. Pebler et al.

zirconium

(ref. 4) have

noted that zr2Ni disproportionates into ZrNiH3 and ZrH2 when it is treated with hydrogen. DISCUSSION Prior XPS studies by Wright et al. initial H2 treatment of these Zr/Ni

(ref. 1) have shown that the intermetallic alloys results

in a thin layer of oxidized Zr supported on a base of the reduced alloy. The oxygen required to form this thin oxidized Zr layer may have been present either as a trace impurity in the H2 treatment gas

either

as

Zr02 or as interstitially dissolved oxygen in the bulk alloy.

or

initially

It

is known that, can

dissolve

in

the bulk of

the

untreated alloy,

under certain high temperature conditions, bulk Zr up

to

28

atomic pe r ce n t

oxygen

as

an

interstitial

820 solute in its hcp lattice (ref. 5). The untreated Zr/Ni alloys may also, therefore, have absorbed some oxygen in the process of their being prepared. The surface of ZrNi3 and Zr2Ni7 following treatment with H2 and then 02 at 400 0C are essentially Zr-free oxidized Ni. There is a region rich in oxidized Zr

below the oxidized Ni

followed

by a

transition to concentrations of reduced Ni and Zr characteristic of the untreated sputter cleaned alloys. Note: During the sputter cleaning step the alloy surface should be enriched in zirconium due

to

the

preferential

sputtering

of

nickel.

After

the

final

surface reduction with H2, the catalyst surface is observed to be essentially pure reduced Ni supported on an underlayer of oxidized Zr

which

is

in

turn

supported

on

the

unaltered

intermetallic

alloy. The sequence of

reductions and oxidations,

simultaneous

interpenetrations

results

uniquely active Ni

in a

pretreatment process

and

together with the

migrations

of

catalyst surface

initially involves

components,

(ref.

2).

The

the

formation of a thin layer of oxidized Zr during the first H2 treatment at 400 oC. Ni

segregates to the surface and is oxidized during the subsequent 02 treatment at 400 oC. At the same time a sublayer of oxidized Zr is formed as some of the Zr near the surface of the alloy is oxidized and

is

joined

following in

H2

at

by

the

oxidized

Zr

which

was

on

the

surface

the first H2 pretreatment step. The final pretreatment 400 0C

reduces

the

surface

Ni.

Zr02

is

sufficiently

thermodynamically stable to not be reduced under these conditions. Scanning electron microscope studies reveal that the sequence of pretreatments produces a

"sponge like" surface morphology on the

alloys with surface features on the order of several microns in size. The information developed in this study provides a preliminary basis

to

estimate

an

upper

bound

to

the

thickness

of

surface layer on the pretreated surface. Tapping et a I ,

the

Ni

(ref.

6)

have calibrated the sputtering rates of eight metal oxides using 4 keV Ar ions. These rates, expressed in nm'min- l/ua'cm- 2, ranged in magnitude

from

0.101

for

Cr203

to

0.195

for

Ta205

(Zr02

was

0.120). The sputtering rate utilizing 1 keV Ar ions in this study can

be expected

to be

lower

than

for

4 keV Ar

assumed that the sputtering rate of oxidized Ni

it

is

in this work

ions.

If

is

somewhat less than the range of values reported by Tapping et al. for metal oxides, the 18.5 ua/cm 2 Ar ion current density utilized

821

during sputtering will have removed less than 2 to 4 nm/min of the surface oxide. The thickness of oxidized Ni removed during the initial' 10 min. of sputtering, Figures 3a and 4a, is therefore less than 20 to 40 nm. If no additional Ni migration occurs during the

final

pretreatment

step,

the

difference

in

atomic

concentration of nickel in NiO and bulk Ni will decrease the thickness of the final reduced Ni surface layer to about half of that

of

the

oxidized

Ni

layer

from

which

it

was

formed.

A

reasonable upper bound on the thickness of the reduced Ni layer is therefore

10

to

20

nm,

This

study

provides

no

basis

for

the

estimation a lower bound on this thickness. ACKNOWLWDGMENTS We are grateful to the staff members of CRISS (supported by the NSF, Grant No. DMR-83-09460) for their excellent technical support. Portions of this work were supported by NSF(EPSCoR) Grant No. ISP-8011449, with matching funds from the State of Montana, and by the Interior Department's Bureau of Mines under contract No.

J0134035

through Department of Energy Contract No.

DE-AC07-

76ID01570.

REFERENCES 1 2 3 4 5 6

R. B. Wright, M. R. Hankins, M. S. Owens and D. L. Cocke, J. Vac. Sci. Technol., To be published August, 1987, and references therein. R. B. Wright, J. G. Jolley, M. S. Owens and D. L. Cocke, J~ Vac. Sci. Technol., To be published August, 1987, and references therein. Deibert, M. C., and Wright, R. B., App1. Surface Sci. ,To be published. A. Pebler and E. A. Gulbransen, Electrochem. Tech., 4 (1966) 211. E. Gebhardt, H. D. Seghezzi and W. J. Durrscchnabel, Nuc. MatI. 4 (1961) 241. R. L. Tapping, R. D. Davidson and T. E. Jackman, Surf. Interface Anal. 7 (1985) 105.