diamine including a mixture of paraphenylenediamine and metaphenylenediamine in a ratio of metaphenylenediamine to paraphenylenediamine of 90: 10 to 1523.5; and, coating the article with the solution.
Two-Coat
comlayer and a com-
Finish Method to Eliminate a Solder Mask
U.S. Went 5,716,678. Feb. i0, 1998 U. R&krath et al., assignors to BASF Lacke Farben, AG, Muenster-H&up, Germany
A process for the production of a two-coat finish on a substrate surface comprising applying a pigmented basecoat to the substrate surface; drying the basecoat film; applying to the basecoat film a nonaqueous, transparent topcoat comprising a hydroxyl group-containing polyacrylate resin and a crosslinking agent, and baking and curing the basecoat and the topcoat together.
Multilayer
prised of bright nickel; a third layer prised of palladium alloy; a fourth comprised of zirconium or titanium; fifth layer comprised of a zirconium pound or a titanium compound.
Coated Article
U,S. Patent 5,716,721.Feb. 10, 1998 S.R. Moysan,111and R. W Sugg, assignors to Baldwin Hardwere Corp., Reading, Pa. An article comprising a metallic substrate having on at least a portion of its surface a first layer comprised of semibright nickel; a second layer com-
the Use of
U.S. Patent 5,716,760. Feb. II?, 1998 E Juskey et al., assignors to Motorola Inc., Schaumburg, 111. A method for plating a substrate to eliminate the need for a solder mask during subsequent component solder attachment processes comprising coating with a polymer catalyst; coating with a first plating mask photopolymer; photo-optically imaging a circuit pattern; developing the thus exposed first plating mask photopolymer thereby forming windows; at least partially filling the windows with copper; covering the copper with nickel, said nickel oxidizing rapidly when exposed to air. thereby rendering the exposed surface unsolderable; removing the first plating mask photopolymer without removing the copper or nickel or said polymer catalyst; coating the
polymer catalyst and nickel with a second plating mask photopolymer; photo-optically imaging an inteconnect pattern; developing the thus exposed second plating mask photopolymer; plating over the interconnect pattern with gold; removing the second plating mask photopolymer without removing the copper, nickel, or gold, wherein the nickel selectively prevents adhesion of solder applied to the substrate to provide electrical interconnection between the circuit pattern and an external component.
Recovery of Secondary from Paint Sludges
Polyols
U.S. Patent 5,776,9%X Feb. 70, 1998
B-U. Kefiemannand M. h4elchione, assignors to Mercedes-Benz AG, Stuttgart, Germany A method for recovering secondary polyols from paint sludge coagulate formed from paint overspray collected during spray painting to which a coagulant has been added and which has been dewatered, said method comprising heating the paint coagulate to a temperature above IOO”C, and glycolytically splitting organic components of the paint coagulate into polyols,
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