132
Nov, Patents
4568961 VARIABLE G E O M E T R Y AUTOMATED UNIVERSAL ARRAY Richard Noto assigned to RCA Corporation A universal array' of the type designed for automatic computer aided design of its customizing conductive layer is easily scaled to change the number of devices in the array. The array con> prises an inner region having first direction extending rows of originally' uncommitted device cells. Each row of cells is powered from first direction extending row power buses. These rows of cells are spaced apart in a second, perpendicular, direction by interleaved first type wiring corridors. The inner region is surrounded by an outer region including second type wiring corridors and peripheral cells. The second type wiring corridors space at least some peripheral cells from the inner region. The second type corridors include second-direction-extending innerregion-supplying power buses which connect to cell row power buses and wiring roadways spaced from the inner region by the inner buses. The wiring roadways are free of row power buses. The second type corridors are populated with tunnels which extend in the first direction only and underlie the roadways.
step. Accordingly, if the estimate of the inspection apparatus is within the specification value, but out of adjustment with respect to the central value. ,An instruction signal can be automatically sent to either the second or the third manufacturing apparatus, to compensate in the direction of the central value.
4572564 A D A P T I V E G R I P P I N G DEVICE Thomas M Cipolla assigned to General Electric Company A versatile robotic gripper is easily and quickly adjusted to grip objects of different geometrical shapes without changing parts and under complete machine control. Opposing jaws have a matrix of axially movable pins each of which is mechanically locked in any axial position. Actuation of an operating mechanism to move the jaws together to grasp an object depresses the pins and they collectively conform to the shape of the object; the jaws retain this shape upon release of the object. A plate is raised to unlock the pins which are returned by springs to a fixed coplanar position.
4571685
8503664
P R O D U C T I O N S Y S T E M FOR MANUFACTURING S E M I C O N D U C T O R DEVICES
S Y S T E M FOR C O U P L I N G A VISUAL S E N S O R P R O C E S S O R AND A R O B O T C O N T R O L L E R
Mototaka Kamoshida, Tokyo, Japan assigned to NEC Corporation
Mitsuo K U R A K A K E , Hideo M I Y A S H I T A , Shoichi O T S U K A , 103, Izumi-heights, 3-3-I0, Tamadaira, Hino-shi, Tokyo 191, Japan assigned to F A N U C L T D
A production system for manufacturing semiconductor devices comprises apparatus for making a semiconductor wafer during a first process step. A plurality of semiconductor devices, or semiconductor chips are arranged and incorporated in the wafer. A second apparatus processes the semiconductor material in a second process step during production. An inspection apparatus provides an automatic inspection function between the first and the second process steps. The inspection result is automatically estimated by the inspection apparatus, with respect to a specification value and a central value within the specification value. The inspection apparatus is connected to a third apparatus for carrying out at least one further manufacturing step after the second process
A system for coupling a visual sensor processor B and a robot controller A, in order to inexpensively constitute the whole system while maintaining increased processing speed. For this purpose, the visual sensor processor B and the robot controller A are couplped together through bidirectional high-speed data transfer channels (10, 28, (1,3))1(, (1,3))2(), so that the data required for the two apparatuses can be exchanged through these channels. Utilizing these channels, furthermore, a non-volatile memory (6) and serial interface (12) for connection to an external input/output device, installed in the robot controller A, are commonly used for these two apparatuses.