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A new technique for testing TAB bonded LSIs in the Gigahertz frequency range
1048
World Abstracts on Microelectronics and Reliability
important, for instance, in the packaging of large integrated circuits or of multichip modules. In order to assess the pertbrmance of such a material it is necessary to construct prototype packages; however, extensive investigation into material behavior and compatibility is often necessary before the material can be incorporated into standard processing routes. This paper illustrates the way in which many standard processing techniques such as laser cutting, thick and thin film deposition, glassing and soldering can be used with aluminum nitride, and also highlights some of the ways in which material and process compatibilities can be achieved. The viability of such techniques is demonstrated by the production of aluminum nitride prototype packages and substrates using thick and thin film technologies. Loop wiring cuts costs, enhances reliability. TSUTOMU SAKURAI and YOSHIFUMI HARI. JEE (Japan) 99 (August 1990). In recent years, the amount of wiring at production facilities has increased with the growing sophistication of machinery control equipment. As a result, in-plant wiring costs have been increasing and in turn, reliability has been going downhill. To solve these problems, a loop wiring method employing optical fibers has been developed.
New polymeric muitilayer substrates and packaging. H. OHDAIRA,K. YOSHIDAand K. SASAOKA.Circuit WId 17(2), 2 (1991). This paper reports on the development of a simple manufacturing process for polymeric multilayer substrates utilizing the thermoplasticity of thermoplastic resin. Features and defects noted in manufacturing trials of the substrates are also reported. The process involves a polymer-based thick film conductive paste screen printed on a hole-punched thermoplastic resin film and dried. The films are stacked to form multiple layers and arc then compressed into one unit. As the extremely thin thermoplastic resin layers are equivalent to a single layer, a feature of this substrate is its exceptional thinness. As thermoplastic resin is used as a base material, the soldering process and other connecting technologies which may be used in place of solder connection are also examined. Applications of magnetic levitation based micro-automation in semiconductor manufacturing. ILENE J. BUSCH-VISHNIAC. IEEE Trans. Semicond. Mfg 3(3), I09 (1990). The demands for precision and speed in manufacturing processes in the semidconductor industry are not well suited to traditional, large-scale approaches to automation. Consideration of several micro-automation approaches has led us to the development of a magnetic levitation-based system capable of three-dimensional motions. Such systems are able to move quickly and precisely, and can deliver prescribed forces and moments. We have identified several applications for magnetic levitation-based micro-automation in semiconductor manufacturing which could be significantly impacted. These include positioning operations at various scales such as mask alignment, hybrid circuit assembly, and transport between process stations. Other applications are analytical probing, nondestructive tape automated bonding (TAB) bond testing, and optical system alignment. A rule-based VLSI process flow validation system with macroscopic process simulation. KIYOHIKO FUNAKOSHI and KAZUSHI MIZUNO. IEEE Trans. Semicond. Mfg 3(4), 239 (1990). As the integration scale of very large scale integration (VLSI) circuits increases, it is becoming increasingly difficult to design long and complex process flows because there is a great amount of knowledge in VLSI process technology. To assist in process flow design, a rule-based validation system has been developed. This system checks designed process flows by using process knowledge related
to contamination, cleaning methods and the various constraints between the wafer structure and the process or equipment. It can point out error conditions that lead to such destructive results as contamination of the process equipment. The system applies process knowledge, expressed as if/then rules, to the process conditions and to macroscopic wafer structures derived from rule-based simulation. Due to the complexity of VLSI multi-layered structures, information related to wafer structure is very important. This information can be obtained by rule-based simulation of such various macroscopic attributes of wafer structure as substance, contamination, and layer thickness. The validation system can precisely check various process flows and substantially improve the efficiency and quality of process flow design.
A new technique for testing TAB bonded LSIs in the Gigahertz frequency range. TAICH1 KON, SHINICHI SASAKIand RIYO KONNO. IEEE Trans. Compon. Hybrids mfg TechnoL 13(4), 682 (1990). This paper describes a new testing technique for tape automated bonding (TAB) bonded LSIs operating in the gigahertz frequency range. A TAB tape is sandwiched between test tools in order to compose a stripline configuration during testing. This new technique enables the testing frequency range to be dramatically extended by reducing reflection noise caused by impedance mismatch between the test leads and the test sets. Maximum testing bit rate reaches 5 Gb/s, which is 2.5 times greater than the conventional technique. Surface active buffered hydrogen fluoride having excellent wettability for ULSI processing. HIROHISA KIKUYAMA, NOBOHIRO MIKI, KIYONORI SAKA, JUN TAKANO, CHIRO KAWANABE, MASAYUKIMIYASHITAand TADARHIRO OHMI. IEEE Trans. Semicond. Mfg 3(3), 99 (1990). Buffered hydrogen fluoride is an essential chemical for wet processing of ultra large scale integration (ULSI) device manufacturing. However, buffered hydrogen fluoride has been demonstrated experimentally to exhibit poor quality in wet cleaning of the silicon wafers or etching of high-aspect ratio contact holes and via holes due to its poor wettability of the silicon wafer surface. A surface active buffered hydrogen fluoride has been developed through the addition of surfactants. It has been confirmed as exhibiting excellent wettability, resulting in improved wet cleaning and etching without causing any roughness of the silicon wafer surface. Wettability control of buffered hydrogen fluoride through the addition of surfactants is discussed based on requirements for ULSI wet chemical processing. Flip-chip soldering to bare copper circuits. ANTHONY P. INGRAHAM, .JACK M. McCREARY and .JACK A. VARCOE. IEEE Trans. Compon. Hybrids mfg Technol. 13(4), 656 (1990). Controlled collapse chip connection (C4) technology was introduced in the mid-1960s as a chip interconnection and has evolved over the years to meet the challenges of new iterations of flip-chip packaging. This paper describes a process for providing high yield/high reliability C4 joining to bare copper circuitry. A study was undertaken in the course of implementing a major change in IBM's metallized ceramic (MC) and metallized ceramic polyimide (MCP) production line. It involved joining chips with 95/5 Pb/Sn C4 solder bumps to bare copper pads on substrates to replace dip tinned substrates with 90/10 Pb/Sn coated pads. Included is an extensive analysis of the C4 interconnection. Over 30,000 chips were jointed to ceramic substrates to characterize wetting to the copper pads, evaluate C4 fatigue life, and assess any reliability impact of natural and artificially induced defects in the C4 columns or wetted pad surface. The technique for C4 interconnection joining to copper pads has been successfully implemented across many manufacturing sites.
World Abstracts on Microelectronics and Reliability
important, for instance, in the packaging of large integrated circuits or of multichip modules. In order to assess the pertbrmance of such a material it is necessary to construct prototype packages; however, extensive investigation into material behavior and compatibility is often necessary before the material can be incorporated into standard processing routes. This paper illustrates the way in which many standard processing techniques such as laser cutting, thick and thin film deposition, glassing and soldering can be used with aluminum nitride, and also highlights some of the ways in which material and process compatibilities can be achieved. The viability of such techniques is demonstrated by the production of aluminum nitride prototype packages and substrates using thick and thin film technologies. Loop wiring cuts costs, enhances reliability. TSUTOMU SAKURAI and YOSHIFUMI HARI. JEE (Japan) 99 (August 1990). In recent years, the amount of wiring at production facilities has increased with the growing sophistication of machinery control equipment. As a result, in-plant wiring costs have been increasing and in turn, reliability has been going downhill. To solve these problems, a loop wiring method employing optical fibers has been developed.
New polymeric muitilayer substrates and packaging. H. OHDAIRA,K. YOSHIDAand K. SASAOKA.Circuit WId 17(2), 2 (1991). This paper reports on the development of a simple manufacturing process for polymeric multilayer substrates utilizing the thermoplasticity of thermoplastic resin. Features and defects noted in manufacturing trials of the substrates are also reported. The process involves a polymer-based thick film conductive paste screen printed on a hole-punched thermoplastic resin film and dried. The films are stacked to form multiple layers and arc then compressed into one unit. As the extremely thin thermoplastic resin layers are equivalent to a single layer, a feature of this substrate is its exceptional thinness. As thermoplastic resin is used as a base material, the soldering process and other connecting technologies which may be used in place of solder connection are also examined. Applications of magnetic levitation based micro-automation in semiconductor manufacturing. ILENE J. BUSCH-VISHNIAC. IEEE Trans. Semicond. Mfg 3(3), I09 (1990). The demands for precision and speed in manufacturing processes in the semidconductor industry are not well suited to traditional, large-scale approaches to automation. Consideration of several micro-automation approaches has led us to the development of a magnetic levitation-based system capable of three-dimensional motions. Such systems are able to move quickly and precisely, and can deliver prescribed forces and moments. We have identified several applications for magnetic levitation-based micro-automation in semiconductor manufacturing which could be significantly impacted. These include positioning operations at various scales such as mask alignment, hybrid circuit assembly, and transport between process stations. Other applications are analytical probing, nondestructive tape automated bonding (TAB) bond testing, and optical system alignment. A rule-based VLSI process flow validation system with macroscopic process simulation. KIYOHIKO FUNAKOSHI and KAZUSHI MIZUNO. IEEE Trans. Semicond. Mfg 3(4), 239 (1990). As the integration scale of very large scale integration (VLSI) circuits increases, it is becoming increasingly difficult to design long and complex process flows because there is a great amount of knowledge in VLSI process technology. To assist in process flow design, a rule-based validation system has been developed. This system checks designed process flows by using process knowledge related
to contamination, cleaning methods and the various constraints between the wafer structure and the process or equipment. It can point out error conditions that lead to such destructive results as contamination of the process equipment. The system applies process knowledge, expressed as if/then rules, to the process conditions and to macroscopic wafer structures derived from rule-based simulation. Due to the complexity of VLSI multi-layered structures, information related to wafer structure is very important. This information can be obtained by rule-based simulation of such various macroscopic attributes of wafer structure as substance, contamination, and layer thickness. The validation system can precisely check various process flows and substantially improve the efficiency and quality of process flow design.
A new technique for testing TAB bonded LSIs in the Gigahertz frequency range. TAICH1 KON, SHINICHI SASAKIand RIYO KONNO. IEEE Trans. Compon. Hybrids mfg TechnoL 13(4), 682 (1990). This paper describes a new testing technique for tape automated bonding (TAB) bonded LSIs operating in the gigahertz frequency range. A TAB tape is sandwiched between test tools in order to compose a stripline configuration during testing. This new technique enables the testing frequency range to be dramatically extended by reducing reflection noise caused by impedance mismatch between the test leads and the test sets. Maximum testing bit rate reaches 5 Gb/s, which is 2.5 times greater than the conventional technique. Surface active buffered hydrogen fluoride having excellent wettability for ULSI processing. HIROHISA KIKUYAMA, NOBOHIRO MIKI, KIYONORI SAKA, JUN TAKANO, CHIRO KAWANABE, MASAYUKIMIYASHITAand TADARHIRO OHMI. IEEE Trans. Semicond. Mfg 3(3), 99 (1990). Buffered hydrogen fluoride is an essential chemical for wet processing of ultra large scale integration (ULSI) device manufacturing. However, buffered hydrogen fluoride has been demonstrated experimentally to exhibit poor quality in wet cleaning of the silicon wafers or etching of high-aspect ratio contact holes and via holes due to its poor wettability of the silicon wafer surface. A surface active buffered hydrogen fluoride has been developed through the addition of surfactants. It has been confirmed as exhibiting excellent wettability, resulting in improved wet cleaning and etching without causing any roughness of the silicon wafer surface. Wettability control of buffered hydrogen fluoride through the addition of surfactants is discussed based on requirements for ULSI wet chemical processing. Flip-chip soldering to bare copper circuits. ANTHONY P. INGRAHAM, .JACK M. McCREARY and .JACK A. VARCOE. IEEE Trans. Compon. Hybrids mfg Technol. 13(4), 656 (1990). Controlled collapse chip connection (C4) technology was introduced in the mid-1960s as a chip interconnection and has evolved over the years to meet the challenges of new iterations of flip-chip packaging. This paper describes a process for providing high yield/high reliability C4 joining to bare copper circuitry. A study was undertaken in the course of implementing a major change in IBM's metallized ceramic (MC) and metallized ceramic polyimide (MCP) production line. It involved joining chips with 95/5 Pb/Sn C4 solder bumps to bare copper pads on substrates to replace dip tinned substrates with 90/10 Pb/Sn coated pads. Included is an extensive analysis of the C4 interconnection. Over 30,000 chips were jointed to ceramic substrates to characterize wetting to the copper pads, evaluate C4 fatigue life, and assess any reliability impact of natural and artificially induced defects in the C4 columns or wetted pad surface. The technique for C4 interconnection joining to copper pads has been successfully implemented across many manufacturing sites.