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A Review of electronics reliability engineering practice
Publications, Notices, Calls for Papers, Etc.
THE INSTITUTE OF
301
ELECTRICAL AND ELECTRONICS ENGINEERS INCORPORATED
1980 INTERNATIONALRELIABILITYPHYSICSSYMPOSIUM April 8 - - 1 0 , 1980 * Caesar's Palace • Las Vegas, Nevada
CALL FOR PAPERS The eighteenth annual symposium, cosponsored by the IEEE Group on Reliability and the Electron Devices Society, emphasizes reliability physics as the link between part reliability and part design and process technology. T h e 1980 S y m p o s i u m w i l l e m p h a s i z e t h e r e l i a b i l i t y p h y s i c s of LSI a n d V L S I d e v i c e s from design through processing, packaging, and testing. Papers are especially s o l i c i t e d i n t h i s a r e a ; h o w e v e r , w o r k i n a l l a r e a s of r e l i a b i l i t y p h y s i c s w i l l b e i n c l u d e d in the program. Papers
s h o u l d d e a l w i t h w o r k on: P h y s i c s of F a i l u r e M e c h a n i s m s - Q u a n t i t a t i v e m o d e l s for component failure. Failure Analysis Techniques - Application to specific failure analysis. Accelerated Testing and Screening - Emphasizing the which validate testing and screening techniques. Design and Process Control for Reliability - Relating c o n c e p t s a n d p r o c e s s c o n t r o l s to p a r t r e l i a b i l i t y .
and mechanisms problems
in
physical mechanisms specific design
In the following or related areas: M a g n e t i c B u b b l e M e m o r i e s (A s p e c i a l s e s s i o n on t h e u n i q u e a s p e c t s of these devices is planned) LSI ( M i c r o p r o c e s s o r s , M e m o r y , e t c . , ) - MOS, b i p o l a r ( e s p e c i a l l y l o w p o w e r S c h o t t k y a n d lZ L), SOS a n d C C D s . Semiconductor/Insulator Interfaces, Contacts and Metalization. Packaging, Bonding, Die Attach, Coatings and Encapsulation. Hybrids (Materials, Processes and Components) Displays, Sensors, and Solar Cells. M i c r o w a v e , O p t o e l e c t r o n i c , a n d SAW D e v i c e s . G a A s D e v i c e s a n d I n t e r f a c e E f f e c t s on l l l - V D e v i c e s . N e w D e v i c e s (DMOS, V M O S , a n d HMOS) N e w T e c h n o l o g i e s (VLSI, L o w T e m p e r a t u r e CVD Deposition, and Dry Process Etching) Passive Components. In a d d i t i o n to t h e n o r m a l v e r b a l p r e s e n t a t i o n s , a special poster session is planned for significant papers on very specialized subjects and papers with a high mathematical content. In t h i s s e s s i o n a u t h o r s w i l l d i s p l a y s i g n i f i c a n t d a t a , e q u a t i o n s a n d a s u m m a r y of t h e i r w o r k on p o s t e r s a n d b e a v a i l a b l e d u r i n g t h e e n t i r e s e s s i o n to d i s c u s s t h e i r w o r k . T h e d e a d l i n e f o r s u b m i s s i o n of a b s t r a c t s i s O c t o b e r 22, 1979. Prospective a u t h o r s a r e r e q u e s t e d t o n o t i f y t h e P r o g r a m C h a i r m a n b e f o r e S e p t e m b e r 15, 1979, of t h e i r i n t e n t i o n t o s u b m i t a n a b s t r a c t a n d t h e t o p i c s to b e d i s c u s s e d . Authors must s u b m i t a 50 w o r d d e s c r i p t i v e a b s t r a c t a n d a 3 0 0 - 5 0 0 w o r d s u m m a r y a p p r o p r i a t e t o d e s c r i b e a Z0 m i n u t e p a p e r o r a p o s t e r p r e s e n t a t i o n w i t h 10 p l a c a r d s . B o t h t h e a b s t r a c t a n d s u m m a r y m u s t c l e a r l y s t a t e : (1) t h e p u r p o s e of t h e w o r k , (Z) h o w i t a d v a n c e s t h e k n o w l e d g e of r e l i a b i l i t y p h y s i c s , a n d (3) t h e r e s u l t s of t h e investigation. T h e 50 w o r d a b s t r a c t , s u i t a b l e f o r p u b l i c a t i o n i n t h e a d v a n c e p r o g r a m , s h o u l d b e t y p e d o n a s e p a r a t e s h e e t , a n d i n c l u d e t h e t i t l e of t h e t a l k , n a m e a n d
302
Publications, Notices, Calls for Papers. Etc.
a f f i l i a t i o n of t h e a u t h o r ( s ) , c o m p l e t e r e t u r n a d d r e s s , a n d t e l e p h o n e n u m b e r . The 300-500 w o r d s u m m a r y m u s t be s u b m i t t e d in a s i n g l e - s i d e d , d o u b l e - s p a c e d t y p e w r i t t e n f o r m a t suitable f o r i m m e d i a t e r e p r o d u c t i o n and r e v i e w p u r p o s e s . No p h o t o g r a p h s o r d r a w i n g s a r e p e r m i t t e d b e c a u s e of p r i n t i n g r e s t r i c t i o n s . The title, name a n d a f f i l i a t i o n of a u t h o r s , c o m p l e t e r e t u r n a d d r e s s a n d t e l e p h o n e n u m b e r s h o u l d a p p e a r on t h e f i r s t p a g e , a n d t h e p a p e r t i t l e a n d a u t h o r ' s n a m e on e a c h s u b s e q u e n t p a g e . F o r w a r d a b s t r a c t s a n d s u m m a r i e s to : D r . M u r r a y H. W o o d s , Technical Program Chairman, 1980 I n t e r n a t i o n a l R e l i a b i l i t y P h y s i c s S y m p o s i u m , Intel Corporation, 3065 B o w e r s A v e n u e , S a n t a C l a r a , CA 95051 (408) 9 8 7 - 8 0 8 0 . A l i m i t e d n u m b e r of l a t e n e w s p a p e r s r e f l e c t i n g i m p o r t a n t n e w d e v e l o p m e n t s w i l l b e c o n s i d e r e d on a s p a c e a v a i l a b l e b a s i s . Please call the Technical Program C h a i r m a n to d i s c u s s t h e d e t a i l s of y o u r l a t e n e w s p a p e r s a s s o o n a s you c a n . Criteria used by the program
c o m m i t t e e to s e l e c t p a p e r s f o r t h e s y m p o s i u m a r e :
The work must be new and previously unpublished. E v i d e n c e of q u a n t i t a t i v e r e s u l t s a n d a n a l y t i c a l r n o d e l s of s t u d i e d p h e n o m e n a m u s t b e g i v e n in t h e a b s t r a c t . T h e p u r p o s e a n d r e s u l t s of t h e w o r k a n d h o w i t a d v a n c e s t h e s t a t e of t h e a r t m u s t b e c l e a r l y d e s c r i b e d . A u t h o r s of a c c e p t e d p a p e r s w i l l b e r e q u i r e d t o s u b m i t t h e i r s l i d e s a n d p a p e r m a n u s c r i p t s f o r r e v i e w b y t h e i r s e s s i o n c h a i r m a n b e f o r e M a r c h 1, 1980. Visual aid legibility is mandatory, Only 35ram s l i d e s will be p e r m i t t e d , P a p e r s will not be a p p r o v e d f o r p r e s e n t a t i o n if t h e s l i d e q u a l i t y i s u n a c c e p t a b l e . F i n a l v e r s i o n s of m a n u s c r i p t s f o r all p a p e r s m u s t b e s u b m i t t e d at t h e s y m p o s i u m f o r i n c l u s i o n in t h e Proceedings. For general conference information contact :
Mr. Glen T. Cheney, General Chairman 1980 International Reliability Physics Symposium, Bell Laboratories, 555 Union Boulevard, Allentown, P A 18103,
(ZI5) 439-7628.
THE INSTITUTE OF
301
ELECTRICAL AND ELECTRONICS ENGINEERS INCORPORATED
1980 INTERNATIONALRELIABILITYPHYSICSSYMPOSIUM April 8 - - 1 0 , 1980 * Caesar's Palace • Las Vegas, Nevada
CALL FOR PAPERS The eighteenth annual symposium, cosponsored by the IEEE Group on Reliability and the Electron Devices Society, emphasizes reliability physics as the link between part reliability and part design and process technology. T h e 1980 S y m p o s i u m w i l l e m p h a s i z e t h e r e l i a b i l i t y p h y s i c s of LSI a n d V L S I d e v i c e s from design through processing, packaging, and testing. Papers are especially s o l i c i t e d i n t h i s a r e a ; h o w e v e r , w o r k i n a l l a r e a s of r e l i a b i l i t y p h y s i c s w i l l b e i n c l u d e d in the program. Papers
s h o u l d d e a l w i t h w o r k on: P h y s i c s of F a i l u r e M e c h a n i s m s - Q u a n t i t a t i v e m o d e l s for component failure. Failure Analysis Techniques - Application to specific failure analysis. Accelerated Testing and Screening - Emphasizing the which validate testing and screening techniques. Design and Process Control for Reliability - Relating c o n c e p t s a n d p r o c e s s c o n t r o l s to p a r t r e l i a b i l i t y .
and mechanisms problems
in
physical mechanisms specific design
In the following or related areas: M a g n e t i c B u b b l e M e m o r i e s (A s p e c i a l s e s s i o n on t h e u n i q u e a s p e c t s of these devices is planned) LSI ( M i c r o p r o c e s s o r s , M e m o r y , e t c . , ) - MOS, b i p o l a r ( e s p e c i a l l y l o w p o w e r S c h o t t k y a n d lZ L), SOS a n d C C D s . Semiconductor/Insulator Interfaces, Contacts and Metalization. Packaging, Bonding, Die Attach, Coatings and Encapsulation. Hybrids (Materials, Processes and Components) Displays, Sensors, and Solar Cells. M i c r o w a v e , O p t o e l e c t r o n i c , a n d SAW D e v i c e s . G a A s D e v i c e s a n d I n t e r f a c e E f f e c t s on l l l - V D e v i c e s . N e w D e v i c e s (DMOS, V M O S , a n d HMOS) N e w T e c h n o l o g i e s (VLSI, L o w T e m p e r a t u r e CVD Deposition, and Dry Process Etching) Passive Components. In a d d i t i o n to t h e n o r m a l v e r b a l p r e s e n t a t i o n s , a special poster session is planned for significant papers on very specialized subjects and papers with a high mathematical content. In t h i s s e s s i o n a u t h o r s w i l l d i s p l a y s i g n i f i c a n t d a t a , e q u a t i o n s a n d a s u m m a r y of t h e i r w o r k on p o s t e r s a n d b e a v a i l a b l e d u r i n g t h e e n t i r e s e s s i o n to d i s c u s s t h e i r w o r k . T h e d e a d l i n e f o r s u b m i s s i o n of a b s t r a c t s i s O c t o b e r 22, 1979. Prospective a u t h o r s a r e r e q u e s t e d t o n o t i f y t h e P r o g r a m C h a i r m a n b e f o r e S e p t e m b e r 15, 1979, of t h e i r i n t e n t i o n t o s u b m i t a n a b s t r a c t a n d t h e t o p i c s to b e d i s c u s s e d . Authors must s u b m i t a 50 w o r d d e s c r i p t i v e a b s t r a c t a n d a 3 0 0 - 5 0 0 w o r d s u m m a r y a p p r o p r i a t e t o d e s c r i b e a Z0 m i n u t e p a p e r o r a p o s t e r p r e s e n t a t i o n w i t h 10 p l a c a r d s . B o t h t h e a b s t r a c t a n d s u m m a r y m u s t c l e a r l y s t a t e : (1) t h e p u r p o s e of t h e w o r k , (Z) h o w i t a d v a n c e s t h e k n o w l e d g e of r e l i a b i l i t y p h y s i c s , a n d (3) t h e r e s u l t s of t h e investigation. T h e 50 w o r d a b s t r a c t , s u i t a b l e f o r p u b l i c a t i o n i n t h e a d v a n c e p r o g r a m , s h o u l d b e t y p e d o n a s e p a r a t e s h e e t , a n d i n c l u d e t h e t i t l e of t h e t a l k , n a m e a n d
302
Publications, Notices, Calls for Papers. Etc.
a f f i l i a t i o n of t h e a u t h o r ( s ) , c o m p l e t e r e t u r n a d d r e s s , a n d t e l e p h o n e n u m b e r . The 300-500 w o r d s u m m a r y m u s t be s u b m i t t e d in a s i n g l e - s i d e d , d o u b l e - s p a c e d t y p e w r i t t e n f o r m a t suitable f o r i m m e d i a t e r e p r o d u c t i o n and r e v i e w p u r p o s e s . No p h o t o g r a p h s o r d r a w i n g s a r e p e r m i t t e d b e c a u s e of p r i n t i n g r e s t r i c t i o n s . The title, name a n d a f f i l i a t i o n of a u t h o r s , c o m p l e t e r e t u r n a d d r e s s a n d t e l e p h o n e n u m b e r s h o u l d a p p e a r on t h e f i r s t p a g e , a n d t h e p a p e r t i t l e a n d a u t h o r ' s n a m e on e a c h s u b s e q u e n t p a g e . F o r w a r d a b s t r a c t s a n d s u m m a r i e s to : D r . M u r r a y H. W o o d s , Technical Program Chairman, 1980 I n t e r n a t i o n a l R e l i a b i l i t y P h y s i c s S y m p o s i u m , Intel Corporation, 3065 B o w e r s A v e n u e , S a n t a C l a r a , CA 95051 (408) 9 8 7 - 8 0 8 0 . A l i m i t e d n u m b e r of l a t e n e w s p a p e r s r e f l e c t i n g i m p o r t a n t n e w d e v e l o p m e n t s w i l l b e c o n s i d e r e d on a s p a c e a v a i l a b l e b a s i s . Please call the Technical Program C h a i r m a n to d i s c u s s t h e d e t a i l s of y o u r l a t e n e w s p a p e r s a s s o o n a s you c a n . Criteria used by the program
c o m m i t t e e to s e l e c t p a p e r s f o r t h e s y m p o s i u m a r e :
The work must be new and previously unpublished. E v i d e n c e of q u a n t i t a t i v e r e s u l t s a n d a n a l y t i c a l r n o d e l s of s t u d i e d p h e n o m e n a m u s t b e g i v e n in t h e a b s t r a c t . T h e p u r p o s e a n d r e s u l t s of t h e w o r k a n d h o w i t a d v a n c e s t h e s t a t e of t h e a r t m u s t b e c l e a r l y d e s c r i b e d . A u t h o r s of a c c e p t e d p a p e r s w i l l b e r e q u i r e d t o s u b m i t t h e i r s l i d e s a n d p a p e r m a n u s c r i p t s f o r r e v i e w b y t h e i r s e s s i o n c h a i r m a n b e f o r e M a r c h 1, 1980. Visual aid legibility is mandatory, Only 35ram s l i d e s will be p e r m i t t e d , P a p e r s will not be a p p r o v e d f o r p r e s e n t a t i o n if t h e s l i d e q u a l i t y i s u n a c c e p t a b l e . F i n a l v e r s i o n s of m a n u s c r i p t s f o r all p a p e r s m u s t b e s u b m i t t e d at t h e s y m p o s i u m f o r i n c l u s i o n in t h e Proceedings. For general conference information contact :
Mr. Glen T. Cheney, General Chairman 1980 International Reliability Physics Symposium, Bell Laboratories, 555 Union Boulevard, Allentown, P A 18103,
(ZI5) 439-7628.