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A standardized hybrid microcircuit design cycle
124
WORLD
ABSTRACTS
()N M I C R O E L E C T R O N I C S
ftowever, selection of the proper bonding alloy involves the coordination of many requirements which may conflict with each other. No matter what method is physically used to introduce the bonding alloys-screenable solder creams and pastes, preforms, immersion, evaporation--the problem of selecting the proper bonding alloy is one which must be considered during the very early production design stages of the hybrid device. The bonding alloy selected will affect the entire production sequence of the device, as well as influencing the overall reliability and usefulness of the completed unit. The primary bonding alloy requirements which must be balanced before an alloy can be properly applied m a hybrid device can be characterized into four major areas: Temperature, Type of Active and Passive Components Used, Stress Considerations and Metallurgical Compatability.
Rigid and non-rigid beam-lead substrates. F. L. BACHNER) R. A. COHEN and R. E. MCMAHON, Solid State Technology, August (1970), p. 62. Beam lead substrates offer a number of advantages in the assembly and interconnection of semiconductor chips. The primary difficulties and limitations of present assembly methods are discussed from the point of view of system requirements. Rigid substrates using alumina and nonrigid substrates using polyimide sheets are described and both gold and aluminiurn metalization techniques are discussed.
Solder sealing of large c o m p l e x hybrid microcircuits. J. H. HOLLEY, Proc. 1970 20th Electronic Components Conf., Washington, 13-15 May (1970), p. 5. This paper covers the process of sealing, the method of repairing, and the effects of sequential environmental testing on large hybrid microcircuit packages. Solder alloys Sn 63 and Sn 96 were used to seal 1 × 1 in. and 1 >,/ 2 in. ceramic packages with metal lids. Environmental testing included: High temperature storage; reduced pressure cycling at elevated temperature ; thermal shock; mechanical shock; vibration, variable frequency ; temperature cycling; low temperature storage and salt spray. The criteria for acceptance was a hermeticity test with a leak rate not to exceed 5 × 10 -7 atmos, cc per sec. No failures occurred with the Sn 96 solder alloy. The Sn 63 solder alloy did not withstand the environmental stress; some units showed a leak rate in excess of the requirement. Process techniques and items determined to be critical in achieving a hermetic seal are discussed.
The intereonnectlon and packaging of thick film microcircuits. R. ILGENFRITZ and L. MOGEY, Proc. ]970 20th Electronic Components Conf., Washington, 13-15 May (1970), p. 122. In the past, the lack of standardization of the module size has caused problems in terms of producibility, tooling and system integration. Based on experience gained in various system design and packaging programs, Raytheon Company has developed a line of hermetic sealed standard packages called RAY-PAKS which provide integration levels up
AND
RELIABILITY
to LSI. In this development program, three multilayer technologies have been evaluated as a means of providing the interconnecting network between chips and passive components; namely, conventional thin film, screened and fired thick film and the ceramic strata.
Thermal design problems with high speed ICs .... Part 2. R. J. HOUSMAN, .~/licroelectronics 1, No. 1, Autumn (1970), p. 45. The role of the mechanical engineer in electronic equipment design has become increasingly important since the introduction of integrated circuits. One result of new circuit technology has been the increasing need for accurate thermal design and analysis. During the past few years this thermal management problem has been magnified by the development of ultra high-speed circuits, which dissipate power at levels of an order of magnitude higher than the first integrated circuits. This discussion deals with some of the factors which contribute to the temperature problem and approaches that may be taken to accomplish a reliable design.
A standardized hybrid microcircuit design cycle. W. A. FAHLEY, Proc. 1970 20th Electronic Components Conf., Washington 13-15 May (1970), p. 503. Large systems houses acquiring or developing in-house hybrid capability have need of hybrid design procedures useful to all levels of design engineering. This paper describes the concept of a standard cycle to meet this need. The general content of each portion of the design cycle is discussed and specific examples of suggested formats are given.
Resin systems for encapsulation of m i c r o e l e c tronic packages. H. HIRSCH, Solid State Technology, August (1970), p. 48. The requirements of polymeric materials for microelectronic packaging are stringent. Contamination in resin systems can degrade circuits by attacking the metallurgy, introducing foreign ions, setting up stresses which may shear bonds, and causing failure when subjected to environmental conditions. A program for evaluating epoxy resins for packaging is described. Emphasis is placed on thermal expansion, effect of curing temperature on second order transition temperatures, effect of reactive diluments, effect of specific fillers, and the effect of temperature and humidity cycling on metallurgical bonds encapsulated with epoxy resin.
Fine line technologies for microelectronic devices. C. H. WANG, Proc. 1970 20th Electronic Components Conf., Washington, 13-15 May (1970), p. 570. Three fine line technologies are discussed : screening, decal, and the photoetching process. The moly-manganese system is used as a conductive material because: (a) metal leads can be easily brazed to it in a reducing environment and the peel strength is excellent, (b) it can be gold plated without deteriorating the peel strength and, (c) it can be sealed hermetically. Photo-etched fine lines yield the best quality of the three technologies discussed.
WORLD
ABSTRACTS
()N M I C R O E L E C T R O N I C S
ftowever, selection of the proper bonding alloy involves the coordination of many requirements which may conflict with each other. No matter what method is physically used to introduce the bonding alloys-screenable solder creams and pastes, preforms, immersion, evaporation--the problem of selecting the proper bonding alloy is one which must be considered during the very early production design stages of the hybrid device. The bonding alloy selected will affect the entire production sequence of the device, as well as influencing the overall reliability and usefulness of the completed unit. The primary bonding alloy requirements which must be balanced before an alloy can be properly applied m a hybrid device can be characterized into four major areas: Temperature, Type of Active and Passive Components Used, Stress Considerations and Metallurgical Compatability.
Rigid and non-rigid beam-lead substrates. F. L. BACHNER) R. A. COHEN and R. E. MCMAHON, Solid State Technology, August (1970), p. 62. Beam lead substrates offer a number of advantages in the assembly and interconnection of semiconductor chips. The primary difficulties and limitations of present assembly methods are discussed from the point of view of system requirements. Rigid substrates using alumina and nonrigid substrates using polyimide sheets are described and both gold and aluminiurn metalization techniques are discussed.
Solder sealing of large c o m p l e x hybrid microcircuits. J. H. HOLLEY, Proc. 1970 20th Electronic Components Conf., Washington, 13-15 May (1970), p. 5. This paper covers the process of sealing, the method of repairing, and the effects of sequential environmental testing on large hybrid microcircuit packages. Solder alloys Sn 63 and Sn 96 were used to seal 1 × 1 in. and 1 >,/ 2 in. ceramic packages with metal lids. Environmental testing included: High temperature storage; reduced pressure cycling at elevated temperature ; thermal shock; mechanical shock; vibration, variable frequency ; temperature cycling; low temperature storage and salt spray. The criteria for acceptance was a hermeticity test with a leak rate not to exceed 5 × 10 -7 atmos, cc per sec. No failures occurred with the Sn 96 solder alloy. The Sn 63 solder alloy did not withstand the environmental stress; some units showed a leak rate in excess of the requirement. Process techniques and items determined to be critical in achieving a hermetic seal are discussed.
The intereonnectlon and packaging of thick film microcircuits. R. ILGENFRITZ and L. MOGEY, Proc. ]970 20th Electronic Components Conf., Washington, 13-15 May (1970), p. 122. In the past, the lack of standardization of the module size has caused problems in terms of producibility, tooling and system integration. Based on experience gained in various system design and packaging programs, Raytheon Company has developed a line of hermetic sealed standard packages called RAY-PAKS which provide integration levels up
AND
RELIABILITY
to LSI. In this development program, three multilayer technologies have been evaluated as a means of providing the interconnecting network between chips and passive components; namely, conventional thin film, screened and fired thick film and the ceramic strata.
Thermal design problems with high speed ICs .... Part 2. R. J. HOUSMAN, .~/licroelectronics 1, No. 1, Autumn (1970), p. 45. The role of the mechanical engineer in electronic equipment design has become increasingly important since the introduction of integrated circuits. One result of new circuit technology has been the increasing need for accurate thermal design and analysis. During the past few years this thermal management problem has been magnified by the development of ultra high-speed circuits, which dissipate power at levels of an order of magnitude higher than the first integrated circuits. This discussion deals with some of the factors which contribute to the temperature problem and approaches that may be taken to accomplish a reliable design.
A standardized hybrid microcircuit design cycle. W. A. FAHLEY, Proc. 1970 20th Electronic Components Conf., Washington 13-15 May (1970), p. 503. Large systems houses acquiring or developing in-house hybrid capability have need of hybrid design procedures useful to all levels of design engineering. This paper describes the concept of a standard cycle to meet this need. The general content of each portion of the design cycle is discussed and specific examples of suggested formats are given.
Resin systems for encapsulation of m i c r o e l e c tronic packages. H. HIRSCH, Solid State Technology, August (1970), p. 48. The requirements of polymeric materials for microelectronic packaging are stringent. Contamination in resin systems can degrade circuits by attacking the metallurgy, introducing foreign ions, setting up stresses which may shear bonds, and causing failure when subjected to environmental conditions. A program for evaluating epoxy resins for packaging is described. Emphasis is placed on thermal expansion, effect of curing temperature on second order transition temperatures, effect of reactive diluments, effect of specific fillers, and the effect of temperature and humidity cycling on metallurgical bonds encapsulated with epoxy resin.
Fine line technologies for microelectronic devices. C. H. WANG, Proc. 1970 20th Electronic Components Conf., Washington, 13-15 May (1970), p. 570. Three fine line technologies are discussed : screening, decal, and the photoetching process. The moly-manganese system is used as a conductive material because: (a) metal leads can be easily brazed to it in a reducing environment and the peel strength is excellent, (b) it can be gold plated without deteriorating the peel strength and, (c) it can be sealed hermetically. Photo-etched fine lines yield the best quality of the three technologies discussed.