World abstracts on microelectronics and reliability derived and discussed. Theoretical and simulation results show that estimation procedures based on the power law process and regression methods can be a flexible, useful tool for reliability analysis of a repairable item.
Optimal design of flexible and reliable process systems. THOMAS V. THOMAID1Sand EFSTRATIOSM. PIST1KOPOULOS. IEEE Transactions on Reliability, 44 (2), 243 (June 1995). In design and operation of chemical process systems, two categories of uncertainty are important: (1) realization of continuous process parameters (product demands, feedstock qualities, reaction kinetics), and (2) discrete states (typically related to equipment availability). This paper presents a general framework for incorporating both types of uncertainty in process system design. A combined flexibility reliability index (FRI) is introduced to measure the capability of a process system to cope simultaneously with 1) (stochastic) parameter variations, and 2) equipment failures, by explicitly accounting for process operational interactions and constraints. A design optimization procedure is then proposed for obtaining flexible, reliable process systems at minimum investment cost and maximum average profit: the potential inclusion of maintenance considerations is briefly discussed.
A device life cycle analysis of the WSI associative string processor. CHRISTOPHER PEACOCK, HAMID BOLOURI and R. MIKE LEA. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18 (3), 406 (August 1995). The paper presents a comprehensive life cycle model and analysis of the WSI Associative String Processor (WASP). The model simulates the manufacture, acceptance, and operational life of a hypothetical WASP device using discrete event simulation techniques. Manufacturing defects are modeled with the negative binomial distribution, and operational faults are modeled using an adaptation of the MIL-NDBK-217F VHSIC reliability model. A full description is given of the simulation procedures and fault tolerant structure representations used in the mode. A hypothetical WASP device manufactured in poor conditions and subjected to harsh operational conditions is shown to support nearly 8000 associative processing elements (APE) after 100 000 h (11.4 yr) of continuous simulated operation. A simple post-manufacture device selection procedure is demonstrated which improves this harvest figure to over 10000 APE's. A hypothetical WASP device manufactured in good conditions and subjected to mild operational conditions is shown to support an average of over 12500 APE's after 100000 h of continuous simulated operation, without device selection. An architectural parameter sensitivity analysis for the hypothetical device shows that the areas of circuit elements at the upper levels of the fault tolerance hierarchy have greater significance than those at the leaf level for both yield and reliability. A
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test coverage analysis demonstrates the need for a comprehensive testing strategy for WSI devices.
Defect and fault tolerant interconnection strategies for WASP devices. MOHAMMED B. A. HUSSAINI, HAMID BOLOURI and R. MIKE LEA. IEEE Transactions on Components, Packagin 9 and M anufacturin 9 Technology, Part B, 18 (3), 416 (August 1995). While WSI-based devices continue to be of particular interest for applications with severe performance, size, weight, power, cost, and reliability requirements, various implementation constraints in the past, including interconnect defect occurrences, have prevented their successful realization. This paper presents an investigation into defect and fault tolerant interconnect strategies for a representative WSI device, WASP (WSI Associative String Processor).
Reliability of a linear connected-(r, s)-out-of-(m, n):F lattice system. H. YAMAMOTO and M. MIYAKAWA. IEEE Transactions on Reliability, 44 (2), 333 (June 1995). A linear connected-(r, s)-out-of-(m, n): F lattice system has its components ordered like the elements of an (m, n)-matrix such that the system fails if all components in a connected (r, s)-submatrix fail. This paper proposes a recursive algorithm, named Yamamoto-Miyakawa (YM), for the system reliablity. The YM algorithm requires O(sm-'. m 3 .r'n) computing time. Comparisons with the existing methods show its usefulness. We prove that the reliability of the large system tends to exp(-/~-), r~) as n =/~'m" ~, m --, if every component has failure probability E'm ,/~r-~, where I~,2, r/ are constant, /z > 0, 2 > 0, r / > s, or r/(r-- l ) > r / > 1.
A system approach to reliability and life-cycle cost of process safety-systems. LARS BODSBERG and PER HOnSTAD. IEEE Transactions on Reliability, 44 (2), 179 (June 1995). An analytic method, PDS, allows the designer to assess the cost effectiveness of computer-based process safety-systems based on a quantification of reliability and life-cycle cost. Using PDS in early system design, configurations and operating philosophies can be identified in which the reliability of field devices and logic control units is balanced from a safety and an economic point of view. When quantifying reliability, the effects are included of fault-tolerant and fault-removal techniques, and of failures due to environmental stresses and failures initiated by humans during engineering and operation. A failure taxonomy allows the analyst to treat hardware failures, human failures, and software failures of automatic systems in an integrated manner. The main benefit of this taxonomy is the direct relationship between failure cause and the means used to improve safety-system performance.
Using statistically designed experiments to improve reliability and to achieve robust reliability. MICHAEL HAMADA.IEEE Transactions on Reliability, 44 (2), 206 (June 1995). This tutorial explains statistically