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A thick film hybrid IC amplifier for industrial use
1196
World Abstracts on Microelectronics and Reliability
Gold conductor pastes for high density circuit. SHIRO KADOTA and KOSHIRO SHIBATA. Electrocomponent Sci. Technol. 9, 31 (1981). High grade quality in fine-line printability, nonporosity of fired film and adhesion to substrate is required for gold conductor pastes applicable to multilayer or high density circuit. Many kinds of gold pastes were made by the changing of types and contents of main components such as gold powder, glass frit and organic vehicle. The important properties of the fired samples of the above pastes on alumina substrate and fired dielectric pastes were compared. Gold paste of the mixed bond type was recognized as superior in adhesion to alumina substrate, while that of the fritless type was found superior in adhesion to the fired dielectric paste and wire bondability. It is possible to print line of 701am width and spacing by using these gold pastes. If suitable printing conditions including screen are chosen, even 50l.tm line width and spacing can be made. Nonporosity measured by means of the back light porosity test and low resistivity of the samples met the requirement for the high density circuit. In this paper, various properties of the above mentioned gold pastes which are most suitable to two different type substrates will be described. Also the relation between the properties and compositions of the samples will be discussed. Electroless nickel resistors formed on IMST substrate. NORIO MIORA, YOSHIO FUURA and AKIRA KAZAMI. IEEE Trans. Components Hybrids Mill Technol. CHMT-4 (4), 532 (1981). N i - P alloy resistors electrolessly plated on a unique insulated metal substrate technology (IMST) substrate are described. The construction of the IMST substrate with electroless nickel resistors is presented. The resistor fabrication processes are shown. The obtained practical sheet resistivity of electroless nickel resistors was 0.5-20fl/V]. Laser trimming was utilized to produce resistors with a tolerance of +0.1 percent; and a resistance range from 0.1 ~ to 100kfl. The thermal coefficient of resistance (TCR) was closely related to the phosphorus content. A TCR of + 80 ppm/°C minimum was obtained. The electroless nickel resistors exhibited excellent stability in various life and high power dissipation tests. Applications to audio power hybrid integrated circuits (IC's) and resistor arrays are shown. A moisture protection screening test for hybrid circuit encapsulants. R. G. MANCKE. IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 492 (1981). An empirical comparative screening test for polymeric encapsulants reported here has been used to indicate how well different materials prevent unwanted leakage currents between closely spaced biased metal lines in integrated circuits (IC's) and hybrid integrated circuits (HIC's). It is not a reliability test. The screening test circuit, test procedure, and test conditions are described. This test and measurement equipment were developed earlier by N. L. Sbar and R. P. Kozakiewicz. Data for two silicone coatings and one epoxy coating are compared with data for our standard encapsulant, Dow Corning 3-6550 RTV. Also, interesting results are shown for layers of two different polymer coatings. A general conclusion drawn from these and other similar studies is that coatings of the same general polymer type can vary quite dramatically in performance in this screening test. An interactive design system for hybrid ICs. HIROSH! SHIRAISHI, KAORU KAWAMURA and MASAAKI HAYASHI. Electrocomponent Sci. Technol. 8, 221 (1981). In hybrid integrated circuit mask design, the design quality largely depends on the designer's experience and creativity. It is difficult to completely automate the design process as is done with LSIs or printed circuit boards. It is important to incorporate flexibility into the system. This paper describes an interactive design system for laying out hybrid ICs. The system is implemented on a large host computer, and graphic display terminals are connected
to it in a time sharing environment. The system provides designers with many interactive facilities which are useful in designing hybrid ICs. In addition to highly interactive dialogue, the system has capabilities such as dynamic checking of the designer's operations against a set of design rules, or automatic generation of standardized element patterns. The system outputs mask information, design documents and so on which are used in the CAM of hybrid ICs. The system is being used at Fujitsu and is contributing to high reliability of the design, and shortening the design period. Solder attachment of leaded components to thick film hybrids. NICHOLAS T. PANOUSIS and R. C. KERSHNER. IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 411 (1981). The mechanical reliability of solder connections between leaded appliqued components surface mounted to thick films is discussed. The test vehicle was a three-leaded device, known as soldered-on-transistor (SOT) which was soldered using 60Sn-40Pb to standard PtPdAg thick films. The amount of solder per connection was varied between 0.14 and 3.1 mg while the solder pad area on the metallization was held constant at 35 x 35 rail. The cross-sectional area of the SOT leads was 4 x 16 rail. SOT's were electrically and mechanically tested initially and after accelerated stress testing. It is concluded that about 1.1 mg of solder per connection is optimum although solder amounts between 0.6 and 2.0mg were shown to be acceptable. Solder amounts as little as 0.14mg per connection were shown to be clearly inferior. Acceptable long-term reliability is predicted for the optimum solder mass connections based on accelerated constant temperature aging and accelerated temperature cycling. A thick film hybrid IC amplifier for industrial use. HIROMI TOSAKI, AKIRAIKEGAMI,TSUTOMUOKAYAMAand YOSHITAKA MATSUOKA. Electrocomponent Sci. Technol. 8, 207 (1981). Electronic circuits for industrial uses must satisfy the following requirements: low sensitivity to changes in the surrounding temperature, high reliability, and small size. In the amplifier for a pressure transmitter described here, the temperature dependences of its properties, Zero point and Span, are intensively influenced by TCRs of the resistors used, and by a mismatching of the temperature dependences of the off-set voltages between the two operational amplifier IC chips. As for the thick film resistors, it has been cleared that the DuPont 1700 series resistor pastes are the most suitable: TCRs of less than + 8 0 p p m / ° C can be attained, and the change in resistance of the overglazed and laser trimmed resistors is less than + 0 . 1 % after 5000 hours at 200°C. As for the operational amplifier IC chips, their temperature dependences of the off-set voltages are checked individually, utilizing a ceramic carrier containing an operational amplifier IC chip. Then a pair of ceramic carriers, with a minimum mismatching of their temperature dependences, is mounted on a thick film circuit substrate by a Pb/Sn solder reflowing. The various transistor chips are divided into three functional blocks, and bonded into three ceramic carriers. Utilization of ceramic carriers in all active devices employed results in sufficient standardization in the characterization of the semiconductor devices and in the hybridizing process. In the thick film hybrid IC amplifier for a pressure transmitter thus developed, the temperature dependences of Zero point and Span are less than - 0 . 5 % FS/100°C, respectively. The drifts of Zero point and Span are less than _+0.1% FS in the period of 3000 hours of an operating test with DC 24 V loading at 100°C. Surface treatments and bondability of copper thick film circuits. T.S. LIu, DAVID E. PITKANEN and CHANDLER H. MCIVER. IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 417 (1981). Crucial issues in using copper thick film microcircuits, namely, surface treatment and bondability, are addressed. A multilayer multichip ceramic substrate package with copper thick film conductors was used
World Abstracts on Microelectronics and Reliability
Gold conductor pastes for high density circuit. SHIRO KADOTA and KOSHIRO SHIBATA. Electrocomponent Sci. Technol. 9, 31 (1981). High grade quality in fine-line printability, nonporosity of fired film and adhesion to substrate is required for gold conductor pastes applicable to multilayer or high density circuit. Many kinds of gold pastes were made by the changing of types and contents of main components such as gold powder, glass frit and organic vehicle. The important properties of the fired samples of the above pastes on alumina substrate and fired dielectric pastes were compared. Gold paste of the mixed bond type was recognized as superior in adhesion to alumina substrate, while that of the fritless type was found superior in adhesion to the fired dielectric paste and wire bondability. It is possible to print line of 701am width and spacing by using these gold pastes. If suitable printing conditions including screen are chosen, even 50l.tm line width and spacing can be made. Nonporosity measured by means of the back light porosity test and low resistivity of the samples met the requirement for the high density circuit. In this paper, various properties of the above mentioned gold pastes which are most suitable to two different type substrates will be described. Also the relation between the properties and compositions of the samples will be discussed. Electroless nickel resistors formed on IMST substrate. NORIO MIORA, YOSHIO FUURA and AKIRA KAZAMI. IEEE Trans. Components Hybrids Mill Technol. CHMT-4 (4), 532 (1981). N i - P alloy resistors electrolessly plated on a unique insulated metal substrate technology (IMST) substrate are described. The construction of the IMST substrate with electroless nickel resistors is presented. The resistor fabrication processes are shown. The obtained practical sheet resistivity of electroless nickel resistors was 0.5-20fl/V]. Laser trimming was utilized to produce resistors with a tolerance of +0.1 percent; and a resistance range from 0.1 ~ to 100kfl. The thermal coefficient of resistance (TCR) was closely related to the phosphorus content. A TCR of + 80 ppm/°C minimum was obtained. The electroless nickel resistors exhibited excellent stability in various life and high power dissipation tests. Applications to audio power hybrid integrated circuits (IC's) and resistor arrays are shown. A moisture protection screening test for hybrid circuit encapsulants. R. G. MANCKE. IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 492 (1981). An empirical comparative screening test for polymeric encapsulants reported here has been used to indicate how well different materials prevent unwanted leakage currents between closely spaced biased metal lines in integrated circuits (IC's) and hybrid integrated circuits (HIC's). It is not a reliability test. The screening test circuit, test procedure, and test conditions are described. This test and measurement equipment were developed earlier by N. L. Sbar and R. P. Kozakiewicz. Data for two silicone coatings and one epoxy coating are compared with data for our standard encapsulant, Dow Corning 3-6550 RTV. Also, interesting results are shown for layers of two different polymer coatings. A general conclusion drawn from these and other similar studies is that coatings of the same general polymer type can vary quite dramatically in performance in this screening test. An interactive design system for hybrid ICs. HIROSH! SHIRAISHI, KAORU KAWAMURA and MASAAKI HAYASHI. Electrocomponent Sci. Technol. 8, 221 (1981). In hybrid integrated circuit mask design, the design quality largely depends on the designer's experience and creativity. It is difficult to completely automate the design process as is done with LSIs or printed circuit boards. It is important to incorporate flexibility into the system. This paper describes an interactive design system for laying out hybrid ICs. The system is implemented on a large host computer, and graphic display terminals are connected
to it in a time sharing environment. The system provides designers with many interactive facilities which are useful in designing hybrid ICs. In addition to highly interactive dialogue, the system has capabilities such as dynamic checking of the designer's operations against a set of design rules, or automatic generation of standardized element patterns. The system outputs mask information, design documents and so on which are used in the CAM of hybrid ICs. The system is being used at Fujitsu and is contributing to high reliability of the design, and shortening the design period. Solder attachment of leaded components to thick film hybrids. NICHOLAS T. PANOUSIS and R. C. KERSHNER. IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 411 (1981). The mechanical reliability of solder connections between leaded appliqued components surface mounted to thick films is discussed. The test vehicle was a three-leaded device, known as soldered-on-transistor (SOT) which was soldered using 60Sn-40Pb to standard PtPdAg thick films. The amount of solder per connection was varied between 0.14 and 3.1 mg while the solder pad area on the metallization was held constant at 35 x 35 rail. The cross-sectional area of the SOT leads was 4 x 16 rail. SOT's were electrically and mechanically tested initially and after accelerated stress testing. It is concluded that about 1.1 mg of solder per connection is optimum although solder amounts between 0.6 and 2.0mg were shown to be acceptable. Solder amounts as little as 0.14mg per connection were shown to be clearly inferior. Acceptable long-term reliability is predicted for the optimum solder mass connections based on accelerated constant temperature aging and accelerated temperature cycling. A thick film hybrid IC amplifier for industrial use. HIROMI TOSAKI, AKIRAIKEGAMI,TSUTOMUOKAYAMAand YOSHITAKA MATSUOKA. Electrocomponent Sci. Technol. 8, 207 (1981). Electronic circuits for industrial uses must satisfy the following requirements: low sensitivity to changes in the surrounding temperature, high reliability, and small size. In the amplifier for a pressure transmitter described here, the temperature dependences of its properties, Zero point and Span, are intensively influenced by TCRs of the resistors used, and by a mismatching of the temperature dependences of the off-set voltages between the two operational amplifier IC chips. As for the thick film resistors, it has been cleared that the DuPont 1700 series resistor pastes are the most suitable: TCRs of less than + 8 0 p p m / ° C can be attained, and the change in resistance of the overglazed and laser trimmed resistors is less than + 0 . 1 % after 5000 hours at 200°C. As for the operational amplifier IC chips, their temperature dependences of the off-set voltages are checked individually, utilizing a ceramic carrier containing an operational amplifier IC chip. Then a pair of ceramic carriers, with a minimum mismatching of their temperature dependences, is mounted on a thick film circuit substrate by a Pb/Sn solder reflowing. The various transistor chips are divided into three functional blocks, and bonded into three ceramic carriers. Utilization of ceramic carriers in all active devices employed results in sufficient standardization in the characterization of the semiconductor devices and in the hybridizing process. In the thick film hybrid IC amplifier for a pressure transmitter thus developed, the temperature dependences of Zero point and Span are less than - 0 . 5 % FS/100°C, respectively. The drifts of Zero point and Span are less than _+0.1% FS in the period of 3000 hours of an operating test with DC 24 V loading at 100°C. Surface treatments and bondability of copper thick film circuits. T.S. LIu, DAVID E. PITKANEN and CHANDLER H. MCIVER. IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 417 (1981). Crucial issues in using copper thick film microcircuits, namely, surface treatment and bondability, are addressed. A multilayer multichip ceramic substrate package with copper thick film conductors was used