- Email: [email protected]
Advances in linear monolithic circuit technology
332
ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
Integrated electronics. Putting the stress on IC reliability. Electronics, May 27 (1968), p. 149. Pressures from Government agencies, particularly the Air Force's Rome Air Development Center in upstate New York, are an important reason for the industry's relatively successful attempts to supply customers with reliable IC's. Realizing that device development was rapidly outpacing reliability data and experience, RADC pioneered physics-of-failure techniques in 1961 with an eye to obtaining better physical, chemical, and metallurgical characterizations of solid state assemblies. A failure analysis laboratory has been in existence at the center since 1963, and a steady stream of guideline publications has been issued. The latest, Military Specification Standard 883, which is now being distributed, not only details many new test methods for microelectronic devices, but also spells out precautionary measures for present procedures. Added to this is material on screening and lot-qualification procedures. CIRCUIT AND SYSTEMS RELIABILITY, MAINTENANCE, REDUNDANCY
The TEG - - A test element for the control of quality and reliability of integrated circuits. E. A. HERR,D. W. BAKERand A. Fox, Proc. 1968 Ann. Syrup. Reliab., Boston, U.S.A. January (1968), p. 201. Included in the main test program were devices manufactured with standard processes and others which were made with deliberate in-process variations. Devices from both the standard and the variable processes were subjected to a series of step-stress and constant stress-in-time tests in the main test program. Data were obtained from in-process measurements, wafer probe, pre-stress measurements of T E G s and integrated circuits, post stress measurements of TEGs and integrated circuits, and physics of failure analyses. More than five thousand integrated circuits and TEGs were stress tested. This represents over four million circuit hours under fixed stress-in-time tests in addition to the step-stress tests in which devices were operated in ambient temperatures up to 250°C. Maintainability--a design parameter. P. S. K. PRASAD,Electro-Technol., India, March-April (1967), p. 49. Maintainability, similar to reliability is a design parameter. The factors affecting maintainability have been enumerated. Some of them are concerned with administrative and logic organization involved. T o the remaining, it is possible to assign numbers with the help of which both prediction and design of maintainability are possible. This process has been discussed in greater detail. Reliability and redundancy. C. LACOMETTEand C. VIDAL,Onde Elect., April (1968), p. 308. (In French.) The object of this treatise is to determine the reliability of redundant systems combining series and parallel connections for branch circuits. The influence of the conditions in which the equipment is used, the type of failure and the level of stress, is taken into consideration. The results obtained are applied in accordance with the intended period of use. MICROELECTRONICS---GENERAL
Advances in linear monolithic circuit technology. R. A. MAMMANO,Solid St. Technol., March (1968), p. 31. The recent large growth in linear integrated circuit sales has established the "arrival" of this technology; however, its acceptance has not been due to the once thought necessary, standardization of linear circuits. It is the fact that the manufacturing process has somewhat standardized, allowing the development of a large number of relatively specialized circuits, that has encouraged the greater part of this growth. The development of the buried layer process and the refinement of component resolutions have done much toward optimizing a process which can be used with relatively little modification to manufacture widely varying circuit types. As a result, circuits ranging from operational and highfrequency video amplifiers to voltage regulator and entertainment types are now available. A monolithic integrated circuit processing laboratory for the electronics industry. H. K. DICKEN, Solid St. Technol., March (1968), p. 47. Design concept, overall plan, implementation, equipment and costs of a typical in-house silicon monolithic, integrated circuit processing laboratory are discussed in detail. Practical as well as theoretical problems of implementation are included. Each step in integrated circuit processing is analyzed so that the laboratory's capabilities will meet their requirements. A scaled layout of the model laboratory is included and explained. It shows work flow and equipment arrangement. Flow charts of the production operation and laboratory organization are included and discussed.
ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
Integrated electronics. Putting the stress on IC reliability. Electronics, May 27 (1968), p. 149. Pressures from Government agencies, particularly the Air Force's Rome Air Development Center in upstate New York, are an important reason for the industry's relatively successful attempts to supply customers with reliable IC's. Realizing that device development was rapidly outpacing reliability data and experience, RADC pioneered physics-of-failure techniques in 1961 with an eye to obtaining better physical, chemical, and metallurgical characterizations of solid state assemblies. A failure analysis laboratory has been in existence at the center since 1963, and a steady stream of guideline publications has been issued. The latest, Military Specification Standard 883, which is now being distributed, not only details many new test methods for microelectronic devices, but also spells out precautionary measures for present procedures. Added to this is material on screening and lot-qualification procedures. CIRCUIT AND SYSTEMS RELIABILITY, MAINTENANCE, REDUNDANCY
The TEG - - A test element for the control of quality and reliability of integrated circuits. E. A. HERR,D. W. BAKERand A. Fox, Proc. 1968 Ann. Syrup. Reliab., Boston, U.S.A. January (1968), p. 201. Included in the main test program were devices manufactured with standard processes and others which were made with deliberate in-process variations. Devices from both the standard and the variable processes were subjected to a series of step-stress and constant stress-in-time tests in the main test program. Data were obtained from in-process measurements, wafer probe, pre-stress measurements of T E G s and integrated circuits, post stress measurements of TEGs and integrated circuits, and physics of failure analyses. More than five thousand integrated circuits and TEGs were stress tested. This represents over four million circuit hours under fixed stress-in-time tests in addition to the step-stress tests in which devices were operated in ambient temperatures up to 250°C. Maintainability--a design parameter. P. S. K. PRASAD,Electro-Technol., India, March-April (1967), p. 49. Maintainability, similar to reliability is a design parameter. The factors affecting maintainability have been enumerated. Some of them are concerned with administrative and logic organization involved. T o the remaining, it is possible to assign numbers with the help of which both prediction and design of maintainability are possible. This process has been discussed in greater detail. Reliability and redundancy. C. LACOMETTEand C. VIDAL,Onde Elect., April (1968), p. 308. (In French.) The object of this treatise is to determine the reliability of redundant systems combining series and parallel connections for branch circuits. The influence of the conditions in which the equipment is used, the type of failure and the level of stress, is taken into consideration. The results obtained are applied in accordance with the intended period of use. MICROELECTRONICS---GENERAL
Advances in linear monolithic circuit technology. R. A. MAMMANO,Solid St. Technol., March (1968), p. 31. The recent large growth in linear integrated circuit sales has established the "arrival" of this technology; however, its acceptance has not been due to the once thought necessary, standardization of linear circuits. It is the fact that the manufacturing process has somewhat standardized, allowing the development of a large number of relatively specialized circuits, that has encouraged the greater part of this growth. The development of the buried layer process and the refinement of component resolutions have done much toward optimizing a process which can be used with relatively little modification to manufacture widely varying circuit types. As a result, circuits ranging from operational and highfrequency video amplifiers to voltage regulator and entertainment types are now available. A monolithic integrated circuit processing laboratory for the electronics industry. H. K. DICKEN, Solid St. Technol., March (1968), p. 47. Design concept, overall plan, implementation, equipment and costs of a typical in-house silicon monolithic, integrated circuit processing laboratory are discussed in detail. Practical as well as theoretical problems of implementation are included. Each step in integrated circuit processing is analyzed so that the laboratory's capabilities will meet their requirements. A scaled layout of the model laboratory is included and explained. It shows work flow and equipment arrangement. Flow charts of the production operation and laboratory organization are included and discussed.