Aluminum nitride as an alternative ceramic for fabrication of microchannel heat exchangers: A numerical study

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Aluminum nitride as an alternative ceramic for fabrication of microchannel heat exchangers: A numerical study Mehdi Fattahia, Kourosh Vaferib, Mohammad Vajdib, Farhad Sadegh Moghanloub,∗∗, Abbas Sabahi Naminic,d, Mehdi Shahedi Aslb,∗ a

Institute of Research and Development, Duy Tan University, Da Nang, 550000, Viet Nam Department of Mechanical Engineering, University of Mohaghegh Ardabili, Ardabil, Iran c Department of Engineering Sciences, Faculty of Advanced Technologies, University of Mohaghegh Ardabili, Namin, Iran d Department of Engineering Sciences, Faculty of Advanced Technologies, Sabalan University of Advanced Technologies(SUAT), Namin, Iran b

A R T I C LE I N FO

A B S T R A C T

Keywords: Heat exchanger Aluminum nitride Advanced ceramics Heat transfer Numerical method

Advances in micro electro mechanical systems (MEMS) necessitate utilizing efficient types of materials which are capable of dissipating high heat transfer rates. Aluminum nitride (AlN) as a member of advanced ceramics family, offers remarkable thermal conductivity which makes it suitable candidate in manufacturing of special and high-tech heat exchangers. The present work aims to investigate the application of a micro-sized heat exchanger made of AlN. According to the performed numerical simulations using Comsol Multiphysics, AlN made heat exchanger showed remarkable heat transfer enhancement of 59%, compared to the Al2O3 made one. Such a considerable improvement can be attributed to the higher thermal conductivity of AlN in comparison with Al2O3. The effectiveness of the heat exchangers were calculated for both AlN and Al2O3 made heat exchangers, and a 26% improvement was observed using aluminum nitride.

1. Introduction Heat exchangers are an essential part of power plants, refrigeration systems, and petrochemical units. A compact heat exchanger (CHE) is a specialized form of heat exchangers, which is defined by its high area density [1]. These devices are used widely because of their relatively large heat transfer surface area to occupied volume. Plate heat exchangers (PHE) as an efficient type of compact heat exchangers can be used in different industries such as pharmaceutical and food industries [2]. They provide numerous advantages, including lower costs, compact size, and high efficiencies. Moreover, plate heat exchangers are expandable, which makes it possible to add new plates to the device instead of buying another heat exchanger. Growing demands for energy, economical use of materials, space limitations, and ease of unit control have led to use of renewable energies [3–5] and fabrication of miniaturized and lightweight heat exchangers [6]. These types of devices are capable of providing higher heat transfer rates in small spaces. Micro-electro-mechanical systems (MEMS), as a branch of miniaturization, are applied in various products such as automotive [7–10], smartphones, wearing devices and biomechanics [11,12]. Micro heat exchangers are known as one of the

∗

essential parts of the MEMS and provide remarkable heat transfer enhancement in fluidics systems [6,13,14]. Microchannel heat exchangers (MCHE) have applications in many industries, such as aerospace, microelectronics cooling, robotics, biomedical processes, metrology, and automotive [15–17]. The first compact water-cooled microchannel heat sink was fabricated by Tuckerman and Pease [18]. They investigated the influence of using silicon wafers on thermal performance and heat transfer coefficient by its thermal resistance. At the heat flux of 790 W/ cm2, the maximum temperature of the water was achieved about 71 °C was detected [14,19]. Kermani et al. [20] tested a new form of a multiple-microchannel heat sink to cool silicon solar cells. They could absorb a heat flux of 75 W/cm2 at lower pressure drop compared to other types of microchannels. Arie et al. [21] worked on a multifold microchannel plate heat exchanger to determine the designing parameters, which can optimize the efficiency and performance of the heat exchangers. They realized that the heat transfer performance of an optimized multiplemicrochannel heat exchanger is higher than the chevron plate heat exchanger. Since the conventional heat exchangers mostly fabricated by metal and metal alloys, their performance has been limited at high

Corresponding author. Corresponding author. E-mail addresses: [email protected] (F. Sadegh Moghanlou), [email protected] (M. Shahedi Asl).

∗∗

https://doi.org/10.1016/j.ceramint.2020.01.195 Received 28 December 2019; Received in revised form 18 January 2020; Accepted 19 January 2020 0272-8842/ © 2020 Elsevier Ltd and Techna Group S.r.l. All rights reserved.

Please cite this article as: Mehdi Fattahi, et al., Ceramics International, https://doi.org/10.1016/j.ceramint.2020.01.195

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Fig. 1. The thermal diffusivity and specific heat of AlN [99,100].

Fig. 2. Thermal conductivity vs. temperature [14,87,88].

also reported a 9% enhancement by optimizing the mentioned parameters. Nagarajan et al. [50] studied a ceramic plate-fin heat exchanger fabricated by silicon carbide (SiC). In their research, nine different fin geometries were examined, and the ripsaw fin showed better heat transfer performance. Nekahi et al. [14] investigated the thermal performance of a microchannel plate heat exchanger constructed by TiB2–SiC and TiB2–SiC doped carbon nanofibers (TiB2–SiC–Cf) materials. They reported a heat transfer enhancement of 15.7% and 15.5% utilizing TiB2–SiC and TiB2–SiC–Cf compared to Al2O3, respectively. A study on a compact silicon carbide heat exchanger, which is used in hydrogen production, has been carried out by Ponyavin et al. [51]. The feasibility of promoting the productivity of the device in the Sulfur Iodine thermochemical cycle was investigated. They applied thermal and pressure loads in order to evaluate the related stresses. It was concluded that decreasing the mass flow rate of reactants, and

temperatures, especially up to 800 °C [14,22–28]. Ceramic materials can be a suitable alternative for metals in these cases [29–39]. These groups of materials provide excellent stability at high temperatures and experience negligible deformation. For instance, aluminum begins to melt at temperature about 660 °C, whereas advanced ceramics like alumina melts at temperatures higher than 2000 °C. On the other hand, ceramics are more stable in corrosive media [40–48]. Carman et al. [49] investigated the influence of utilizing a microchannel heat exchanger made of a ceramic material on a micro turbine. They proposed silicon carbon nitride (SiCN) ceramics, as a stable material at temperatures up to 1300 °C, in a combustion gases media. Fluid channels with equilateral triangle and square cross-sections were selected to investigate, and it was reported that for the same volume, the equilateral triangle cross-section indicated higher thermal performance. The results showed that the type of geometry, fabrication method, and material selection had a direct effect on the thermal performance. They

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Table 1 Geometry of the counter-flow microchannel plate heat exchanger based on Ref. [98].

Number of passes Number of channels Total number of channels Channel length (mm) Channel width (μm) Channel height (μm) Wall thickness (μm) Layer thickness (μm)

Cold flow

Hot flow

3 17 51 12.5 250 420 520 880

3 17 51 12.5 250 320 520 990

conditions, especially thermal shock [45,53–62]. However, advanced ceramics such as ZrB2 [63–77], TiB2 [78–82], HfB2 possess high thermal conductivities as well as remarkable mechanical properties [29,83–86]. Aluminum nitride (AlN) as a family of advanced ceramics, offers significant thermal conductivities. The high the thermal conductivity, the more uniform temperature distribution. Higher thermal conductivity of the AlN decreases the danger of undesirable thermal gradients, and consequently the material fracture. Beside high thermal conductivity of AlN, it presents particular specifications such as good hardness (17.7 GPa), high melting point (2700 K), and excellent elastic modulus (310 GPa) [87–93]. These interesting characteristics make AlN a suitable material to use in power microelectronic applications [94,95]. The thermal properties of AlN are given in Figs. 1 and 2. The primary purpose of the current research is to investigate the thermal performance of a counter-flow microchannel plate heat exchanger. By optimizing the performance of these devices, the better utilization of energy in conjunction with diminish in volume and weight of the heat exchanger can be achieved. Because of the high thermal conductivity of AlN and its ability to withstand higher temperatures, it is suggested to use AlN ceramic as the material of the heat exchanger. The influence of using this material on heat transfer rate, and thermal efficiency is examined. The designed heat exchanger is simulated numerically by COMSOL Multiphysics software. numerical methods are reliable and cost effective in modeling and optimizing the thermal and mechanical systems [96,97].Computational Fluid Dynamics (CFD) with the presented operating conditions in Ref. [98] is used as a simulation method to evaluate the heat transfer performance of the heat exchanger.

Fig. 3. Two-dimensional view of the plate heat exchanger.

2. The geometry of heat exchanger A microchannel plate heat exchanger with three passes for each hot and cold flows was considered for simulations. A three dimensional view of the investigated heat exchanger with its flow directions is shown in Fig. 3. Once the fluids enter the device, distribute into three plates. Every plate contains 17 microchannels with a rectangular crosssection. The wall between the channels has a thickness of 520 μm together with a length of 12.5 mm, as shown in Fig. 4. Moreover, Table 1 presents the detailed geometric dimensions of the heat exchanger. Symmetry condition in the shape of the heat exchanger makes it possible to simulate only a properly selected part of the heat exchanger instead of the whole geometry. This method reduces the time of the simulation. The selected part is demonstrated in detail in Fig. 5.

Fig. 4. The dimensions of channel.

enhancing the operating pressure resulted in decomposition improvement. Monterio and de Mello [22] evaluated the thermal efficiency and pressure drop in a plate-fin heat exchanger with plates made of alumina (Al2O3). They reported that increasing the mass flow rate increases the pressure drop and, consequently, decreases the effectiveness of the device. The applied material for the fabrication of heat exchangers is at the first level of importance. Ceramics generally have weak thermal conductivities [52]. On the other hand, low thermal expansion of these materials confine their application in the case of high thermal stress

3. Governing equations and numerical method Two types of governing equations are necessary to describe the fluid behavior and heat transfer of the heat exchanger. The equations related to fluid flow are: The conservation of mass equation:

∇. u = 0 The Navier-Stokes equation for fluid flow: 3

(1)

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Fig. 5. The selected part of the domain for simulation.

exchanger consists of fluid and solid domains; therefore, heat transfer should be investigated in both solid and fluid domains. The heat transfer process in the solid domain is considered pure conduction, whereas, in the fluid domain, both conduction and convection heat transfer methods were applied [14]. The heat transfer in the ceramic domain is as:

Table 2 Inlet of fluids Conditions as Ref. [98].

Mass flow rate (kg/h) Temperature (°C) Pressure (atm)

Cold flow inlet

Hot flow inlet

20.4–120.3 12.5 1

21.0–120.8 90 1

∇ (k . ∇T ) = 0 2 ρ (u. ∇) u = −∇p + ∇ . ⎛μ (∇u + (∇u)T ) − μ (∇u) I ⎞ 3 ⎝ ⎠

The thermal efficiency of the heat exchanger's is defined by a dimensionless parameter, which is called effectiveness, and is the ratio of actual heat transfer to maximum possible value. The effectiveness is calculated by:

(2)

in these equations, ρ (kg / m3) , μ (kg / m . s ) , u (m / s ) and P (Pa) are the density, dynamic viscosity, velocity, and pressure of the fluid, respectively. Solving Eqs. (1) and (2) simultaneously, gives the velocity and pressure of the fluid at each point. To obtain the temperature distribution in the fluids, it is needed to solve the conservation of energy equation, which is as:

ρcp (u. ∇) T = k∇2 T

(4)

ε=

q qmax

(5)

where q (J / s ) and qmax are allocated to actual and the maximum possible heat transfer, respectively and are given as [98]:

(3)

where cp (J / kg . K ) represents the heat capacity and k (W / m . K ) is the thermal conductivity of the material. The geometry of the heat

˙ pc (Tci − Tco) = mc ˙ pw (Two − Twi ) q = mc

(6)

qmax = min(m˙ c cpc ; m˙ w cpw )(Tci − Twi )

(7)

Fig. 6. Computational domain mesh. 4

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Fig. 7. The comparison between obtained values for outlet temperatures with reported values in Ref. [98].

Fig. 8. The obtained results of cold flow outlet temperatures at different mass flow rates.

in these equations, m˙ (kg / s ) represents the mass flow rate of fluids, and cp is the specific heat capacity of fluids. The subscripts of c and w are used to show the cold and warm flows, respectively. Besides, Tci (K ) , Tco , Twi and Two are allocated to the inlet and outlet temperatures of the cold and hot fluids, respectively [98,101]. In heat exchangers field of study, ˙ p , is called minimum fluid. the fluid with lower value of mc Calculating for minimum fluid, the effectiveness can be calculated as [98]:

ε=

Tci − Tco T − Twi = wo Tci − Twi Tci − Twi

atmospheric condition. The simulation and analysis are performed at steady-state condition. The properties of the working fluid (water), in particular, the thermal conductivity are considered temperature-dependent. The computational domain of the channel, which is shown in Fig. 6, was meshed by mapped and triangular elements, respectively. In order to show the mesh independency, several mesh sizes were investigated, and finally, the mesh independency was attained by 168750 elements for simulated geometry.

(8) 4. Model validation

The heat exchanger is initially at ambient temperature. The boundary conditions at the inlets of both fluids are given in Table 2. For the outlet boundary condition, the pressure of both fluids considered in

The numerical results were validated by the experimental data of Alm et al. [98]. They manufactured and tested a microchannel plate 5

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Fig. 9. The obtained results of hot flow outlet temperatures at different mass flow rates.

Fig. 10. The temperature contours of the whole simulated geometry for (a) AlN, (b) Al2O3, and (c) TiB2–SiC.

Fig. 11. The temperature contours of the fluid flow in (a) AlN, (b) Al2O3, and (c) TiB2–SiC heat exchangers.

5. Results and discussion

heat exchanger by Al2O3 ceramic. The comparison between the numerical simulation and experimental data is shown in Fig. 7, which depicts outlet temperatures for hot and cold flows at several mass flow rates. The close agreement between results shows the validity of the numerical method; therefore, this procedure can be developed to the same heat exchanger made by AlN material.

The present work deals with the heat transfer and fluid flow simulation in a microchannel plate heat exchanger made of Aluminium nitride (AlN). Same as the operating conditions of the study conducted by Alm et al. [98], water is considered as the flowing fluid from hot and cold passages. In the next step, the thermal performance of the microchannel plate heat exchanger made of AlN was investigated numerically, and the 6

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Fig. 12. The temperature contours of the simulated geometry from the inlet side of the cold fluid for (a) AlN, (b) Al2O3, and (c) TiB2–SiC.

Fig. 13. The temperature contours of the simulated geometry from the inlet side of the hot fluid for (a) AlN, (b) Al2O3, and (c) TiB2–SiC.

Fig. 14. The obtained results of heat transfer rate at different mass flow rates.

hot fluid flow is observable. According to Fig. 2, AlN possesses higher thermal conductivities than Al2O3. This discrepancy between the thermal conductivities of two materials is the main reason for the better thermal performance of AlN made heat exchanger. Therefore, using AlN as the heat exchanger material results in more heat absorption from hot flow and as a sequence the lower temperature at the outlet.

results were compared with the obtained data for Al2O3. In Fig. 8 and Fig. 9, the cold and hot outlet temperatures for heat exchangers made of AlN and Al2O3 are shown, respectively. The higher thermal conductivity of AlN increases the heat transfer from hot side to cold stream, and as a result, the cold flow experiences more temperature raise. On the other hand, in comparison with Al2O3, more temperature drop in 7

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Fig. 15. The effectiveness results at different mass flow rates.

(120 kg/h). At different mass flow rates, the effectiveness values of heat exchangers made of AlN and Al2O3 were calculated and compared in Fig. 15. It is obvious that, the utilization of AlN has increased the efficiency of the heat exchanger compared to Al2O3. For example, at the mass flow rate of 20.4 kg/h, the effectiveness values of 26% and 19% obtained for heat exchangers made by AlN and Al2O3, respectively. Besides, increasing the mass flow rate causes a reduction in the effectiveness of both heat exchangers. Again, the higher thermal conductivity of AlN is the main reason for the heat transfer enhancement compared to Al2O3.

Comparison of the obtained data for AlN with authors previous work in Ref. [14], shows the better performance of Aluminum Nitride against TiB2–SiC and TiB2–SiC–Cf made heat exchangers. As it is reported by Nekahi et al. [14,102], heat transfer rate in the heat exchangers made by TiB2–SiC and TiB2–SiC–Cf is almost identical (about 15.5% enhancement compared to alumina), and the addition of carbon fiber as dopant, showed no significant effect on heat transfer. However, using AlN, a 25% enhancement compared to by TiB2–SiC and TiB2–SiC–Cf made heat exchanger was observed. The temperature contours of the micro heat exchanger with three different materials are shown in. Fig. 10. In addition, Fig. 11 demonstrates the temperature contours of the passing fluids through the channels of the heat exchanger. It can be seen that the AlN made heat exchanger results in more uniform temperature distribution compared to other materials. This is a result of higher thermal conductivity of AlN, which allows easier heat dissipation in the whole heat exchanger. The worst temperature distribution comes back to Al2O3 made device. Since Alumina has lower thermal conductivity, zones with less uniformity in temperature distribution is observable. Less uniformity in temperature distribution corresponds to higher thermal stresses. Undesirable thermal stresses may be harmful and result in crack distribution in ceramic material. The highest thermal gradient in heat exchanger occurs in the inlet and outlet regions. The cold flow inlet surface is shown in Fig. 12. At this region, the cold fluid has its lowest temperature. The other place with high temperature difference is inlet zone of hot fluid, which is shown in (Fig. 13). It can be seen that at both these figures, the AlN made heat exchanger shows more uniform contours. The higher thermal conductivity of AlN makes it possible rapid heat transfer between the cold and hot regions. The reduced thermal gradient at these regions decrease the danger of crack propagation in the heat exchanger. Fig. 14 shows the heat transfer comparison between heat exchangers made of AlN and Al2O3 ceramics at different mass flow rates. It is clear that, as the mass flow rate raises, the difference between the heat transfer rates of devices made of AlN and Al2O3 increases. This means that at higher mass flow rates, the heat exchanger made of AlN shows better performance than the one made of Al2O3. For instance, at mass flow rate of 20.4 kg/h, an enhancement of 36% is obtained for the heat exchanger made of AlN compared to Al2O3. This betterment in the heat transfer rate is about 59% for the highest applied mass flow rate

6. Conclusions The application of aluminum nitride as an advanced ceramic to fabricate a micro heat exchanger was investigated numerically. The governing equations were solved numerically utilizing the finite element method. Temperature distribution for hot and cold fluids was obtained, and the results were compared with experimental data of Al2O3 made heat exchanger. In all mass flow rates, the AlN made heat exchanger showed better heat transfer rate compared than that made of Al2O3. A considerable heat transfer enhancement of 59% was observed for the AlN made heat exchanger compared toAl2O3. The higher thermal conductivity of AlN compared to the Al2O3 is the main reason for this remarkable heat transfer enhancement. The effectiveness of both heat exchangers were calculated and compared. The results showed that, fabricating the heat exchanger made of AlN showed a maximum value of 26% enhancement in effectiveness. By increasing the mass flow rates, heat transfer enhancement by application of AlN compared to Al2O3 is slightly increased. Declaration of competing interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper. References [1] B. Zohuri, Compact heat exchangers design for the process industry, Compact Heat Exch. Springer International Publishing, Cham, 2017, pp. 57–185, , https://doi.

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