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Are components still the major problem: a review of electronic system and device field failure returns
Microelectron. Reliab.,Vol. 34, No. 8, pp. 1409-1430, 1994 Copyright © 1994 ElsevierScienceLtd Printed in Great Britain. All rights reserved 0026-2714/94 $7.00 + .00
Pergamon
WORLD ABSTRACTS ON MICROELECTRONICS A N D RELIABILITY Abstract--The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects 1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability~General. Reliability of Components, Tubes, Transistors and ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Microelectronics--General. Microelectronics--Design and Construction. Microelectronics--Components, Systems and Equipment. Semiconductor Integrated Circuits, Devices and Materials. Thick- and Thin-Film Components, Hybrid Circuits and Materials. Electron, Ion and Laser Beam Techniques.
1. RELIABILITY--GENERAL
The inventory replenishment problem with a linear trend in demand. MONCER HARIGA. Computers and Industrial Engineering, 24(2), 143 (1993). This paper relaxes the restrictive assumption of constant demand rate that is often used in the inventory economic order quantity model. The paper also proposes a simple fixed-horizon algorithm for the inventory replenishment problem with a linear trend in demand. The algorithm is based on an iterative numerical procedure that generates the optimal replenishment schedule for both growing and declining markets. Two numerical examples from the literature are included to illustrate the algorithm.
Are components still the major problem: a review of electronic system and device field failure returns. MICHAEL PECHT and VIJAY RAMAPPAN. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15(6), 1160 (1992). This paper presents a collection of electronic system and device (component) failure data from various sources over the last 20 years. Categories of failures are illustrated by means of pie charts. Issues of data collection and confusions in the definitions of failure mechanisms, failure sites, and stages of failure occurrence (design, manufacturing, testing) are discussed. The most recent data are then evaluated, the contribution of the inherent component failures to the system failures is analyzed, and conclusions of significance to the industry are discussed.
Two new replacement policies. NADER EBRAHIMI. IEEE Transactions on Reliability, 42(1), 141 (1993). This paper investigates two new replacement policies which can be used in deciding whether one should
replace or repair a system: • a local policy wherein a decision is made based on average life-time (or life-time) per unit cost of repair; • a global policy. Mathematical properties of these policies are developed and some examples show that the two policies can yield different decisions under the same circumstances.
Mechanical design failure models for buckling. ABHIJIT DASGUPTA and HENRY W. HASLACH JR, IEEE Transactions on Reliability, 42(1), 9 (1993). This tutorial illustrates design situations where elastic buckling of slender columns and thin plates under compressive loads can result in large deformations and eventual failure of the structure. This is a classic example of an overstress failure mechanism, and analytic methods, based on continuum mechanics principles, are presented to design against such failures. Examples illustrate the use of these models in practical design situations in mechanical engineering and electronic packaging applications. Material nonlinearities and geometric nonlinearities due to initial imperfections can reduce the critical buckling stress, and generally require numerical solutions. The design equations are based on energy stability principles and can be implemented in an engineering design environment. This is an overstress mechanical design failure mechanism. Like excessive elastic deformations, this mechanism is not in itself a material failure mechanism, but can eventually lead to overstress material failure due to large deformation.
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Pergamon
WORLD ABSTRACTS ON MICROELECTRONICS A N D RELIABILITY Abstract--The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections.
Subjects 1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability~General. Reliability of Components, Tubes, Transistors and ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Microelectronics--General. Microelectronics--Design and Construction. Microelectronics--Components, Systems and Equipment. Semiconductor Integrated Circuits, Devices and Materials. Thick- and Thin-Film Components, Hybrid Circuits and Materials. Electron, Ion and Laser Beam Techniques.
1. RELIABILITY--GENERAL
The inventory replenishment problem with a linear trend in demand. MONCER HARIGA. Computers and Industrial Engineering, 24(2), 143 (1993). This paper relaxes the restrictive assumption of constant demand rate that is often used in the inventory economic order quantity model. The paper also proposes a simple fixed-horizon algorithm for the inventory replenishment problem with a linear trend in demand. The algorithm is based on an iterative numerical procedure that generates the optimal replenishment schedule for both growing and declining markets. Two numerical examples from the literature are included to illustrate the algorithm.
Are components still the major problem: a review of electronic system and device field failure returns. MICHAEL PECHT and VIJAY RAMAPPAN. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15(6), 1160 (1992). This paper presents a collection of electronic system and device (component) failure data from various sources over the last 20 years. Categories of failures are illustrated by means of pie charts. Issues of data collection and confusions in the definitions of failure mechanisms, failure sites, and stages of failure occurrence (design, manufacturing, testing) are discussed. The most recent data are then evaluated, the contribution of the inherent component failures to the system failures is analyzed, and conclusions of significance to the industry are discussed.
Two new replacement policies. NADER EBRAHIMI. IEEE Transactions on Reliability, 42(1), 141 (1993). This paper investigates two new replacement policies which can be used in deciding whether one should
replace or repair a system: • a local policy wherein a decision is made based on average life-time (or life-time) per unit cost of repair; • a global policy. Mathematical properties of these policies are developed and some examples show that the two policies can yield different decisions under the same circumstances.
Mechanical design failure models for buckling. ABHIJIT DASGUPTA and HENRY W. HASLACH JR, IEEE Transactions on Reliability, 42(1), 9 (1993). This tutorial illustrates design situations where elastic buckling of slender columns and thin plates under compressive loads can result in large deformations and eventual failure of the structure. This is a classic example of an overstress failure mechanism, and analytic methods, based on continuum mechanics principles, are presented to design against such failures. Examples illustrate the use of these models in practical design situations in mechanical engineering and electronic packaging applications. Material nonlinearities and geometric nonlinearities due to initial imperfections can reduce the critical buckling stress, and generally require numerical solutions. The design equations are based on energy stability principles and can be implemented in an engineering design environment. This is an overstress mechanical design failure mechanism. Like excessive elastic deformations, this mechanism is not in itself a material failure mechanism, but can eventually lead to overstress material failure due to large deformation.
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