- Email: [email protected]
Author index volume 24
Microelectronic Elsevier
Engineering
Author Anderson,
R.E.,
437
24 (1994) 437-441
Index Volume 24
see Campbell,
11-22
A.N.
Balk, L.J., see Maywald, M. Barr& M., see Marc, F. Batin%, M., see Helmreich, K. Baur, G., R. Hofmann, G. Solkner and H.-J. Pfleiderer, High voltage resolution with a laser diode based electro-optic measurement system Bergner, H., see Hempel, K. Bloom, D.M., Voltage-contrast scanning probe microscopy BGhm, Ch., Ch. Roths and E. Kubalek, Scanning-force-microscope test system for device internal test with high spatial and temporal resolution Born, Ch., see Persch, G. Brunner, M., R. Schmid, R. Schmitt, M. Sturm and 0. Gessner, Contactless testing of multi-chip modules Brunner, M., see Schmitt, R.
99-106 295-301 71-80
Cabestany, J., see Madrenas, J. Campbell, A.N., E.1. Cole, Jr., B.A. Dodd and R.E. Anderson, Magnetic force microscopy/current contrast imaging: A new technique for internal current probing of ICs Casey, Jr., J.D., A.F. Doyle, R.G. Lee, D.K. Stewart and H. Zimmermann, Gas-assisted etching with focused ion beam technology Chan, D.S.H., see Sim, K.S. Chiorboli, G., see Corsi, F. Claeys, W., S. Dilhaire and V. Quintard, Laser probing of thermal behaviour of electronic components and its application in quality and reliability testing Cole, Jr., E.I., see Campbell, A.N. Corsi, F., G. Chiorboli, D. De Venuto, C. Morandi and G.V. Portacci, Enhancing the time resolution of an EBT system via the primary electron pulse shape measurement Courtade, F., see Perdu, P.
147-154
Danto, Y., see Marc, F. David, G., S. Redlich, W. Mertin, E. Kubalek and D. Jager, dimensional field mapping in coplanar MMIC components direct electro-optic probing David, G., see Jager, D. David, G., see Mertin, W.
393-400 401-408 3-9
91-98 113-121 61-70 35-42
11-22
43-50 249-256 241-247
41 l-420 11-22
241-247 171-177 295-301
Twousing 385-391 327-339 377-384
43x
Author
index
David, G., see Tacnzler. F. De Kort, K., The role of internal waveform measurements in IC development De Kort, K., J.M. Luchies and J.J. Vrehen, The transient behaviour of an input protection De Venuto, D., see Corsi. F. Dilhaire, S., see Claeys, W. Dinnis, A.R., Voltage measurements using the time-of-flight electron spectrometer Dodd, B.A., see Campbell, A.N. Doyle, A.F., see Casey, Jr., J.D. Dupire, M., see Perdu P. Fitting, H.-J., see Hingst. Th. Fixl, A.J. and K.A. Jenkins, Laser-stimulated beam prober for 15 ps resolution waveform Franz, R., see Hingst, Th. Fremont, H., see Marc, F.
123-130 365-376 355-362 241-247 4 1 I-420 133-138 11-22 43-50 163-170 181-188
photocathode measurements
electron
Gessner, O., see Brunner, M., Goldstein, M., G. Solkner and E. Gornik, Heterodyn interferometer for the detection of electric and thermal signals in integrated circuits through the substrate Gornik, E., J. Smoliner and V. RoBkopf, Electrical and optical characterization of nanostructures Gornik, E., see Goldstein, M. Gruning, T., see Heinitz, M. Haverkort, J.E.M., P. Hendriks, E.A.E. Zwaal and J.H. Wolter. Time-resolved OBIC for probing current filamentation in GaAsi Al,Ga,.,As heterostructures Heiland, R. and A. Leslie, Combining electron and focused ion beam techniques for failure analysis and design verification of integrated circuits Heinitz, M. and T. G&ring. Generation of inherently periodical test patterns for the e-beam test of scan-based designs Helmreich, K., W. Wolz and M. Batinid, An optimized electron beam deflection assembly Hempel, K. and H. Bergner, Time-resolved investigations on n-MOS devices by capacitive coupling in a laser scanning microscope Hendriks, P., see Haverkort. J.E.M. Hingst, Th., M. Hiibner, R. Franz, J.-Ch. Kuhr and H.-J. Fitting, High-field EBIC by computer controlling Hofmann, R., see Baur, G. Holm, A.. G. Solkner, W. Ruile and R. Weigel, Optical measurement system for the determination of acoustic phase velocities with high accuracy Hiibner, M., see Hingst, Th.
81-88 181-188 295-301 61-70
43 l-436 305-315 43 l-436 279-286
203-209
51-58 279-286 71-80 401-408 203-209 181-188 393-400
317-323 181-188
Author Index
Ito, A., see Okubo,
439
271-278
K.
JHger, D., G. David and W. von Wendorff, Fundamentals of optical beam testing Jager, D., see David, G. JHger, D., see Mertin, W. Jager, D., see Taenzler, F. Jakubowicz, A. and A. Oosenbrug, SEM/EBIC characterization of degradation at mirrors of GaAsiAlGaAs laser diodes Jank, A., M. Jung and H. Schmoranzer, Application of electronbeam testing technique to potential profile measurements in thin film semiconductor devices Jenkins, K.A., see Fixl, A.J. Jounet, P., see Marc, F. Jung, M., see Jank, A.
139-146 81-88 295-301 139-146
Kassing, R., see Oesterschulze, Kovic, J., see Satka. A. Kubalek, E., see Biihm, Ch. Kubalek, E., see David, G. Kubalek, E., see Mertin, W. Kubalek, E., see Schottler, M. Kubalek, E., see Taenzler, F. Kuhr, J.-Ch., see Hingst, Th.
107-112 195-201 91-98 385-391 377-384 233-240 123-130 181-188
E
Lackmann, R., see Wieberneit, M. Lee, R.G., see Casey, Jr., J.D. Leslie, A., see Heiland, R. Leyk, A., see Mertin, W. Luchies, J.M., see De Kort, K. Madrenas, J. and J. Cabestany, Primary beam address error reduction in e-beam testing of packaged integrated circuits Marc, F., H. Fremont, P. Jounet, Y. Danto and M. Barre, Functional localization in integrated circuits by signal selective voltage contrast in a scanning electron microscope Maywald, M., R.E. Stephan and L.J. Balk, Evaluation of an epitaxial layer structure by lateral force and contact current measurements in a scanning force microscope Mertin, W., A. Leyk, F. Taenzler, T. Novak, G. David, D. Jager and E. Kubalek, Characterization of an MMIC by direct and indirect electro-optic sampling and by network analyzer measurements Mertin, W., see David, G. Mertin, W., see Taenzler, F. Morandi, C., see Corsi, F. Miiller-Glaser, K.D. and W. Wolz, Towards higher quality of design and test-Perspectives of EBT tool integration Miiller-Glaser, K.D., see Scharf, R.
327-339 385-391 377-384 123-130 189-194
421-430 43-50 51-58 377-384 355-362
147-154
295-301
99-106
377-384 385-391 123-130 241-247 259-270 155-162
Ng, W.. An integrated electron-beam probing simulation interface and CAD navigation Novak, T.. sw Mertin. W.
environment
with
a 787-3-l 377-383
Oesterschulze, E., M. Stopka and R. Kassing. Photo-thermal characterization of solids and thin films by optical and scanning probe techniques Okuho, K.. H. Teguri and A. Ito, Pattern matching for automated e-beam testing Oosenhrug, A.. see Jakubowicz. A.
107-I I?
Perdu, P. and M. Dupire. Electron beam testing: A comparative study of irradiation effects on 54HCUO4 with passivation. without passivation. and with an ultra-thin carbon layer Perdu, P. and F. Courtade. Sample preparation for electron beam testing: An electrical characterization method to obtain an optimized anti-charge-up carbon layer Persch, G., Ch. Born and B. Utcsch, Nano-hardness invc~tigations of thin films by an atomic force microscope Pfleiderer, H.-J.. set Baur. G. Phang, J.C.H.. see Sim. K.S. Portacci, G.V.. see Corsi. F.
171-177
Quintard,
JI l-420
V.. .sw Clacys.
W
Rao, V.R.M. and A. Saini, Electron tion at Intel Redlich, S.. see David, G. RoRkopf, V.. see Gornik, E. Roths, Ch.. see BZihm, Ch. Ruile, W.. sw Helm. A. Russell, P.E., see Vitarelli. J.
beam probing
it3.3-170
for design veritic:b-
Saini, A.. see Rao. V.R.M. Satka, A. and J. Kov&Z. Time-resolved OBIC‘IEBIC mapping in InGaAsPi InP photodiodes Scharf, R.. W. Wolz. K.D. Mtiller-Glaser and D. Seitzcr. Reliable EBT fine positioning using correlation-based window adjustment Schmid, R.. see Brunner. M. Schmitt, R.. M. Brunner and D. Winkler, Electron beam testing ot flat panel display substrates Schmitt, R.. see Brunner. M. Schmoranzer, H., see Jank, A. Schiittler, M.. C. Traub and E. Kubalek. Crosstalk cffcct in electron beam testing: Simulations and measurements Seitzer, D.. see Scharf, R. Sim, K.S.. D.S.H. Chan and J.C.H. Phang, Investigation of capacitive coupling voltage contrast using a specimen charging model Smoliner, J., see Gornik, E.
75-34 195-201
233-240 155 163
Author Index
Solkner, G., Optical beam testing device characterization Solkner, G., see Baur, G. Solkner, G., see Goldstein, M. Solkner, G., see Holm, A. Stephan, R.E., see Maywald, M. Stewart, D.K., see Casey, Jr., J.D. Stopka, M., see Oesterschulze, E. Sturm, M.. see Brunner, M.,
and
its potential
441
for electronic 341-353 393-400 431-436 317-323 99-106 43-50 107-112 61-70
Taenzler, F., W. Mertin, G. David, D. Jager and E. Kubalek, Experimental characterization of the perturbations of microwave devices by the electro-optic probe tip Taenzler, F., see Mertin, W. Teguri, H., see Okubo, K. Trauh, C., see Schottler, M.
123-130 377-384 271-278 233-240
Utesch,
113-121
B., see Persch.
G.
Verguin, P., Liquid crystals in failure analysis today Vitarelli, J. and P.E. Russell, Time delay measurements ventional e-beam technology Von Wendorff, W., see Jager, D. Vrehen, J.J., see De Kort, K.
211-218 using
con221-232 327-339 355-362
Weigel, R., see Holm, A. Wieberneit, M. and R. Lackmann, New results of field-induced deformation of nematic liquid crystals for testing of digital integrated circuits Winkler, D.. see Schmitt, R. Wolter, J.H., see Haverkort, J.E.M. Wolz, W., see Helmreich, K. Wolz, W., see Muller-Glaser, K.D. Wolz, W.. see Scharf, R.
421-430 35-42 203-209 71-80 259-270 155-162
Zimmermann, H., see Casey, Zwaal, E.A.E., see Haverkort.
43-50 203-209
Jr., J.D. J.E.M.
317-323
Engineering
Author Anderson,
R.E.,
437
24 (1994) 437-441
Index Volume 24
see Campbell,
11-22
A.N.
Balk, L.J., see Maywald, M. Barr& M., see Marc, F. Batin%, M., see Helmreich, K. Baur, G., R. Hofmann, G. Solkner and H.-J. Pfleiderer, High voltage resolution with a laser diode based electro-optic measurement system Bergner, H., see Hempel, K. Bloom, D.M., Voltage-contrast scanning probe microscopy BGhm, Ch., Ch. Roths and E. Kubalek, Scanning-force-microscope test system for device internal test with high spatial and temporal resolution Born, Ch., see Persch, G. Brunner, M., R. Schmid, R. Schmitt, M. Sturm and 0. Gessner, Contactless testing of multi-chip modules Brunner, M., see Schmitt, R.
99-106 295-301 71-80
Cabestany, J., see Madrenas, J. Campbell, A.N., E.1. Cole, Jr., B.A. Dodd and R.E. Anderson, Magnetic force microscopy/current contrast imaging: A new technique for internal current probing of ICs Casey, Jr., J.D., A.F. Doyle, R.G. Lee, D.K. Stewart and H. Zimmermann, Gas-assisted etching with focused ion beam technology Chan, D.S.H., see Sim, K.S. Chiorboli, G., see Corsi, F. Claeys, W., S. Dilhaire and V. Quintard, Laser probing of thermal behaviour of electronic components and its application in quality and reliability testing Cole, Jr., E.I., see Campbell, A.N. Corsi, F., G. Chiorboli, D. De Venuto, C. Morandi and G.V. Portacci, Enhancing the time resolution of an EBT system via the primary electron pulse shape measurement Courtade, F., see Perdu, P.
147-154
Danto, Y., see Marc, F. David, G., S. Redlich, W. Mertin, E. Kubalek and D. Jager, dimensional field mapping in coplanar MMIC components direct electro-optic probing David, G., see Jager, D. David, G., see Mertin, W.
393-400 401-408 3-9
91-98 113-121 61-70 35-42
11-22
43-50 249-256 241-247
41 l-420 11-22
241-247 171-177 295-301
Twousing 385-391 327-339 377-384
43x
Author
index
David, G., see Tacnzler. F. De Kort, K., The role of internal waveform measurements in IC development De Kort, K., J.M. Luchies and J.J. Vrehen, The transient behaviour of an input protection De Venuto, D., see Corsi. F. Dilhaire, S., see Claeys, W. Dinnis, A.R., Voltage measurements using the time-of-flight electron spectrometer Dodd, B.A., see Campbell, A.N. Doyle, A.F., see Casey, Jr., J.D. Dupire, M., see Perdu P. Fitting, H.-J., see Hingst. Th. Fixl, A.J. and K.A. Jenkins, Laser-stimulated beam prober for 15 ps resolution waveform Franz, R., see Hingst, Th. Fremont, H., see Marc, F.
123-130 365-376 355-362 241-247 4 1 I-420 133-138 11-22 43-50 163-170 181-188
photocathode measurements
electron
Gessner, O., see Brunner, M., Goldstein, M., G. Solkner and E. Gornik, Heterodyn interferometer for the detection of electric and thermal signals in integrated circuits through the substrate Gornik, E., J. Smoliner and V. RoBkopf, Electrical and optical characterization of nanostructures Gornik, E., see Goldstein, M. Gruning, T., see Heinitz, M. Haverkort, J.E.M., P. Hendriks, E.A.E. Zwaal and J.H. Wolter. Time-resolved OBIC for probing current filamentation in GaAsi Al,Ga,.,As heterostructures Heiland, R. and A. Leslie, Combining electron and focused ion beam techniques for failure analysis and design verification of integrated circuits Heinitz, M. and T. G&ring. Generation of inherently periodical test patterns for the e-beam test of scan-based designs Helmreich, K., W. Wolz and M. Batinid, An optimized electron beam deflection assembly Hempel, K. and H. Bergner, Time-resolved investigations on n-MOS devices by capacitive coupling in a laser scanning microscope Hendriks, P., see Haverkort. J.E.M. Hingst, Th., M. Hiibner, R. Franz, J.-Ch. Kuhr and H.-J. Fitting, High-field EBIC by computer controlling Hofmann, R., see Baur, G. Holm, A.. G. Solkner, W. Ruile and R. Weigel, Optical measurement system for the determination of acoustic phase velocities with high accuracy Hiibner, M., see Hingst, Th.
81-88 181-188 295-301 61-70
43 l-436 305-315 43 l-436 279-286
203-209
51-58 279-286 71-80 401-408 203-209 181-188 393-400
317-323 181-188
Author Index
Ito, A., see Okubo,
439
271-278
K.
JHger, D., G. David and W. von Wendorff, Fundamentals of optical beam testing Jager, D., see David, G. JHger, D., see Mertin, W. Jager, D., see Taenzler, F. Jakubowicz, A. and A. Oosenbrug, SEM/EBIC characterization of degradation at mirrors of GaAsiAlGaAs laser diodes Jank, A., M. Jung and H. Schmoranzer, Application of electronbeam testing technique to potential profile measurements in thin film semiconductor devices Jenkins, K.A., see Fixl, A.J. Jounet, P., see Marc, F. Jung, M., see Jank, A.
139-146 81-88 295-301 139-146
Kassing, R., see Oesterschulze, Kovic, J., see Satka. A. Kubalek, E., see Biihm, Ch. Kubalek, E., see David, G. Kubalek, E., see Mertin, W. Kubalek, E., see Schottler, M. Kubalek, E., see Taenzler, F. Kuhr, J.-Ch., see Hingst, Th.
107-112 195-201 91-98 385-391 377-384 233-240 123-130 181-188
E
Lackmann, R., see Wieberneit, M. Lee, R.G., see Casey, Jr., J.D. Leslie, A., see Heiland, R. Leyk, A., see Mertin, W. Luchies, J.M., see De Kort, K. Madrenas, J. and J. Cabestany, Primary beam address error reduction in e-beam testing of packaged integrated circuits Marc, F., H. Fremont, P. Jounet, Y. Danto and M. Barre, Functional localization in integrated circuits by signal selective voltage contrast in a scanning electron microscope Maywald, M., R.E. Stephan and L.J. Balk, Evaluation of an epitaxial layer structure by lateral force and contact current measurements in a scanning force microscope Mertin, W., A. Leyk, F. Taenzler, T. Novak, G. David, D. Jager and E. Kubalek, Characterization of an MMIC by direct and indirect electro-optic sampling and by network analyzer measurements Mertin, W., see David, G. Mertin, W., see Taenzler, F. Morandi, C., see Corsi, F. Miiller-Glaser, K.D. and W. Wolz, Towards higher quality of design and test-Perspectives of EBT tool integration Miiller-Glaser, K.D., see Scharf, R.
327-339 385-391 377-384 123-130 189-194
421-430 43-50 51-58 377-384 355-362
147-154
295-301
99-106
377-384 385-391 123-130 241-247 259-270 155-162
Ng, W.. An integrated electron-beam probing simulation interface and CAD navigation Novak, T.. sw Mertin. W.
environment
with
a 787-3-l 377-383
Oesterschulze, E., M. Stopka and R. Kassing. Photo-thermal characterization of solids and thin films by optical and scanning probe techniques Okuho, K.. H. Teguri and A. Ito, Pattern matching for automated e-beam testing Oosenhrug, A.. see Jakubowicz. A.
107-I I?
Perdu, P. and M. Dupire. Electron beam testing: A comparative study of irradiation effects on 54HCUO4 with passivation. without passivation. and with an ultra-thin carbon layer Perdu, P. and F. Courtade. Sample preparation for electron beam testing: An electrical characterization method to obtain an optimized anti-charge-up carbon layer Persch, G., Ch. Born and B. Utcsch, Nano-hardness invc~tigations of thin films by an atomic force microscope Pfleiderer, H.-J.. set Baur. G. Phang, J.C.H.. see Sim. K.S. Portacci, G.V.. see Corsi. F.
171-177
Quintard,
JI l-420
V.. .sw Clacys.
W
Rao, V.R.M. and A. Saini, Electron tion at Intel Redlich, S.. see David, G. RoRkopf, V.. see Gornik, E. Roths, Ch.. see BZihm, Ch. Ruile, W.. sw Helm. A. Russell, P.E., see Vitarelli. J.
beam probing
it3.3-170
for design veritic:b-
Saini, A.. see Rao. V.R.M. Satka, A. and J. Kov&Z. Time-resolved OBIC‘IEBIC mapping in InGaAsPi InP photodiodes Scharf, R.. W. Wolz. K.D. Mtiller-Glaser and D. Seitzcr. Reliable EBT fine positioning using correlation-based window adjustment Schmid, R.. see Brunner. M. Schmitt, R.. M. Brunner and D. Winkler, Electron beam testing ot flat panel display substrates Schmitt, R.. see Brunner. M. Schmoranzer, H., see Jank, A. Schiittler, M.. C. Traub and E. Kubalek. Crosstalk cffcct in electron beam testing: Simulations and measurements Seitzer, D.. see Scharf, R. Sim, K.S.. D.S.H. Chan and J.C.H. Phang, Investigation of capacitive coupling voltage contrast using a specimen charging model Smoliner, J., see Gornik, E.
75-34 195-201
233-240 155 163
Author Index
Solkner, G., Optical beam testing device characterization Solkner, G., see Baur, G. Solkner, G., see Goldstein, M. Solkner, G., see Holm, A. Stephan, R.E., see Maywald, M. Stewart, D.K., see Casey, Jr., J.D. Stopka, M., see Oesterschulze, E. Sturm, M.. see Brunner, M.,
and
its potential
441
for electronic 341-353 393-400 431-436 317-323 99-106 43-50 107-112 61-70
Taenzler, F., W. Mertin, G. David, D. Jager and E. Kubalek, Experimental characterization of the perturbations of microwave devices by the electro-optic probe tip Taenzler, F., see Mertin, W. Teguri, H., see Okubo, K. Trauh, C., see Schottler, M.
123-130 377-384 271-278 233-240
Utesch,
113-121
B., see Persch.
G.
Verguin, P., Liquid crystals in failure analysis today Vitarelli, J. and P.E. Russell, Time delay measurements ventional e-beam technology Von Wendorff, W., see Jager, D. Vrehen, J.J., see De Kort, K.
211-218 using
con221-232 327-339 355-362
Weigel, R., see Holm, A. Wieberneit, M. and R. Lackmann, New results of field-induced deformation of nematic liquid crystals for testing of digital integrated circuits Winkler, D.. see Schmitt, R. Wolter, J.H., see Haverkort, J.E.M. Wolz, W., see Helmreich, K. Wolz, W., see Muller-Glaser, K.D. Wolz, W.. see Scharf, R.
421-430 35-42 203-209 71-80 259-270 155-162
Zimmermann, H., see Casey, Zwaal, E.A.E., see Haverkort.
43-50 203-209
Jr., J.D. J.E.M.
317-323