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Batch acceptance sampling by attributes to reduce overall costs
WORLD A B S T R A C T S ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
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obtain an adherent and interlocked structure which is resistant to spalling. Other studies have shown that A1 films are relatively inert to molten pure Pb-5 per cent Sn solder, but are susceptible to rapid attack if gold is added to the solder. Appreciable delay of such attack is afforded by an overlying film of Cr, provided both surface and edge coverage are achieved.
Dielectric breakdown voltage characteristics of evaporated silicon oxide films. Y. NISHIMURA, T. INAGAKI and H. SASAKI, Trans. Electron. Commun. Engrs ffapan 52, No. 3, March (1969), p. 21. Dielectric breakdown voltage characteristics of evaporated silicon oxide films, often used as protective, insulative and dielectric material, have been explored through various deposition conditions. Especially it has been investigated that their breakdown voltage characteristics are affected by gas absorption depending on deposition conditions. Failure mechanisms in large-scale integrated circuits. G. L SCHNABLEand R. S. KEEN, IEEE Trans. ED-16, No. 4, April (1969), p. 322. Factors affecting the reliability of LSI circuits, including the effect on array reliability of the processing steps needed for multilevel metallization, are investigated. The effect of smaller geometry and closer spacings is considered. Experimental tests on new failure modes in multilevel arrays, such as on dielectric failures, change in resistance of conductors, and silicon surface effects, are described, and it is concluded that the arrays are more reliable per function accomplished than conventional integrated circuits.
Microcircuit testing--matching the value with the cost--Part 2. J. B. BRAUER,Microelectronics 2, No. 7, July (1969), p. 23. Results of tests to determine the extent of testing necessary to determine reliability are given. The costs are broken down into servicing costs and testing costs, and methods are described to determine the optimum number of devices per card to attain the best equipment.
Quality and reliability of electronic components. B. M. MAIR and M. J. PROWSE, Electron. Equip. News 11, No. 2, May (1969), p. 48. The general philosophy of product testing for high reliability at minimum cost is discussed and a number of examples are included as illustrations. Topics mentioned include selection of cheap sampling tests, selection of final tests to eliminate the occasional defective, and accelerated testing for finding the effect of process variables on product life.
Batch acceptance sampling by attributes to reduce overall costs. W. T. TRUSCOTT,Quality Engr 33, No. 3, May-June (1969), p. 9. Three objectives are set in this paper; to review the fundamental concepts and principles of batch sampling by attributes; take an objective look at existing methods and techniques; make proposals for future action.
Simulated failure analysis of integrated circuits. J. G. VALASSISand M. A. MEHTA, Automatic Elect. Tech. ft., July (1969). p. 306. The design of diagnostic programs for large electronic telephone switching systems (TSPS and E-A-X) requires simulated failure analysis data for the components used to implement these systems. At Automatic Electric Laboratories they have obtained simulated failure analysis data for the integrated circuits (ICs) used in these systems. With these data, they have developed logic-layout and system implementation rules that may be used to render each system diagnosable and, thus, expedite the efficient design of system diagnostic programs. A local approach to testing IC's. J. BRAUER,Electron. Prod., August (1969), p. 140. Based on data from a number of electronic systems involving over 5 × 109 operating device-hours, the author has devised a four-level concept of quality and reliability assurance ranging from off-the-shelf commercialgrade products to those under full vendor and user control. Included is a formula for predicting IC failure rates (ranging from 15 to 0.005 failures per million hours). The factors each independently reflect the effects of temperature, circuit complexity, package, application, environment and quality. Testing costs up to 80 per cent of the cost of unscreened microcircuits are shown to offer order-of magnitude improvements in failure rate and eliminate the loss due to inplant rework. Reliability is essentially a quality factor, since microcircuits do not wear out. In fact, less than 1 per cent of all failures are attributed to long-term degradation rather than quality defects. The basis is thus provided for making a value judgment regarding procedures for eliminating the troublesome fraction of any microcircuit population.
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obtain an adherent and interlocked structure which is resistant to spalling. Other studies have shown that A1 films are relatively inert to molten pure Pb-5 per cent Sn solder, but are susceptible to rapid attack if gold is added to the solder. Appreciable delay of such attack is afforded by an overlying film of Cr, provided both surface and edge coverage are achieved.
Dielectric breakdown voltage characteristics of evaporated silicon oxide films. Y. NISHIMURA, T. INAGAKI and H. SASAKI, Trans. Electron. Commun. Engrs ffapan 52, No. 3, March (1969), p. 21. Dielectric breakdown voltage characteristics of evaporated silicon oxide films, often used as protective, insulative and dielectric material, have been explored through various deposition conditions. Especially it has been investigated that their breakdown voltage characteristics are affected by gas absorption depending on deposition conditions. Failure mechanisms in large-scale integrated circuits. G. L SCHNABLEand R. S. KEEN, IEEE Trans. ED-16, No. 4, April (1969), p. 322. Factors affecting the reliability of LSI circuits, including the effect on array reliability of the processing steps needed for multilevel metallization, are investigated. The effect of smaller geometry and closer spacings is considered. Experimental tests on new failure modes in multilevel arrays, such as on dielectric failures, change in resistance of conductors, and silicon surface effects, are described, and it is concluded that the arrays are more reliable per function accomplished than conventional integrated circuits.
Microcircuit testing--matching the value with the cost--Part 2. J. B. BRAUER,Microelectronics 2, No. 7, July (1969), p. 23. Results of tests to determine the extent of testing necessary to determine reliability are given. The costs are broken down into servicing costs and testing costs, and methods are described to determine the optimum number of devices per card to attain the best equipment.
Quality and reliability of electronic components. B. M. MAIR and M. J. PROWSE, Electron. Equip. News 11, No. 2, May (1969), p. 48. The general philosophy of product testing for high reliability at minimum cost is discussed and a number of examples are included as illustrations. Topics mentioned include selection of cheap sampling tests, selection of final tests to eliminate the occasional defective, and accelerated testing for finding the effect of process variables on product life.
Batch acceptance sampling by attributes to reduce overall costs. W. T. TRUSCOTT,Quality Engr 33, No. 3, May-June (1969), p. 9. Three objectives are set in this paper; to review the fundamental concepts and principles of batch sampling by attributes; take an objective look at existing methods and techniques; make proposals for future action.
Simulated failure analysis of integrated circuits. J. G. VALASSISand M. A. MEHTA, Automatic Elect. Tech. ft., July (1969). p. 306. The design of diagnostic programs for large electronic telephone switching systems (TSPS and E-A-X) requires simulated failure analysis data for the components used to implement these systems. At Automatic Electric Laboratories they have obtained simulated failure analysis data for the integrated circuits (ICs) used in these systems. With these data, they have developed logic-layout and system implementation rules that may be used to render each system diagnosable and, thus, expedite the efficient design of system diagnostic programs. A local approach to testing IC's. J. BRAUER,Electron. Prod., August (1969), p. 140. Based on data from a number of electronic systems involving over 5 × 109 operating device-hours, the author has devised a four-level concept of quality and reliability assurance ranging from off-the-shelf commercialgrade products to those under full vendor and user control. Included is a formula for predicting IC failure rates (ranging from 15 to 0.005 failures per million hours). The factors each independently reflect the effects of temperature, circuit complexity, package, application, environment and quality. Testing costs up to 80 per cent of the cost of unscreened microcircuits are shown to offer order-of magnitude improvements in failure rate and eliminate the loss due to inplant rework. Reliability is essentially a quality factor, since microcircuits do not wear out. In fact, less than 1 per cent of all failures are attributed to long-term degradation rather than quality defects. The basis is thus provided for making a value judgment regarding procedures for eliminating the troublesome fraction of any microcircuit population.