Chip trio simplifies precise position control

Reliability considerations of flip chip components for automotive electronic applications KEISUKE SUGIYAMA, ISAO BANSAKU, N A O H A R U TSUZIMOTO and IWAO TACHIKAWA Electrocomponent ScL TechnoL 9, 87 (1981) Electronic devices for automotive electronic applications have to be operated under extreme en~,ironmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic ones using thick film technology. This paper presents results that shows that our flip chip IC technology can satisfy the high reliability requirements of automobile electronics. Chip resistors gain support R O D E R I C BERES FORD Electronics 90 (17 Nov 1981) US companies gear up to make the small, light thick film devices, as a second domestic maker introduces an automatic insertion system. Gallium arsenide digital Integrated circuits for appfications above one gigahertz M. R O C t l l and M. G A V A N T Acta electron. 23 (3), 243 (1980) (in French) Gallium arsenide logic approaches are compared about their static and dynamic performances. Their respective range of applications are then clearly defined. Frequency dividers by 2 to be used as test circuits for a high speed technology are thoroughly analysed. The design, optimisation and experimental evaluation of 2 diodesB FL (Buffered FET logic) frequency dividers by 2 and 8 are then presented. Tester takes on VLS! with 264.-K vectors behind its pins G A R R Y C. G I L L E ' I q ~ Electronics 122 (3 Nov 1981) Combining both high-speed static and denser dynamic RAMs, the 40 MHz system will also serve in computeraided design networks. Building quality analog circuits with C-MOS logic arrays R I C t t A R D KASH Electronics 109 (11 Aug 1981) Design techniques can turn digital complementaryMOS components into low-power, high-performance linear systems. Large scale integration techniques for telecommunication J. C O R N U Electl Commun. 55 (4), 376 (1980) Over the past few years, advances in electronics technology - principally the ever increasing scale of circuit integration and the development of semiconductor memory - have started to have a marked effect on the telecommunication industry. As microprocessors become more powerful and less costly, distributed control techniques are increasingly being implemented. Similarly, now that complex circuits can be constructed economically on a single chip, digital techniques are takinz over from tra_d_itio_nal'analog techniques. The

author looks at the problems which have been encountered in attempting to use the new technologies in the field of telecommunication, and shows how they have been successfully overcome. Much of the development work in this area is being conducted at the major I a~l"research laboratories. Thick film temperature compensating circuit for semiconductor strain gauges HIDEO ARIMA, AKIRA IKEGAMI, HIROMI TOSAKI, MITSUO AI, YOSHITAKA MATSUOKA and TSUTOMU OKAYAMA ElectrocomponentSci. Technol. 8, 189 (1981) Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting the gauges to amplifiers in electronic pressure and differential pressure transmitters. In each circuit, ten Au pads for AI wire bonding and thirteen Ag/Pd pads for soldering must be fabricated on a small substrate. The results of the research are shown as follows. (1) The resistance values and the thermistor 9constants required for the thermistors are 0.9--+0.09 kiloohm and 2500-,-40 .Kelvin, respectively. Those characteristics are realised by developing a paste composition composed of a new spinel type oxide (Mnt.6 Co0.8 Nio.35 Ruo.2.s O4), RuO2 and glass. (2) Accelerated life tests of the thick film thermistors reveal that the resistance drift rates of the thermistors are less than • at 12&C. (3) Life tests clarify that the wire bonding pads fabricated by using ESL 8882 Au paste keep more than 4 grams in pull strength, and that the soldering pads fabricated by using Sumitomo CLP 495 A Ag/Pd paste are more than I kilogram in pull strengt h. (4) The temperature dependence of zero shift and span 9 in the pressure transmitter are suppressed within +_.0.2% between -40~ and 120~ by using the thick film circuit developed. The use of 16-bit high level languages and microcomputer products to solve Industrial control products G. A. TRICKEY Microelectron. Reliab. 21 (3), 381 (1981) The increasing useage of low-cost microcomputer systems in industrial control and automation has caused two industry bottlenecks - hardware and software systems design. Ease of application is thus a prime criterion for microcomputer system selection for use in this area. This paper examines the consequences of combining high-level languages, which are efficient for the programmer to use - with predefined hardware configurations, and-discusses the advantages and disadvantages of various hardware/software solutions to typical industrial applications.

Chip triosimplifiesprecisepositioncontrol M A U R I Z I O PITALIERI and C A R L O BOZOT'FI Electronics 125 (8 Sept 1981) A microcomputer is the only other device needed to complete the interface with the motor in this low-cost servomotor loop.