- Email: [email protected]
Composite plating apparatus
position consisting essentially of from 0.01 to 45% by weight polyvinylidene fluoride based polymer; and from greater than 55 to 99.99% polyamide polymer selected from the group consisting of polyamide 11 and polyamide 12.
COMPOSITE PMTING
APPARATUS
U.S. Patent 6,086,731. July 11, 2000
0. Ishigami et al., assignors to Honda Giken Kogyo KK, Tokyo An apparatus for forming a composite plating film on an inner surface of a hollow section of a workpiece, which comprises a cy-
lindrical electrode adapted to be disposed in the hollow section of the workpiece with a surrounding gap left between a surface of an outer wall of the electrode and the inner surface of the hollow section; and a plating liquid circulating mechanism for supplying composite plating liquid, consisting of ceramic particles mixed in plating liquid, to an interior of the cylindrical electrode, for passing the composite plating liquid through the through-holes of the outer wall of the electrode to be then jetted onto the inner surface of the hollow section, and for collecting the jetted composite plating liquid f-rum a region surrounding the cylindrical electrode.
mu SCarlaaCoatrallar
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Cleaning & Degreasing Chemical Milling Conversion Coating Painting
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TDSlpHIConductivQ Control Relay for Valves I & Solenoids 1 Recorder Output for Data Collection
Meg8 Mater Cond/TDS/pH/Temp. Waterproof Easy-to-use Single Probe to Measure Cond, TDS, pH & Temp. Protective Boot Included! l l l
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laHnbiaat~onController 4 Pump pH or ORP Dosing Pump Rugged Constrwtion Easy-to-use Proportional Dosing l l l l
Cohrlmetaro
Lightweight & Portable Digital Display 4 Single & Multiparameter Models Available Quick & Simple-to-use l l
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Cond/TDS/Temp. Waterproof Compact & Lightweight
ChamlcalTmr I(Ib Wide Variety to Chaose From Simple-to-use Economically Priced
U.S. Patent 6,086,?42. July 11, 2000 H.U. Huhn et al., assignors to GlycoMetall-Werke, Glyco B. v. & Co. KG, Weisbaden
A process for producing multilayer materials for plain bearings comprising preparing a metallic backing layer; applying a bronze layer to the backing layer; electrodepositing a binary layer on the bronze layer selected from a group of materials consisting essentially of lead-based and tinbased alloys in an electroplating bath having a nonionic wetting agent and a benzene derivative anodically activating at least one surface layer of t le binary layer; and electroplati lg a molybdenum-based runn 1 ng-in layer on the binary layer.
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ELECTROPLA’IING BATH FOR SLIDING BEARINGS
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Qq&
HhNNR lill~lll~l instrumnts
43130
Circle060 on reader card or go to www.thm.to/webconnact 80
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Water Analysis & Control Division Business Park Drive, Suite 201, Tel.: 888 426.6222 l Fax: 909 693.5213 email: [email protected]
Temecula, CA 92590
Circle025 on reader card or go to www.thm.to/webconnect
ELECfROLESS
GOLD DEPOSITION
U.S. Patent 6,086,946. July 11, 2000 G.L. Ballard et al., assignors to International Business Machines Corp., Armonk, N. Y.
A method for electroless gold deposition comprising forming copper circuit features on a substrate by an additive process employing a Metal Finishing
COMPOSITE PMTING
APPARATUS
U.S. Patent 6,086,731. July 11, 2000
0. Ishigami et al., assignors to Honda Giken Kogyo KK, Tokyo An apparatus for forming a composite plating film on an inner surface of a hollow section of a workpiece, which comprises a cy-
lindrical electrode adapted to be disposed in the hollow section of the workpiece with a surrounding gap left between a surface of an outer wall of the electrode and the inner surface of the hollow section; and a plating liquid circulating mechanism for supplying composite plating liquid, consisting of ceramic particles mixed in plating liquid, to an interior of the cylindrical electrode, for passing the composite plating liquid through the through-holes of the outer wall of the electrode to be then jetted onto the inner surface of the hollow section, and for collecting the jetted composite plating liquid f-rum a region surrounding the cylindrical electrode.
mu SCarlaaCoatrallar
I
Cleaning & Degreasing Chemical Milling Conversion Coating Painting
l l
l
I
TDSlpHIConductivQ Control Relay for Valves I & Solenoids 1 Recorder Output for Data Collection
Meg8 Mater Cond/TDS/pH/Temp. Waterproof Easy-to-use Single Probe to Measure Cond, TDS, pH & Temp. Protective Boot Included! l l l
l
laHnbiaat~onController 4 Pump pH or ORP Dosing Pump Rugged Constrwtion Easy-to-use Proportional Dosing l l l l
Cohrlmetaro
Lightweight & Portable Digital Display 4 Single & Multiparameter Models Available Quick & Simple-to-use l l
l
l l
Cond/TDS/Temp. Waterproof Compact & Lightweight
ChamlcalTmr I(Ib Wide Variety to Chaose From Simple-to-use Economically Priced
U.S. Patent 6,086,?42. July 11, 2000 H.U. Huhn et al., assignors to GlycoMetall-Werke, Glyco B. v. & Co. KG, Weisbaden
A process for producing multilayer materials for plain bearings comprising preparing a metallic backing layer; applying a bronze layer to the backing layer; electrodepositing a binary layer on the bronze layer selected from a group of materials consisting essentially of lead-based and tinbased alloys in an electroplating bath having a nonionic wetting agent and a benzene derivative anodically activating at least one surface layer of t le binary layer; and electroplati lg a molybdenum-based runn 1 ng-in layer on the binary layer.
l
l
ELECTROPLA’IING BATH FOR SLIDING BEARINGS
l
l l
Qq&
HhNNR lill~lll~l instrumnts
43130
Circle060 on reader card or go to www.thm.to/webconnact 80
_
Water Analysis & Control Division Business Park Drive, Suite 201, Tel.: 888 426.6222 l Fax: 909 693.5213 email: [email protected]
Temecula, CA 92590
Circle025 on reader card or go to www.thm.to/webconnect
ELECfROLESS
GOLD DEPOSITION
U.S. Patent 6,086,946. July 11, 2000 G.L. Ballard et al., assignors to International Business Machines Corp., Armonk, N. Y.
A method for electroless gold deposition comprising forming copper circuit features on a substrate by an additive process employing a Metal Finishing