Corrigendum to “Bias deposition of nanoporous Cu thin films” [Mater. Lett. 102–103 (2013) 72–75]

Corrigendum to “Bias deposition of nanoporous Cu thin films” [Mater. Lett. 102–103 (2013) 72–75]

Materials Letters 127 (2014) 12–12 Contents lists available at ScienceDirect Materials Letters journal homepage: www.elsevier.com/locate/matlet Cor...

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Materials Letters 127 (2014) 12–12

Contents lists available at ScienceDirect

Materials Letters journal homepage: www.elsevier.com/locate/matlet

Corrigendum

Corrigendum to “Bias deposition of nanoporous Cu thin films” [Mater. Lett. 102–103 (2013) 72–75] J.B. Su n, H.H. Wang, M.P. Jiang, L.X. Li Department of Electronic Science and Engineering, School of Mathematics and Physics, Changzhou University, 213164 Changzhou, PR China

art ic l e i nf o the printed version of the above article contained the following error. The correct and final version follows. The authors would like to apologise for any inconvenience caused. The as-sputtered Cu deposits should be corrected to CuxO (x ¼1, 2) deposits. The XRD patterns of the deposits can be found in Fig. 4.

The authors that Available online 26 regret April 2014

Fig. 4. XRD patterns showing the microstructures of the deposits obtained at RT under different substrate conditions: ➀ Vs ¼0 V, glass slide; ➁ Vs ¼  100 V, glass slide; and ➂ Vs ¼  100 V, 30 nm-CuxO/glass slide.

n

DOI of original article: http://dx.doi.org/10.1016/j.matlet.2013.03.114 Corresponding author. Tel.: þ 86 15151981517. E-mail addresses: [email protected], [email protected] (J.B. Su).

http://dx.doi.org/10.1016/j.matlet.2014.04.084 0167-577X/& 2014 Elsevier B.V. All rights reserved.