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Depositing golden titanium nitride
_ _ .............. COMPOSmOIIiI u.s. Patent 5,919,318. July 6, 1999 K-D. Brands et ai., assignors to Henkel KGA, Duesseldorf
An aqueous solution for iron phosphating of metals having a pH value of 3.5 to 6 and comprising 1 to 20 gIL of dissolved phosphate, 0.02 to 2 gIL of nitrobenzene sulfonic acid, and 0.01 to 0.8 gIL of one or more organic monocarboxylie acids. ••POSInNG GOLDIN mANIU. NmllDi
U.S. Patent 5,919,342. July 6, 1999 K. K- T Ngan, assignor to Applied Materials Inc., Santa Clara, Calif.
A method of depositing golden TiN having uniform sheet resistance in a plasma sputtering
J.l!:1~Y
81) l'JJ!:It!:l.t
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chamber including a titanium target connected to a source of DC power; a substrate support electrode mounted spaced from and parallel to the target; an internal helical coil connected to a source of RF power; a gas inlet; and an adjustable exhaust system.
having an upper edge; and a pin member having an outer diameter, the pin member to firmly attach the stainless steel sheet to the copper hanger bar so that the stainless steel sheet extends perpendicularly from the flat undersurface.
CATHODI .LAllIe POll COPPIII PLATING
~
UNII'OIIII DIPOSnIOII OP . .ftllllAU U.S. Patent 5,919,345. July 6, 1999
U.S. Patent 5,919,343. July 6, 1999 R.A. Sparapani, assignor to Customer Metal Fabrication Inc., Iron Mountain, Mich.
A. Tepman, assignor to Applied Materials Inc. , Santa Clara. Calif.
A cathode blank for copper plating comprising a copper hanger bar having an undersurface with end portions adapted to rest upon support members and electrical contacts; a stainless steel sheet
[L.A• ...
... precisely monitor the current density on the parts on t.h e plating rack I ." Minimlz overplating and rejects I ... Increase production efficiency I
An apparatus for sputtering a film layer onto a substrate comprising a vacuum enclosure having a sputtering target of generally uniform thickness and a pedestal disposed therein; the pedestal having a generally pla-
Salt Spray Meet Specifications of A TM B-117-97
Model CD200 Portable , Mol.ture proof
c •• e Model CD300 Hand Held
AJJ!)J'uuld!J jJul;j!J H!JdJ1!JJ' ]:!) !J.&!jJl!)J'!I
!:d!J!J~J'!)jJl11H.Ll~ ... u!JjJ!);jH Ul!l1J'llU.l:!:IJ'.l;j~b~, tJ'lll.Ll :'jl:&!J, Ul.!udlHy, ~);..I'!:I:'j:'ji !:It!.:.
No Me or Preparation Time Ready to use in 5-Gallon and 55-Gallon Drum upplied with of Shipment within 24-Hour
Red Bird Service Model £0103 Mod I £0510 Model £2060
1/tItIW/tIiU
Max Max Max Max Max Max
Ave Ave Ave Avo Ave Ave
Ro ••dale N.w York
Forward current: Rever.e Current: Forward current: Rever.e Current: Forward current: Rever.e Current:
1.0 Amp 3 .0 Amp 5.0 Amp 10.0 Amp 20.0 Amp 60.0 Amp
o good
IN 47037 800-428-3502
www.redbirdervice.com
711- •• 1- '141 F•• 711 - "I - tU9
Circle 035 on reeder Information card Aprf12000
205 We tern Avenue
•
An aqueous solution for iron phosphating of metals having a pH value of 3.5 to 6 and comprising 1 to 20 gIL of dissolved phosphate, 0.02 to 2 gIL of nitrobenzene sulfonic acid, and 0.01 to 0.8 gIL of one or more organic monocarboxylie acids. ••POSInNG GOLDIN mANIU. NmllDi
U.S. Patent 5,919,342. July 6, 1999 K. K- T Ngan, assignor to Applied Materials Inc., Santa Clara, Calif.
A method of depositing golden TiN having uniform sheet resistance in a plasma sputtering
J.l!:1~Y
81) l'JJ!:It!:l.t
XU.!'
chamber including a titanium target connected to a source of DC power; a substrate support electrode mounted spaced from and parallel to the target; an internal helical coil connected to a source of RF power; a gas inlet; and an adjustable exhaust system.
having an upper edge; and a pin member having an outer diameter, the pin member to firmly attach the stainless steel sheet to the copper hanger bar so that the stainless steel sheet extends perpendicularly from the flat undersurface.
CATHODI .LAllIe POll COPPIII PLATING
~
UNII'OIIII DIPOSnIOII OP . .ftllllAU U.S. Patent 5,919,345. July 6, 1999
U.S. Patent 5,919,343. July 6, 1999 R.A. Sparapani, assignor to Customer Metal Fabrication Inc., Iron Mountain, Mich.
A. Tepman, assignor to Applied Materials Inc. , Santa Clara. Calif.
A cathode blank for copper plating comprising a copper hanger bar having an undersurface with end portions adapted to rest upon support members and electrical contacts; a stainless steel sheet
[L.A• ...
... precisely monitor the current density on the parts on t.h e plating rack I ." Minimlz overplating and rejects I ... Increase production efficiency I
An apparatus for sputtering a film layer onto a substrate comprising a vacuum enclosure having a sputtering target of generally uniform thickness and a pedestal disposed therein; the pedestal having a generally pla-
Salt Spray Meet Specifications of A TM B-117-97
Model CD200 Portable , Mol.ture proof
c •• e Model CD300 Hand Held
AJJ!)J'uuld!J jJul;j!J H!JdJ1!JJ' ]:!) !J.&!jJl!)J'!I
!:d!J!J~J'!)jJl11H.Ll~ ... u!JjJ!);jH Ul!l1J'llU.l:!:IJ'.l;j~b~, tJ'lll.Ll :'jl:&!J, Ul.!udlHy, ~);..I'!:I:'j:'ji !:It!.:.
No Me or Preparation Time Ready to use in 5-Gallon and 55-Gallon Drum upplied with of Shipment within 24-Hour
Red Bird Service Model £0103 Mod I £0510 Model £2060
1/tItIW/tIiU
Max Max Max Max Max Max
Ave Ave Ave Avo Ave Ave
Ro ••dale N.w York
Forward current: Rever.e Current: Forward current: Rever.e Current: Forward current: Rever.e Current:
1.0 Amp 3 .0 Amp 5.0 Amp 10.0 Amp 20.0 Amp 60.0 Amp
o good
IN 47037 800-428-3502
www.redbirdervice.com
711- •• 1- '141 F•• 711 - "I - tU9
Circle 035 on reeder Information card Aprf12000
205 We tern Avenue
•