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Deposition of chromium oxides
Granted in the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.
PRINTED CIRCUIT BOARD
U.S. Patent 6,003,225. Dec. 21, 1999 S. Yoon, assignor to Hughes Electronics Corp., Los Angeles
from the object and chamber; and processing and cleaning contaminated solvent within the closed circuit.
A method for fabrication of aluminum-backed printed wiring boards with plated holes.
RECYCLING CLEANING SOLVENT
POWDER COAnNG GUN
U.S. Patent 6,003,779. Dec. 21, 1999 M.A Robidoux, assignor to The Eastwood Co., Malvern, Pa.
A method for electrostatic spraying of a powder onto a workpiece having a broad surface. CARBON DIOXIDE CLEANING PROCESS
U.S. Patent 6,004,400. Dec. 21, 1999 P. W. Bishop and AJ. Harrouer, assignors to Phillips W. Bishop, Chandler, Ariz.
A method for cleaning contaminant particles from a surface of a metal part including preliminarily cleaning with an abrasive material and then cleaning with frozen carbon dioxide pellets. SOLVENT CLEANING SYSTEM
U.S. Patent 6,044,403. Dec. 21, 1999 D.J. Gray and P.T.E. Gebhard, assignors to Gebhard Gray Associates, Providence, R.I.
A closed circuit solvent cleaning method comprising placing an object to be cleaned in a chamber sealable with respect to the atmosphere; applying a negative gauge pressure to the chamber to remove air and other noncondensable gases; introducing a solvent to the evacuated chamber; cleaning the object while maintaining an airless environment within the chamber; recovering the solvent January 2001
U.S. Patent 6,004,434. Dec. 21, 1999 E. Kiany, assignor to Safety-Kleen Corp., Elgin, Ill.
A method comprising cleaning and recycling a mixture of a cleaning solvent and a treating composition, said cleaning solvent having been contaminated with impurities through use and comprising not more than 209(; aromatic solvents and the remainder aliphatic solvents, and having a flashpoint of 100 to 250°F. CURRENT CONTROL SYSTEM FOR AN ELECTROPLAnNG APPARATUS
U.S. Patent 6,004,440. Dec. 21, 1999 K.M. Hanson et al., assignors to Semitool lnc., Kalispell, Mont.
A current thief for use in electroplating a wafer, the current thief comprising a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer; a first plurality of resistance devices each associated with a respective one of the plurality of conductive segments; and regulating current through the respective conductive segments during electroplating of the wafer. ELECTROFORMING PROCESS
U.S. Patent 6,004,447. Dec. 21, 1999 P. Bischoping et al., assignors to Xerox Corp., Stamford, Conn.
An electroform prepared by a process comprising the steps of electroforming a layer of metal on an
inner surface of a mandrel having a duct therein, thereby forming an electroform with a hollow interior; and removing the electroform from the mandrel. DEPOsmON OF CHROMIUM OXIDES
U.S. Patent 6,004,448. Dec. 21, 1999 N.M. Martyak, assignor to Atotech USA Inc., N.J.
A process for deposition of chromium oxides from a trivalent chromium solution containing a complexing agent for a buffer. GALVANIZING EQUIPMENT
U.S. Patent 6,004,507. Dec. 21, 1999 J.A Morando, assignor to Alphatech Inc., Grosse Isle, Mich.
A material formulation for galvanizing equipment submerged in molten aluminum and/or zinc melts. COIL COAnNG PROCESS
U.S. Patent 6,004,629. Dec. 21, 1999 W.V. Madigan, Bayville, N. Y.
A process for coating a continuous moving length of sheet metal comprising cleaning with a waterbased solution to remove surface contaminants that may interfere with the coating adhering to the sheet metal; applying a waterbased pretreatment solution to the moving length of sheet metal to promote adhesion of the coating to the surface of the sheet metal; applying an electron-beam-curable coating to the moving length of sheet metal; and exposing the moving length of sheet metal to an electron beam to cure the coating. 99
PRINTED CIRCUIT BOARD
U.S. Patent 6,003,225. Dec. 21, 1999 S. Yoon, assignor to Hughes Electronics Corp., Los Angeles
from the object and chamber; and processing and cleaning contaminated solvent within the closed circuit.
A method for fabrication of aluminum-backed printed wiring boards with plated holes.
RECYCLING CLEANING SOLVENT
POWDER COAnNG GUN
U.S. Patent 6,003,779. Dec. 21, 1999 M.A Robidoux, assignor to The Eastwood Co., Malvern, Pa.
A method for electrostatic spraying of a powder onto a workpiece having a broad surface. CARBON DIOXIDE CLEANING PROCESS
U.S. Patent 6,004,400. Dec. 21, 1999 P. W. Bishop and AJ. Harrouer, assignors to Phillips W. Bishop, Chandler, Ariz.
A method for cleaning contaminant particles from a surface of a metal part including preliminarily cleaning with an abrasive material and then cleaning with frozen carbon dioxide pellets. SOLVENT CLEANING SYSTEM
U.S. Patent 6,044,403. Dec. 21, 1999 D.J. Gray and P.T.E. Gebhard, assignors to Gebhard Gray Associates, Providence, R.I.
A closed circuit solvent cleaning method comprising placing an object to be cleaned in a chamber sealable with respect to the atmosphere; applying a negative gauge pressure to the chamber to remove air and other noncondensable gases; introducing a solvent to the evacuated chamber; cleaning the object while maintaining an airless environment within the chamber; recovering the solvent January 2001
U.S. Patent 6,004,434. Dec. 21, 1999 E. Kiany, assignor to Safety-Kleen Corp., Elgin, Ill.
A method comprising cleaning and recycling a mixture of a cleaning solvent and a treating composition, said cleaning solvent having been contaminated with impurities through use and comprising not more than 209(; aromatic solvents and the remainder aliphatic solvents, and having a flashpoint of 100 to 250°F. CURRENT CONTROL SYSTEM FOR AN ELECTROPLAnNG APPARATUS
U.S. Patent 6,004,440. Dec. 21, 1999 K.M. Hanson et al., assignors to Semitool lnc., Kalispell, Mont.
A current thief for use in electroplating a wafer, the current thief comprising a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer; a first plurality of resistance devices each associated with a respective one of the plurality of conductive segments; and regulating current through the respective conductive segments during electroplating of the wafer. ELECTROFORMING PROCESS
U.S. Patent 6,004,447. Dec. 21, 1999 P. Bischoping et al., assignors to Xerox Corp., Stamford, Conn.
An electroform prepared by a process comprising the steps of electroforming a layer of metal on an
inner surface of a mandrel having a duct therein, thereby forming an electroform with a hollow interior; and removing the electroform from the mandrel. DEPOsmON OF CHROMIUM OXIDES
U.S. Patent 6,004,448. Dec. 21, 1999 N.M. Martyak, assignor to Atotech USA Inc., N.J.
A process for deposition of chromium oxides from a trivalent chromium solution containing a complexing agent for a buffer. GALVANIZING EQUIPMENT
U.S. Patent 6,004,507. Dec. 21, 1999 J.A Morando, assignor to Alphatech Inc., Grosse Isle, Mich.
A material formulation for galvanizing equipment submerged in molten aluminum and/or zinc melts. COIL COAnNG PROCESS
U.S. Patent 6,004,629. Dec. 21, 1999 W.V. Madigan, Bayville, N. Y.
A process for coating a continuous moving length of sheet metal comprising cleaning with a waterbased solution to remove surface contaminants that may interfere with the coating adhering to the sheet metal; applying a waterbased pretreatment solution to the moving length of sheet metal to promote adhesion of the coating to the surface of the sheet metal; applying an electron-beam-curable coating to the moving length of sheet metal; and exposing the moving length of sheet metal to an electron beam to cure the coating. 99