patterning the resist: selectively etching WC plating the copper layer using the patterned resist as a mask to thereby form a copper circuit to be used as a part of a circuit board; measuring a degree of oxidation of the copper layer, ,iaid measuring being accomplished prior to coating the resist on the copper layer by irradiating a surface of the copper layer with an irradiation beam so that at least a portion 01‘ the irradiation beam is reflected from the surface as a reflected beam and evaluating a characteristic of the reflected beam as a measure of the degree of oxidation: and after an excessive degree of oxidation has been determined. either removing at least a portion of the oxidized copper or covering the oxidized copper with a copper cladding prior to the coating of the copper layer with the resist.
tolithography on the metal layer. excess metal removed from the housing leaving the conductor pattern thereon in the form of closely spaced contact members, the housing including a contact section and a sodering section, with the contact members extending along one surface of the contact section and along one part of the soldering section including a side surface and a bottom surface of the soldering section, and the side surface of the soldering section having arcuate depressions along which the contact members extend.
an abrasive layer- and a second major surface having a layer of pressure-sensitive adhesive and a protective liner covering the layer of pressure-sensitive adhesive, the liner having a perimeter coterminous with the perimeter of the substrate in which the liner has a lift flap secured thereto with a greater bond strength therebetween than the bond strength developed between the liner and the pressure-sensitive adhesive. the lift flap not extending heyond the perimeter of the liner and having a free portion accessible to finger grip.
Cationic Electrodeposition Composition
Sputtering
Electrical Connector Metal Plating
An electrodepositable composition comprising a nongelled cai:ionic water-dispersible resin electrodepositable on a cathode. which is derived from a polyepoxide.
Formed by
U.S. Patenl 5,6X,483. May 6, 1997 T Akfoh, assignor to The Whitaker
Wilmington,Del.
Corp.,
An electrical connector comprising a dielectric h,ousing made of a heat-resistant plasrlc that can accept metal plating having a roughened surface covered with a metal layer. a conductor pattern formed by pho-
Apparatus
U.S. Patent 5,626.727. May 6 1997 H. Yamanishief al, assignors fo Matsushita Electric lndustriai Co. Ltd., Osaka-fu,Japan
U.S. Pafent5,633,297. May 27, 1997 J.T. Valko and RF: Karabin, assignors to PPG Industries Inc., Pittsburgh
Abrasive Articles U.S. Patent 5.626,639. May 6, 1997 W.B. King, assignor to 3M Co., St Pau/, Minn.
An abrasive article comprising a substrate having a first major surface bearing
A sputtering apparatus using a plurahty of rectangular targets to form a thin film on a substrate comprising a plurality of magnets disposed along both side edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the target are opposite, and the polarities of the magnets confronting each other across the target are opposite, the surfaces of at least two said targets being inclined to a surface of the substrate al an angle not smaller than 30” and not larger than 60”
Coating and Surface Treatment Systems for Metals by J,
E:dwards 470pages $135.00
Selection of the most appropriate coating or other surface treatment is addressed in the comprehensive guide. Part I covers 76 industrially important coating types from acrylic polymers through zinc alloys. Part II provides an overvkw of the 19 most important coating and treatment methods with emphasis on the implications for a parlicular product in terms of its substrate or shape. Part III offers a guide to coating characteristics.
electroplating
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