- Email: [email protected]
Electroless copper
ELECTROLESS
simultaneously received in at least some of the surface openings in the airfoil, the appendages blocking the surface openings in which they are received.
COPPER
l%S. Patent 6,258,223.
July 10, 2001
R. Cheung et al., assignors to Applied Materials, Inc., Santa Clara, Calif:
A system for depositing a conductive layer on a substrate comprising an electroplating processing mainframe having a transfer robot and one or more electroplating cells; an electroless deposition applicator coupled to the mainframe, the applicator comprising a nozzle positioned to distribute electroless deposition fluid over the substrate; and an electroless deposition fluid supply fluidly connected to the electroless deposition applicator.
ANODIZING
S. Matsumura An apparatus
for anodizing a substrate by an electrolytic solution comprising a process tank for storing the electrolytic solution, the tank having an opening in a wall; a positive electrode having a flat contacting surface adapted to contact a surface of the substrate arranged to close the opening from an inside of the process tank, the surface being open outside the process tank through the opening; and a negative electrode arranged to oppose the substrate, which closes the opening.
AIRFOILS
US. Patent 6,258,226. July 10, 2001 JA. Conner, assignor to General Electric Co., Cincinnati,
and K. Yamagata,
assignors to Canon KK, Tokyo
FOR PLATING OF TURBINE
MASKS
APPARATUS
US. Patent 6,258,240. July lo,2001
An electrically enhanced method for forming a corrosion-resistant surface on an electrically conductive surface comprising contacting with a medium consisting of a combination of water, greater than 2% of at least one water-soluble silicate, and at least one dopant; establishing an electrolytic environment within the
Ohio
An electroplating
masking insert assembled with an airfoil having surface openings therein, the masking insert comprising a base and appendages projecting from the base, at least some of the appendages being positioned and oriented on the base so as to be
PROCESS
FOR TREATING AN ELEC-
TRICALLV CONDUCTIVE
SURFACE
US. Patent 6,258,243. July lo,2001 R.L. Heimann et al., assignors to Elisha Technologies Co LLC, Moberly, MO.
CHEMICAL COATINGS J Duo Control : voltage and ampere ti Digital reading to 0.01 unit J DC with less than 1% AC residual ripple. J Current limiter control J Beautiful Acrylic housing J Duo AC input : 115 8c240 vat
J Selectable constant voltage & current mode J Independent voltage and current calibration J DC with less than 1% AC ripple.
LM@YW
Rosedale. New York
718-481-874
CARLSTADT, NJ 07072 Phone: (201) 433-3700
l
Fax: (201) 4334231
Circle 039 on reader card or go to Circle 024on reader card or go to www.thru.to/webconnect July 2002
www.thru.to/webconnect 57
simultaneously received in at least some of the surface openings in the airfoil, the appendages blocking the surface openings in which they are received.
COPPER
l%S. Patent 6,258,223.
July 10, 2001
R. Cheung et al., assignors to Applied Materials, Inc., Santa Clara, Calif:
A system for depositing a conductive layer on a substrate comprising an electroplating processing mainframe having a transfer robot and one or more electroplating cells; an electroless deposition applicator coupled to the mainframe, the applicator comprising a nozzle positioned to distribute electroless deposition fluid over the substrate; and an electroless deposition fluid supply fluidly connected to the electroless deposition applicator.
ANODIZING
S. Matsumura An apparatus
for anodizing a substrate by an electrolytic solution comprising a process tank for storing the electrolytic solution, the tank having an opening in a wall; a positive electrode having a flat contacting surface adapted to contact a surface of the substrate arranged to close the opening from an inside of the process tank, the surface being open outside the process tank through the opening; and a negative electrode arranged to oppose the substrate, which closes the opening.
AIRFOILS
US. Patent 6,258,226. July 10, 2001 JA. Conner, assignor to General Electric Co., Cincinnati,
and K. Yamagata,
assignors to Canon KK, Tokyo
FOR PLATING OF TURBINE
MASKS
APPARATUS
US. Patent 6,258,240. July lo,2001
An electrically enhanced method for forming a corrosion-resistant surface on an electrically conductive surface comprising contacting with a medium consisting of a combination of water, greater than 2% of at least one water-soluble silicate, and at least one dopant; establishing an electrolytic environment within the
Ohio
An electroplating
masking insert assembled with an airfoil having surface openings therein, the masking insert comprising a base and appendages projecting from the base, at least some of the appendages being positioned and oriented on the base so as to be
PROCESS
FOR TREATING AN ELEC-
TRICALLV CONDUCTIVE
SURFACE
US. Patent 6,258,243. July lo,2001 R.L. Heimann et al., assignors to Elisha Technologies Co LLC, Moberly, MO.
CHEMICAL COATINGS J Duo Control : voltage and ampere ti Digital reading to 0.01 unit J DC with less than 1% AC residual ripple. J Current limiter control J Beautiful Acrylic housing J Duo AC input : 115 8c240 vat
J Selectable constant voltage & current mode J Independent voltage and current calibration J DC with less than 1% AC ripple.
LM@YW
Rosedale. New York
718-481-874
CARLSTADT, NJ 07072 Phone: (201) 433-3700
l
Fax: (201) 4334231
Circle 039 on reader card or go to Circle 024on reader card or go to www.thru.to/webconnect July 2002
www.thru.to/webconnect 57