BLASnNG MASK
US. Patent 5,989,689. Nov. 23, 1999 T. Komatsu et al., assignor to The Chromaline Corp., Duluth, Minn.
A sandblast mask laminate with blastable pressure-sensitive adhesive. ELECTROLYTIC COPPER FOIL
US. Patent 5,989,727. Nov. 23, 1999 C.B. Yates et al., assignors to Circuit Foil US.A. Inc. Gordentown, N.J.
A copper foil comprising electrolytic copper having a matte side and an opposite shiny side, a first electrodeposited copper gilding layer on the surface of the shiny side and an electrodeposited copper microroughening layer on the copper gilding layer.
DECORAnVE AND PROTEcnYE MULnLAYER COAnNG
PROTECTIVE COAnNG FOR MOAL COMPONENTS
U.S. Patent 5,989,730. Nov. 23 1999
US. Patent 5,989,735. Nov. 23, 1999 M. Ruimi and J.P. Guerbert-Jubert, assignors to Societe Nationale dEtude et de Construction de Moteurs dAuiation "SNECMA," Paris
R. W. Sugg et ai., assignors to Masco
Corp., Taylor, Mich.
An article comprising a substrate having disposed on at least a portion of its surface a multilayer coating comprising a layer of semibright nickel; a layer of bright nickel; a layer of tin-nickel alloy; a layer of zirconium or titanium; sandwich layer comprised of a plurality of alternating layers comprised of zirconium or titanium and of zirconium compound or titanium compound or titanium compound; and a layer comprised of zirconium compound or titanium compound.
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A protective coating for a metal component having good corrosion resistance in a saline atmosphere and comprising at least one layer of a tin-zinc alloy containing between 8 and 35% by weight of zinc and a sublayer of a zinc-nickel alloy containing between 10 to 16% of nickel, the sublayer of zinc-nickel alloy constituting about two thirds of the thickness of the coating.
COST EFFECTIVE INDUSTRIAL WASTEWATER SYSTEMS
COMPLIANCE
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RECYCLE
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International,lnc.
NA TIONWIDE SUPPLIER OF SYSTEMS WHICH INTEGRATE CHEMISTRY AND EQUIPMENT FOR COST EFFECTIVE TREATMENT, REUSE, AND RECYCLE OF INDUSTRIAL WASTEWATER WE MANUFACTURE: I CLiNED PLATE CLARIFIER SYSTEMS FROM 5 TO 1000 GPM SH)UENTIAL HATCH SYSTEMS FROM 250 TO 5000 (iALl.ON MEMBRANE SYSTEMS FROM 2 (jPM TO 250 (jPM ION EXCHAN(jE SYSTEMS FROM 2 TO IOU (jl'M SMALLER UNITS ARE SKID !\10lJNTED AND FlII.LY ASSEMBl.I:D - READY TO RUN
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Metal Finishing