ABSTRACTS ON ELECTRONICS RELIABILITY AND MICROMINIATURIZATION
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held in a fixed position and the appropriate mask is brought into contact with it. Also, all movement is by rolling rather than sliding, as the latter will result in seizing up of the surfaces. The masks themselves are made by etching the appropriate pattern in copper or molybdenum. The jig has been used satisfactorily to produce a number of circuits and other thin film devices. It was sometimes necessary to hold the substrate at 300°C; this was done without any ill effects to the jig. MISCELLANEOUS Thermoelectric cooling. J. E. BEAN, Ind. Electron. (Nov. 1962). The Pdtier effect, has now become a practicable method of small-scale refrigeration. This is a consequence of the development of semiconductors and very compact units are now available. T h i r d internat, symposium on quantum electronics. M. Y. BERNARD,L'Onde E[ectT~que, pp. 721737 (July-Aug. 1963). The third International Symposium on Quantum Electronics was held in Paris, 11-15 February 1963. One thousand scientists, from about thirty countries, went to the Palais of UNESCO and heard about hundred original communications and about fifty communications to precise a matter. The present article gives precisions on the various aspects of this important international scientific manifestation. (In French.) Printed circuits. Their contribution to reliable realisations their potentialities in miniaturisation. J. MARZlN,L'Onde Electrique, pp. 794-801 (July-Aug. 1963). Printed circuits, used originally mainly for economic reasons, have now become the indispensable adjunct of high performance complex apparatus. The author describes in detail the methods of obtaining metallised holes and analyses their characteristics. He also considers various methods of manufacture offering the possibility of improved performance. High definition multi-layer printed circuits will provide an excellent method of realizing and connecting together miniature and micro-miniature sub-assemblies. (In French.) Electron beam cutting techniques for electronic applications. F. R. SCHOLLHAMMER,Trans. I.E.E.E. PEP-7, No. 2, p. 16 (April 1963). The advantages of electron beam cutting are outlined. Specific production applications of these cutting techniques to electronic packaging are discussed in detail. Examples presented include: the etching of micro components; the scribing of thin films; the drilling and cutting of precision holes and slots in ceramic components; and the use of the electron beam cutter as a salvage tool.