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Events — 1998
March 1998
Additives for Polymers
However, when more than one flameretarding additive is used, there can be very interesting synergistic effects (which are not yet fully understood). The potential of a multi-additive approach is illustrated by a recent patent filed by the Japanese company Teijin Ltd:
April 6-8, Teddington, UK Humidity and Moisture - International Symposium: National Physical Laboratory, Teddington, TW 11 OLW, UK; tel: +44-l 8 1 943 6710; fax: +44-181 943 6306
Title: Polyamide resin composition of good obtained by mixing resistance f Ire polyamide resin with silicate powder, halogenated compound, antimony trioxide and PTFE.
April 22-24, Paris, France JournCes d’Etudes Composites - JEC ‘98 JEC, 65 rue de Prony, F-75854 Paris Cedex 17, France; tel: +33-l 4401 1643; fax: +33-l 4401 1665
Patent No. J07126523; priority date 2 November 1995, publication date 16 May 1995
June 3-6, Naples, Italy ECCM-8: European Conference on Composite Materials: ECCM-8, DIMPUniversity of Naples, Piazzale V. Tecchio, 80125 Naples, Italy; tel: +39-81 7682373; Fax: +39-81 627826
Description: A polyamide resin composition is obtained by mixing polyamide resin with 5-40 wt(% of silicate powder as an inorganic filler, lo-40 wt,% of a halogenated compound, 0.5-2 wt.% of Sb trioxide and 0.1-l wt.% of polytetrafluoroethylene resin obtained by emulsion polymerization. The polyamide component is an aliphatic polyamide (such as nylon 6 or nylon 66) or an aliphatic and alicyclic polyamide (such as polyhexamethylene terephthalamide or polyhexamethylene isophthalamide). The filler (preferably calcined kaolin or talc), should if possible be surface-treated with a coupling agent, such as a silane compound. The halogenated component should be a brominated polystyrene of 10 000-l 000 000 average molecular weight. The resulting flame-retarded compound can be used in automobile or electrical/electronic components. It offers a high resistance to tire and can also be electroplated. Contact: Teijin Ltd, 1-6-7, MinamiHonmachi, Chuo-ku, Osaka 541, Japan; tei: +81-6 268 2132; fax: +81-6 268 3210 (Extended summaries or full copies of the patents described here can be obtainedfrom Derwent Information Ltd, Derwent House, 24 Great Queen Street, London, WC2B 5DF, UK; tel: +44-I 71 355 2800; fmc: +44-l 71 344 2900)
01998 Elsevier Science
EVENTS - 1998
June 9- 13, Stockholm, Sweden 5th International Workshop on Biodegradable Plastics and Polymers: Prof. A-C Albertsson, Polymer Technology, Royal Institute of Technology, S-l 00 44 Stockholm, Sweden; fax: +46-810 0775 rune 15- 17, Beijing, China Functional fillers for plastics 98: The Asian opportunity: conference: lntertech Conferences, 411 US Route One, Portland MA 04105, USA; tel: +l-207 781 9800; fax: +l-207 781 2150 luly 13-17, Gold Coast, Australia 37th International Symposium on 4lacromolecules: APS 22 Secretariat, LJniversity of Auckland, PO Box 92019, 4uckland, New Zealand September 9- 11, 1998, Brighton, UK Polymer ‘98, conference: The Institute of ?hysics, 76 Portland Place, London WIN 4AA, UK; tel: +44-l 71 470 4800; fax: t44- 17 1 470 4900 October 22-29, 1998, Dusseldorf Germany K’98 - 14th International Exhibition NOWEA, Postfach 10 10 06, D-4000 1 Dusseldorf Germany; tel: +49-211 456C 900; fax: +49-211 4560 86100
Additives for Polymers
However, when more than one flameretarding additive is used, there can be very interesting synergistic effects (which are not yet fully understood). The potential of a multi-additive approach is illustrated by a recent patent filed by the Japanese company Teijin Ltd:
April 6-8, Teddington, UK Humidity and Moisture - International Symposium: National Physical Laboratory, Teddington, TW 11 OLW, UK; tel: +44-l 8 1 943 6710; fax: +44-181 943 6306
Title: Polyamide resin composition of good obtained by mixing resistance f Ire polyamide resin with silicate powder, halogenated compound, antimony trioxide and PTFE.
April 22-24, Paris, France JournCes d’Etudes Composites - JEC ‘98 JEC, 65 rue de Prony, F-75854 Paris Cedex 17, France; tel: +33-l 4401 1643; fax: +33-l 4401 1665
Patent No. J07126523; priority date 2 November 1995, publication date 16 May 1995
June 3-6, Naples, Italy ECCM-8: European Conference on Composite Materials: ECCM-8, DIMPUniversity of Naples, Piazzale V. Tecchio, 80125 Naples, Italy; tel: +39-81 7682373; Fax: +39-81 627826
Description: A polyamide resin composition is obtained by mixing polyamide resin with 5-40 wt(% of silicate powder as an inorganic filler, lo-40 wt,% of a halogenated compound, 0.5-2 wt.% of Sb trioxide and 0.1-l wt.% of polytetrafluoroethylene resin obtained by emulsion polymerization. The polyamide component is an aliphatic polyamide (such as nylon 6 or nylon 66) or an aliphatic and alicyclic polyamide (such as polyhexamethylene terephthalamide or polyhexamethylene isophthalamide). The filler (preferably calcined kaolin or talc), should if possible be surface-treated with a coupling agent, such as a silane compound. The halogenated component should be a brominated polystyrene of 10 000-l 000 000 average molecular weight. The resulting flame-retarded compound can be used in automobile or electrical/electronic components. It offers a high resistance to tire and can also be electroplated. Contact: Teijin Ltd, 1-6-7, MinamiHonmachi, Chuo-ku, Osaka 541, Japan; tei: +81-6 268 2132; fax: +81-6 268 3210 (Extended summaries or full copies of the patents described here can be obtainedfrom Derwent Information Ltd, Derwent House, 24 Great Queen Street, London, WC2B 5DF, UK; tel: +44-I 71 355 2800; fmc: +44-l 71 344 2900)
01998 Elsevier Science
EVENTS - 1998
June 9- 13, Stockholm, Sweden 5th International Workshop on Biodegradable Plastics and Polymers: Prof. A-C Albertsson, Polymer Technology, Royal Institute of Technology, S-l 00 44 Stockholm, Sweden; fax: +46-810 0775 rune 15- 17, Beijing, China Functional fillers for plastics 98: The Asian opportunity: conference: lntertech Conferences, 411 US Route One, Portland MA 04105, USA; tel: +l-207 781 9800; fax: +l-207 781 2150 luly 13-17, Gold Coast, Australia 37th International Symposium on 4lacromolecules: APS 22 Secretariat, LJniversity of Auckland, PO Box 92019, 4uckland, New Zealand September 9- 11, 1998, Brighton, UK Polymer ‘98, conference: The Institute of ?hysics, 76 Portland Place, London WIN 4AA, UK; tel: +44-l 71 470 4800; fax: t44- 17 1 470 4900 October 22-29, 1998, Dusseldorf Germany K’98 - 14th International Exhibition NOWEA, Postfach 10 10 06, D-4000 1 Dusseldorf Germany; tel: +49-211 456C 900; fax: +49-211 4560 86100