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Failure analysis of linear ICs
Mieroelectronics and Reliability, Vol. 13, p p . 7 5 - 8 4 . P e r g a m o n Press, 1974. P r i n t e d in G r e a t Britain
W O R L D ABSTRACTS O N M I C R O E L E C T R O N I C S A N D RELIABILITY THE abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects : 1. Reliability General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. ,~. Microelect ronics--General. 5. Microelectronics Design and Construction. 6. Microelectronics--Components, Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Circuits and Materials. 9. Electron, Ion and Laser Beams. Abstracts marked * are acknowledged from R and D Abstracts, published by Mintech Reports Centre (TRC), Orpington, Kent BR5 3RF. 1. R E L I A B I L I T Y - - - G E N E R A L
Relating factory test failure results to field reliability, required field maintenance, and to total life cycle costs. C. M. RYERSON, Microelectron. & Reliab. 12, 357 (1973). An alternate title to this report could well be How to spend reliability dollars to save maintenance millions. The new approach to system total integrated life cycle explained herein now provides for accomplishing this. Analytical and control tools for management are described which make it possible to relate cause and effect in the seven key factors in the total life cycle of all hardware systems. These controlling factors are: (1) Design emphasis and priorities; (2) Component selection and control; (3) Factory process weaknesses and control; (4) Factory and demonstration test failure results; (5) Achieved field reliability; (6) Required field maintenance; (7) Total life cycle cost.
A review of new methods and attitudes in reliability engineering. H. S. BLANKS. Microelectron. & Reliab. 12, 301 (1973). The paper reviews new attitudes and methods in reliability engineering, showing inter alia, the growing scepticism about, and sophistication of, reliability prediction. The emphasis on reliability physics and reliability improvement programs is discussed, as well as recent work on accelerated testing, component screening and reliability testing of integrated circuits by means of a standard component. Recently investigated failure mechanisms and tools of analysis are reviewed. The U.K. BS9000 scheme and its status are briefly discussed.
2. R E L I A B I L I T Y
OF COMPONENTS,
Ausfall-analyse integrierter Analog-Schaltungen (Failure analysis of linear ICs) (in German) by P. BECKER. Radio Mentor Electron. 40, 020 (1974). Failure analysis of linear ICs. When checking ICs as delivered the percentage of failure is 0"6 per cent with linear ICs and 0-35 per cent with digital ones. To assure a high quality standard of the equipment to be built a thorough failure analysis is necessary. The procedure of such an analysis is discussed in detail. After an explanation of the different parts of an IC typical samples of component failures are given.
TUBES, TRANSISTORS
A N D ICs
DLR-FB-73-33. pp. 69 53 ref. (1973). Starting from the fundamental demand of the constancy of the electrical resistance of solder joints in electronics all facts influencing this were summarized after consulting the relevant literature. It appears that the elastic and plastic behaviour of the used metals and alloys are of great importance. The main part contains a s u m m a r y of facts which influence the strength features.
Faulty-contact detection in communications systems. J. MANSFELD. T E S I A Electronics 10, 259 (1973). A method is described which is intended for the detection of faulty contacts in one-ports, two-ports and any complex equipment. The method relies on evaluation of a change in the transfer function of the object under test. This change can be caused by changed resistance of the faulty contact due to vibration. The parameters of the new TESLA faulty-contact detector are presented. The instrument detects faulty contacts in communications equipment operating over a range of 4kHz 10MHz.
Logic tester uses single trial procedure to troubleshoot digital IC boards. D. P. ALLEN. Electronics 89 (Nov. 1973). Combining the properties of a logic probe, a logic clip, and an IC comparator, this hand-held instrument promises significant cost reductions, both in factory use and in checking actual systems operating in the field. *Significance of strength for the reliability of solder joints in electronics (in German) by G. GOHLE. Deutsche Forschungsu. Versuchsanstalt Luft-u. Raumf., G e r m a n y T73-08016 75
W O R L D ABSTRACTS O N M I C R O E L E C T R O N I C S A N D RELIABILITY THE abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the article. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects : 1. Reliability General. 2. Reliability of Components, Tubes, Transistors and ICs. 3. Circuit and Systems Reliability, Maintenance and Redundancy. ,~. Microelect ronics--General. 5. Microelectronics Design and Construction. 6. Microelectronics--Components, Systems and Equipments. 7. Semiconductor Integrated Circuits, Devices and Materials. 8. Thick- and Thin-Film Components, Circuits and Materials. 9. Electron, Ion and Laser Beams. Abstracts marked * are acknowledged from R and D Abstracts, published by Mintech Reports Centre (TRC), Orpington, Kent BR5 3RF. 1. R E L I A B I L I T Y - - - G E N E R A L
Relating factory test failure results to field reliability, required field maintenance, and to total life cycle costs. C. M. RYERSON, Microelectron. & Reliab. 12, 357 (1973). An alternate title to this report could well be How to spend reliability dollars to save maintenance millions. The new approach to system total integrated life cycle explained herein now provides for accomplishing this. Analytical and control tools for management are described which make it possible to relate cause and effect in the seven key factors in the total life cycle of all hardware systems. These controlling factors are: (1) Design emphasis and priorities; (2) Component selection and control; (3) Factory process weaknesses and control; (4) Factory and demonstration test failure results; (5) Achieved field reliability; (6) Required field maintenance; (7) Total life cycle cost.
A review of new methods and attitudes in reliability engineering. H. S. BLANKS. Microelectron. & Reliab. 12, 301 (1973). The paper reviews new attitudes and methods in reliability engineering, showing inter alia, the growing scepticism about, and sophistication of, reliability prediction. The emphasis on reliability physics and reliability improvement programs is discussed, as well as recent work on accelerated testing, component screening and reliability testing of integrated circuits by means of a standard component. Recently investigated failure mechanisms and tools of analysis are reviewed. The U.K. BS9000 scheme and its status are briefly discussed.
2. R E L I A B I L I T Y
OF COMPONENTS,
Ausfall-analyse integrierter Analog-Schaltungen (Failure analysis of linear ICs) (in German) by P. BECKER. Radio Mentor Electron. 40, 020 (1974). Failure analysis of linear ICs. When checking ICs as delivered the percentage of failure is 0"6 per cent with linear ICs and 0-35 per cent with digital ones. To assure a high quality standard of the equipment to be built a thorough failure analysis is necessary. The procedure of such an analysis is discussed in detail. After an explanation of the different parts of an IC typical samples of component failures are given.
TUBES, TRANSISTORS
A N D ICs
DLR-FB-73-33. pp. 69 53 ref. (1973). Starting from the fundamental demand of the constancy of the electrical resistance of solder joints in electronics all facts influencing this were summarized after consulting the relevant literature. It appears that the elastic and plastic behaviour of the used metals and alloys are of great importance. The main part contains a s u m m a r y of facts which influence the strength features.
Faulty-contact detection in communications systems. J. MANSFELD. T E S I A Electronics 10, 259 (1973). A method is described which is intended for the detection of faulty contacts in one-ports, two-ports and any complex equipment. The method relies on evaluation of a change in the transfer function of the object under test. This change can be caused by changed resistance of the faulty contact due to vibration. The parameters of the new TESLA faulty-contact detector are presented. The instrument detects faulty contacts in communications equipment operating over a range of 4kHz 10MHz.
Logic tester uses single trial procedure to troubleshoot digital IC boards. D. P. ALLEN. Electronics 89 (Nov. 1973). Combining the properties of a logic probe, a logic clip, and an IC comparator, this hand-held instrument promises significant cost reductions, both in factory use and in checking actual systems operating in the field. *Significance of strength for the reliability of solder joints in electronics (in German) by G. GOHLE. Deutsche Forschungsu. Versuchsanstalt Luft-u. Raumf., G e r m a n y T73-08016 75