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Fault-tree analysis: a knowledge-engineering approach
538
World abstracts on microelectronics and reliability
the best found in the literature. Due to larger overheads required, the R A F F T - G F P algorithm is superior for problem sizes larger than about 4000 components, in terms of both computation and CPU time for the examples studied in this paper. Lastly, studies of very large systems with unequal reliabilities indicate that the binomial distribution gives a good approximation for generating function coefficients, allowing algebraic solutions for system reliability.
An O(k 3. log(n/k)) algorithm for the consecutive-k-outof-n:F system. FRANK K. HWANG and PAUL E. WRIGHT. IEEE Transactions on Reliability, 44(1), 128 (March 1995). The fastest generally-recognized algorithms for computing the reliability of consecutivek-out-of-n:F systems require O(n) time, for both the linear and circular systems. Our new algorithm requires O(k3.1og(n/k)) time. The algorithm can be extended to yield an O(n'max{k3"log(n/k),log(n)}) total time procedure for solving the combinatorial problem of counting the number of working states, with w working and n - w failed components, w = l , 2 . . . . ,n.
An exact recursion relation solution for the steady-state surface temperature of a general multilayer structure. JOHN ALBERS. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 180), 31 (March 1995). A recursion relation technique has been used in the past to determine the surface potential from the multilayer electrical Laplace equation. This has provided for a vastly simplified evaluation of the electrical spreading resistance and four-probe resistance. The isomorphism of the multilayer Laplace equation and the multilayer steady-state heat flow equation suggests the possibility of developing a recursion relation applicable to the multilayer thermal problem. This recursive technique is developed and is shown to provide the surface temperature of the multilayer steady-state heat flow equation. For the three-layer case, the thermal recursion relation readily yields the surface results, which are identical with those presented by Kokkas and the TXYZ thermal code. This recursive technique can be used with any number of layers while incurring only a small increase in computation time for each added layer. For the case of complete, uniform top surface coverage by a heat source, the technique gives rise to the generalized one-dimensional thermal resistance result. An example of the use of the new recursive method is provided by the preliminary calculations of the surface temperature of a buried oxide (SOI, SIMOX) structure containing several thicknesses of the surface silicon layers. This new technique should prove prove useful in the investigation and understanding of the steady-state thermal response of modern multilayer microelectronic structures.
Reliability prediction and estimation of Prolog programmes. ALIREZA AZEM, FEVZI BELLI and PIOTR JEDRZEJOWICZ. IEEE Transactions on Reliability, 43(4), 542 (December 1994). This paper presents an approach to reliability prediction and estimation of Prolog programs, and introduces two complexity measures for Prolog programs. The structural complexity measure refers to the program's static characteristics: size and number of clauses, clause arguments (number and types), and clause types (facts or rules). The operational complexity measure refers to the program's dynamic characteristics: execution frequency of program components, user behavior, and backtracking and recursion. Values of the two measures are used to: (l) predict Prolog-program reliability before testing and in the early testing stages and (2) estimate the reliability as a function of time, in order to determine whether the reliability objective is achieved. The feature-oriented reliability determination approach leads to improvements in the accuracy of software-reliability predictions and estimations. Detection of multiple faults using SSFTS in CMOS logic circuits. CAROL Q. TONG and DING LU. Computers and Electronic Engineering, 21(4), 271 (1995). With the increasing density of CMOS VLSI circuits, it is necessary to test for the combinations of different multiple faults. This paper studies the possibility of using single stuck-at fault test set (SSFTS) to detect multiple faults and their combinations. The paper shows that a single stuck-at-fault test set can detect single and multiple self-feedback bridging faults, combinations of feedback bridging, input bridging and stuck-on faults when current monitoring is done. We also prove that a single stuck-at fault test set can detect the combination of single stuck-open fault and some other faults like bridging and stuck-on faults when both logic and current monitoring are done. Fault-tree analysis: a knowledge-engineering approach. JOSE ANTONIO BOGARIN GEYMAYR and NELSON FRANCISCO FAVILLA EBECKEN. IEEE Transactions on Reliability, 44(1), 37 (March 1995). This paper deals with the application of knowledge-engineering, and a methodology for the assessment and measurement of reliability, availability, maintainability and safety of industrial systems using fault-tree representation. Object oriented structures, production rules representing the expert's heuristics, algorithms and database structures are the basic elements of the system. The blackboard architecture of the system supports qualitative and quantitative evaluation of the fault tree. A fuzzy set approach analyzes problems with few failure data or much fuzziness or imprecision. Fault-tree analysis is a knowledge acquisition structure that has been extensively explored by knowledge engineers. Reliability engineers can apply the techniques developed by this area of computer science to: (1) improve the data acquisition process; (2) explore the benefits of
World abstracts on microelectronics and reliability object oriented expert systems for reliability applications; (3) integrate the several sources of knowledge into a unique system; (4) explore the approximate reasoning to handle uncertainty and (5) develop hybrid solution strategies combining expert heuristics, conventional procedures and available failure data.
Rationalizing scheduled-maintenance requirements using reliability centered maintenance---A Canadian Air Force perspective. L U G W I G J. H O L L I C K and GREG N. NELSON. Proceedings of the Annual IEEE Reliability and Maintainability Symposium, 11 (1995). Failure Modes and Effects Analysis (FMEA) and Reliability Centred Maintenance (RCM)/Maintenance Steering Group (MSG) decision logic have been successfully used by military and commercial avaiation manufacturers for over three decades to develop preventive maintenance programs for new aircraft fleets. However, once a fleet is in place, there is a requirement to periodically validate or rationalize the applicability and effectiveness of individual tasks in the program, and to adjust task frequencies. Experience has shown that it is inefficient to re-apply F M E A / R C M decision logic to every aircraft item on a fixed frequency basis. This paper identifies how the Canadian Air Force (CAF) proposes to make more efficient and effective use of the in-service data it collects to identify those items for which the preventive maintenance requirement is ineffective or nonapplicable. Moreover, it discusses how the same data source can be used in follow-up investigation to determine the actual failure mode history of an item as a basis for comparison with the FMEA; the basis upon which the requirement for the existing tasks is developed.
Cumulative
balance
testing
of
logic
circuits.
K R I S H E N D U CHAKRABARTY and JOHN P. HAYES. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 3(1), 72 (March 1995). We present a new test response compression method called cumulative balance testing (CBT) that extends both balance testing and accumulator compression testing. CBT uses an accumulated balance signature, and it guarantees very high error coverage (over 99~o) for various error models. We demonstrate that the single stuck-line (SSL) fault coverage of CBT for many of the ISCAS 85 combinational benchmarch circuits is 100~o, and for all but one circuit, the fault coverage is over 99.5°/o. To make processor circuits self-testing, any existing accumulators and counters can be exploited to implement CBT. Its ease of implementation, provably high error coverage, and exceptionally high SSL fault coverage, even with reduced (nonexhaustive) test sets, make CBT suitable for the built-in self testing of processor circuits that require a guaranteed level of test confidence.
539
Optimal preventive-replacement intervals for the Weibull life distribution: solutions and applications. J. HUANG, C. g. MILLER and O. G. OKOGBAA.
Proceedings of the Annual IEEE Reliability and Maintainability Symposium, 370 (1995). Using a well-known single-unit replacement model with Weibull failure distribution assumption, normalization is used to reduce the model input parameters such that standard optimal preventive replacement solutions can be generated. Characteristics of the model solutions are discussed. The standard solutions are organized in charts and tables for ease of use. Procedures are developed and examples are given for applying the standard solutions for engineering problems with different system parameters. It is believed that the generated standard solutions and the developed procedures will be helpful for maintenance practitioners to apply theoretical research results in industrial practice.
Power cycling and stress variation in a multichip module. BISWAJIT SUR and I W O N A TURLIK. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18(2), 388 (May 1995). The effect of inelastic (creep and plastic) deformation of solder joints during power cycling of a specific multichip module is presented here. The utilized finite element technique allows one to account for the stress redistribution in the module as a function of time while the deformation/creep of the solder joints occur. It is shown that a nonuniform stress distribution exists in the module during power cycling, which affects and controls the inelastic deformation and fatigue life of solder joints. It is also shown that the choice of a suitable material and geometry for different components contained in the module plays a very important role in enhancing the fatigue life of solder joints.
Latent open defect detection using phase-sensitive nonlinearity detection technique. A R N O L D HALPERIN, THOMAS H. DISTEFANO and SHINWU CHIANG. IEEE Transactions on Components,
Packaging, and Manufacturing Technology, Part B, 18(2), 358 (May 1995). Alternating and direct electric currents are applied through the metal interconnections in electronic packaging to detect potential electrical opens, such as the line narrowings, notches, nicks, cracks, weak connections and interface contaminations. Due to the nonlinear relationship between the voltage across and current through the metal conductor, distortion signals are generated by the defect region as well as the good conductor. The signal generated from a latent open defect can be detected by comparing the defect signal phase with the reference phase produced by the good conductor. Application of this technique to electronic packaging development and manufacturing can improve product reliability and reduce cost by early detection of latent open defects.
World abstracts on microelectronics and reliability
the best found in the literature. Due to larger overheads required, the R A F F T - G F P algorithm is superior for problem sizes larger than about 4000 components, in terms of both computation and CPU time for the examples studied in this paper. Lastly, studies of very large systems with unequal reliabilities indicate that the binomial distribution gives a good approximation for generating function coefficients, allowing algebraic solutions for system reliability.
An O(k 3. log(n/k)) algorithm for the consecutive-k-outof-n:F system. FRANK K. HWANG and PAUL E. WRIGHT. IEEE Transactions on Reliability, 44(1), 128 (March 1995). The fastest generally-recognized algorithms for computing the reliability of consecutivek-out-of-n:F systems require O(n) time, for both the linear and circular systems. Our new algorithm requires O(k3.1og(n/k)) time. The algorithm can be extended to yield an O(n'max{k3"log(n/k),log(n)}) total time procedure for solving the combinatorial problem of counting the number of working states, with w working and n - w failed components, w = l , 2 . . . . ,n.
An exact recursion relation solution for the steady-state surface temperature of a general multilayer structure. JOHN ALBERS. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 180), 31 (March 1995). A recursion relation technique has been used in the past to determine the surface potential from the multilayer electrical Laplace equation. This has provided for a vastly simplified evaluation of the electrical spreading resistance and four-probe resistance. The isomorphism of the multilayer Laplace equation and the multilayer steady-state heat flow equation suggests the possibility of developing a recursion relation applicable to the multilayer thermal problem. This recursive technique is developed and is shown to provide the surface temperature of the multilayer steady-state heat flow equation. For the three-layer case, the thermal recursion relation readily yields the surface results, which are identical with those presented by Kokkas and the TXYZ thermal code. This recursive technique can be used with any number of layers while incurring only a small increase in computation time for each added layer. For the case of complete, uniform top surface coverage by a heat source, the technique gives rise to the generalized one-dimensional thermal resistance result. An example of the use of the new recursive method is provided by the preliminary calculations of the surface temperature of a buried oxide (SOI, SIMOX) structure containing several thicknesses of the surface silicon layers. This new technique should prove prove useful in the investigation and understanding of the steady-state thermal response of modern multilayer microelectronic structures.
Reliability prediction and estimation of Prolog programmes. ALIREZA AZEM, FEVZI BELLI and PIOTR JEDRZEJOWICZ. IEEE Transactions on Reliability, 43(4), 542 (December 1994). This paper presents an approach to reliability prediction and estimation of Prolog programs, and introduces two complexity measures for Prolog programs. The structural complexity measure refers to the program's static characteristics: size and number of clauses, clause arguments (number and types), and clause types (facts or rules). The operational complexity measure refers to the program's dynamic characteristics: execution frequency of program components, user behavior, and backtracking and recursion. Values of the two measures are used to: (l) predict Prolog-program reliability before testing and in the early testing stages and (2) estimate the reliability as a function of time, in order to determine whether the reliability objective is achieved. The feature-oriented reliability determination approach leads to improvements in the accuracy of software-reliability predictions and estimations. Detection of multiple faults using SSFTS in CMOS logic circuits. CAROL Q. TONG and DING LU. Computers and Electronic Engineering, 21(4), 271 (1995). With the increasing density of CMOS VLSI circuits, it is necessary to test for the combinations of different multiple faults. This paper studies the possibility of using single stuck-at fault test set (SSFTS) to detect multiple faults and their combinations. The paper shows that a single stuck-at-fault test set can detect single and multiple self-feedback bridging faults, combinations of feedback bridging, input bridging and stuck-on faults when current monitoring is done. We also prove that a single stuck-at fault test set can detect the combination of single stuck-open fault and some other faults like bridging and stuck-on faults when both logic and current monitoring are done. Fault-tree analysis: a knowledge-engineering approach. JOSE ANTONIO BOGARIN GEYMAYR and NELSON FRANCISCO FAVILLA EBECKEN. IEEE Transactions on Reliability, 44(1), 37 (March 1995). This paper deals with the application of knowledge-engineering, and a methodology for the assessment and measurement of reliability, availability, maintainability and safety of industrial systems using fault-tree representation. Object oriented structures, production rules representing the expert's heuristics, algorithms and database structures are the basic elements of the system. The blackboard architecture of the system supports qualitative and quantitative evaluation of the fault tree. A fuzzy set approach analyzes problems with few failure data or much fuzziness or imprecision. Fault-tree analysis is a knowledge acquisition structure that has been extensively explored by knowledge engineers. Reliability engineers can apply the techniques developed by this area of computer science to: (1) improve the data acquisition process; (2) explore the benefits of
World abstracts on microelectronics and reliability object oriented expert systems for reliability applications; (3) integrate the several sources of knowledge into a unique system; (4) explore the approximate reasoning to handle uncertainty and (5) develop hybrid solution strategies combining expert heuristics, conventional procedures and available failure data.
Rationalizing scheduled-maintenance requirements using reliability centered maintenance---A Canadian Air Force perspective. L U G W I G J. H O L L I C K and GREG N. NELSON. Proceedings of the Annual IEEE Reliability and Maintainability Symposium, 11 (1995). Failure Modes and Effects Analysis (FMEA) and Reliability Centred Maintenance (RCM)/Maintenance Steering Group (MSG) decision logic have been successfully used by military and commercial avaiation manufacturers for over three decades to develop preventive maintenance programs for new aircraft fleets. However, once a fleet is in place, there is a requirement to periodically validate or rationalize the applicability and effectiveness of individual tasks in the program, and to adjust task frequencies. Experience has shown that it is inefficient to re-apply F M E A / R C M decision logic to every aircraft item on a fixed frequency basis. This paper identifies how the Canadian Air Force (CAF) proposes to make more efficient and effective use of the in-service data it collects to identify those items for which the preventive maintenance requirement is ineffective or nonapplicable. Moreover, it discusses how the same data source can be used in follow-up investigation to determine the actual failure mode history of an item as a basis for comparison with the FMEA; the basis upon which the requirement for the existing tasks is developed.
Cumulative
balance
testing
of
logic
circuits.
K R I S H E N D U CHAKRABARTY and JOHN P. HAYES. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 3(1), 72 (March 1995). We present a new test response compression method called cumulative balance testing (CBT) that extends both balance testing and accumulator compression testing. CBT uses an accumulated balance signature, and it guarantees very high error coverage (over 99~o) for various error models. We demonstrate that the single stuck-line (SSL) fault coverage of CBT for many of the ISCAS 85 combinational benchmarch circuits is 100~o, and for all but one circuit, the fault coverage is over 99.5°/o. To make processor circuits self-testing, any existing accumulators and counters can be exploited to implement CBT. Its ease of implementation, provably high error coverage, and exceptionally high SSL fault coverage, even with reduced (nonexhaustive) test sets, make CBT suitable for the built-in self testing of processor circuits that require a guaranteed level of test confidence.
539
Optimal preventive-replacement intervals for the Weibull life distribution: solutions and applications. J. HUANG, C. g. MILLER and O. G. OKOGBAA.
Proceedings of the Annual IEEE Reliability and Maintainability Symposium, 370 (1995). Using a well-known single-unit replacement model with Weibull failure distribution assumption, normalization is used to reduce the model input parameters such that standard optimal preventive replacement solutions can be generated. Characteristics of the model solutions are discussed. The standard solutions are organized in charts and tables for ease of use. Procedures are developed and examples are given for applying the standard solutions for engineering problems with different system parameters. It is believed that the generated standard solutions and the developed procedures will be helpful for maintenance practitioners to apply theoretical research results in industrial practice.
Power cycling and stress variation in a multichip module. BISWAJIT SUR and I W O N A TURLIK. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18(2), 388 (May 1995). The effect of inelastic (creep and plastic) deformation of solder joints during power cycling of a specific multichip module is presented here. The utilized finite element technique allows one to account for the stress redistribution in the module as a function of time while the deformation/creep of the solder joints occur. It is shown that a nonuniform stress distribution exists in the module during power cycling, which affects and controls the inelastic deformation and fatigue life of solder joints. It is also shown that the choice of a suitable material and geometry for different components contained in the module plays a very important role in enhancing the fatigue life of solder joints.
Latent open defect detection using phase-sensitive nonlinearity detection technique. A R N O L D HALPERIN, THOMAS H. DISTEFANO and SHINWU CHIANG. IEEE Transactions on Components,
Packaging, and Manufacturing Technology, Part B, 18(2), 358 (May 1995). Alternating and direct electric currents are applied through the metal interconnections in electronic packaging to detect potential electrical opens, such as the line narrowings, notches, nicks, cracks, weak connections and interface contaminations. Due to the nonlinear relationship between the voltage across and current through the metal conductor, distortion signals are generated by the defect region as well as the good conductor. The signal generated from a latent open defect can be detected by comparing the defect signal phase with the reference phase produced by the good conductor. Application of this technique to electronic packaging development and manufacturing can improve product reliability and reduce cost by early detection of latent open defects.