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Gas purity requirements for titanium silicide metalization
World Abstracts on Microelectronics and Reliability ring is suitable for inclusion in the final package. The unsupported ring has two specific advantages over cornersupported rings heretofore available. Outer lead excise tooling needs only pierce copper, and may be of simple square design. In addition, the entire periphery of the floating annulus may be used for lead layout, whereas supported rings require certain areas (usually corners) to be free of leads.
New process for automated IC assembly manufacturing. DANIEL J. QUINN and ROBERT H. BOND. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 391 (1987). A novel assembly process, designed for automation, has been developed and implemented. This paper describes both the equipment and processes employed by this technology. The key features of the design are the use of the whole top surface of the chip for assembly, large bonding pads to reduce the required mechanical accuracies, and elimination of wire bonding and chip attach by bonding the chip directly to the leadframe. All bonds are being made simultaneously to a strip of leadframe. Other features such as the thermal and electrical characteristics, corrosion resistance, and environmental stress results are also discussed.
Thermal management of air- and liquid-cooled multichip modules. AVRAMBAR-COHEN.IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 159 (1987). The state-of-the-art in air- and liquid-cooled multichip modules is examined. An effort is made to identify the salient features of eight distinct modules, define their thermal characteristics, and establish a consistent basis for comparing and evaluating their thermal performance.
Optimizing the wire-bonding process for copper ball bonding, using classic experimental designs. MICHAELSHEAFFER,LEE R. LEVlNE and BRIAN SCHLAIN.IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 321 (1987). Two classic experimental designs were used to develop the copper ball bonding process. A two-level factorial design was used to screen five process variables simultaneously and determine whether any of them had a significant effect on the process. A four-factor central composite design was used to optimize and map the bonding process window. The efficiency of using designed experiments allowed the development of the process and the achievement of a major milestone in only 15 experiments. The experimental designs which were used have wide application for process development and optimization. The concepts can be easily taught so that the experiments can become a standard for process technicians to follow. The use and analysis of these experimental designs are described.
The fundamental limits for electronic packaging and systems. WILLIAM E. PENCE and J. PETER KRUSIUS. IEEE Trans. Compon. Hydrids mfg Technol. CHMT-10, 176 (1987). A systems analysis of the fundamental physical laws that will eventually restrict the evolution of all electronic systems is presented. To formulate the analysis, a logical framework based on a minimum set of three critical hardware parameters is constructed. These parameters serve as variables in the quantification of the physical laws as they affect electronic systems. The parameters to reduce the array of fundamental constraints to simple mathematical relationships have been chosen, which can be plotted into the space spanned by the parameter set. The mathematical relationships, together with operational criteria such as noise margins and package thermal resistance, partition this space into allowed and forbidden regions. By placing current systems into the allowed region, it is shown that current technology is approaching several fundamental limits simultaneously. It is clear from this analysis that the approach to systems design will have to be integrated to include all levels in the system package, in order to optimize the performance of the system as a whole. The properties that a systems package must
833
possess if it is to successfully combat these approaching limits is discussed.
Surface attach chip carriers for conventional and highperformance applications. FRANK STARK. IEEE Trans. Compon. Hybrids mf# Technol. CHMT-10, 152 (1987). Three types of surface attach chip carriers are available for systems use: leadless ceramic and plastic packages, leaded plastic and ceramic packages, and a new updated version of the leadless ceramic packages suitable only for socketing. These new packages have high lead,count, copper leads, and provisions for internal decoupling capacitors. These three packaging types and the important role that sockets play in system design are discussed.
Wet bench fire suppression. PETER H. SINGER.Semiconductor int., 154 (September 1987). It's the smoke, not the fire, that can cause the most damage in an IC lab.
Resist image reversal for next-generation VLSI circuit fabrication. JOHN HOCK, CHARLESKING and JOHN HELBERT. Semiconductor int., 164 (September 1987). Image reversal process extends effective resolution of projection aligners, provides vertical edge walls for dry etching, and superior resist image CD control.
Gas purity requirements for titanium silicide metalization. HENRY BERGER. Semiconductor int., 137 (September 1987). Gas contamination during Ti silicide anneals affects the sheet resistance of the resulting film. Sources of contamination must be understood to obtain optimal control over the process.
The clean module: advanced technology for processing silicon wafers. D. I. GOLLAND,P. D. ALBRECHT,W. C. KRUSSELand P. A. PUERTO. Semiconductor int., 184 (September 1987). Developed specifically for processing silicon wafers, the clean module can be readily adapted to IC wafer fabrication.
Electrical modeling of interconnections in multilayer packaging structures. ALGIERD A. PAI~US1NSKI,J. C. LIAO, PAUL E. TESCHAN, JOHN L. PRINCE and FRANCISCO QUINTERO. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 217 (1987). An effort toward modeling the interconnections in selected typical multilayer packaging structures is presented. The modeling is based on a quasistatic approximation to the associated electro-magnetic problems. A program for computing capacitance and inductance matrices and the numerical techniques used to improve the program efficiency are described. The results of numerical testing of the program are provided and discussed. The program was also compared with experimental data published in the open literature and the results are shown. The agreement between the model and the experiments is satisfactory.
Investigation of aluminum ball bonding mechanism. JIN ONUKI, MASATERUSUWA, MASAHIROKOIZUM1and TOMIO hZUKA.IEEE Trans. Compon. Hybrids mfff Technol. CHMT10, 242 (1987). The effects of various factors, e.g. ball hardness, amount of ball deformation, thickness, and surface cleanliness of the aluminum electrode, which can influence bonding strength were investigated. Metallurgical bonding between balls and electrodes occurs by rupturing the oxide film existing on the aluminum electrodes and proceeds from outside, inwards to the center of the bonds. The bonding strength is found to be a linear function of the true bonded area between balls and electrodes. The factors increasing the true bonded area are a high ball hardness, a large amount of deformation, a thick aluminum electrode, and a clean electrode surface. In addition, a high strength ball bonding
New process for automated IC assembly manufacturing. DANIEL J. QUINN and ROBERT H. BOND. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 391 (1987). A novel assembly process, designed for automation, has been developed and implemented. This paper describes both the equipment and processes employed by this technology. The key features of the design are the use of the whole top surface of the chip for assembly, large bonding pads to reduce the required mechanical accuracies, and elimination of wire bonding and chip attach by bonding the chip directly to the leadframe. All bonds are being made simultaneously to a strip of leadframe. Other features such as the thermal and electrical characteristics, corrosion resistance, and environmental stress results are also discussed.
Thermal management of air- and liquid-cooled multichip modules. AVRAMBAR-COHEN.IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 159 (1987). The state-of-the-art in air- and liquid-cooled multichip modules is examined. An effort is made to identify the salient features of eight distinct modules, define their thermal characteristics, and establish a consistent basis for comparing and evaluating their thermal performance.
Optimizing the wire-bonding process for copper ball bonding, using classic experimental designs. MICHAELSHEAFFER,LEE R. LEVlNE and BRIAN SCHLAIN.IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 321 (1987). Two classic experimental designs were used to develop the copper ball bonding process. A two-level factorial design was used to screen five process variables simultaneously and determine whether any of them had a significant effect on the process. A four-factor central composite design was used to optimize and map the bonding process window. The efficiency of using designed experiments allowed the development of the process and the achievement of a major milestone in only 15 experiments. The experimental designs which were used have wide application for process development and optimization. The concepts can be easily taught so that the experiments can become a standard for process technicians to follow. The use and analysis of these experimental designs are described.
The fundamental limits for electronic packaging and systems. WILLIAM E. PENCE and J. PETER KRUSIUS. IEEE Trans. Compon. Hydrids mfg Technol. CHMT-10, 176 (1987). A systems analysis of the fundamental physical laws that will eventually restrict the evolution of all electronic systems is presented. To formulate the analysis, a logical framework based on a minimum set of three critical hardware parameters is constructed. These parameters serve as variables in the quantification of the physical laws as they affect electronic systems. The parameters to reduce the array of fundamental constraints to simple mathematical relationships have been chosen, which can be plotted into the space spanned by the parameter set. The mathematical relationships, together with operational criteria such as noise margins and package thermal resistance, partition this space into allowed and forbidden regions. By placing current systems into the allowed region, it is shown that current technology is approaching several fundamental limits simultaneously. It is clear from this analysis that the approach to systems design will have to be integrated to include all levels in the system package, in order to optimize the performance of the system as a whole. The properties that a systems package must
833
possess if it is to successfully combat these approaching limits is discussed.
Surface attach chip carriers for conventional and highperformance applications. FRANK STARK. IEEE Trans. Compon. Hybrids mf# Technol. CHMT-10, 152 (1987). Three types of surface attach chip carriers are available for systems use: leadless ceramic and plastic packages, leaded plastic and ceramic packages, and a new updated version of the leadless ceramic packages suitable only for socketing. These new packages have high lead,count, copper leads, and provisions for internal decoupling capacitors. These three packaging types and the important role that sockets play in system design are discussed.
Wet bench fire suppression. PETER H. SINGER.Semiconductor int., 154 (September 1987). It's the smoke, not the fire, that can cause the most damage in an IC lab.
Resist image reversal for next-generation VLSI circuit fabrication. JOHN HOCK, CHARLESKING and JOHN HELBERT. Semiconductor int., 164 (September 1987). Image reversal process extends effective resolution of projection aligners, provides vertical edge walls for dry etching, and superior resist image CD control.
Gas purity requirements for titanium silicide metalization. HENRY BERGER. Semiconductor int., 137 (September 1987). Gas contamination during Ti silicide anneals affects the sheet resistance of the resulting film. Sources of contamination must be understood to obtain optimal control over the process.
The clean module: advanced technology for processing silicon wafers. D. I. GOLLAND,P. D. ALBRECHT,W. C. KRUSSELand P. A. PUERTO. Semiconductor int., 184 (September 1987). Developed specifically for processing silicon wafers, the clean module can be readily adapted to IC wafer fabrication.
Electrical modeling of interconnections in multilayer packaging structures. ALGIERD A. PAI~US1NSKI,J. C. LIAO, PAUL E. TESCHAN, JOHN L. PRINCE and FRANCISCO QUINTERO. IEEE Trans. Compon. Hybrids mfg Technol. CHMT-10, 217 (1987). An effort toward modeling the interconnections in selected typical multilayer packaging structures is presented. The modeling is based on a quasistatic approximation to the associated electro-magnetic problems. A program for computing capacitance and inductance matrices and the numerical techniques used to improve the program efficiency are described. The results of numerical testing of the program are provided and discussed. The program was also compared with experimental data published in the open literature and the results are shown. The agreement between the model and the experiments is satisfactory.
Investigation of aluminum ball bonding mechanism. JIN ONUKI, MASATERUSUWA, MASAHIROKOIZUM1and TOMIO hZUKA.IEEE Trans. Compon. Hybrids mfff Technol. CHMT10, 242 (1987). The effects of various factors, e.g. ball hardness, amount of ball deformation, thickness, and surface cleanliness of the aluminum electrode, which can influence bonding strength were investigated. Metallurgical bonding between balls and electrodes occurs by rupturing the oxide film existing on the aluminum electrodes and proceeds from outside, inwards to the center of the bonds. The bonding strength is found to be a linear function of the true bonded area between balls and electrodes. The factors increasing the true bonded area are a high ball hardness, a large amount of deformation, a thick aluminum electrode, and a clean electrode surface. In addition, a high strength ball bonding