- Email: [email protected]
Gold plating process
plated held by the holding jig while a clearance is left between the cylindrical body and the surface to be plated and an axial line of the cylindrical body is substantially perpendicular to the surface to be plated; an anode plate arranged in the cylindrical body being opposed to the surface of the object to be plated; and a nozzle arranged in the cylindrical body while it penetrates the anode plate and the plating solution is j e t t e d onto the surface to be plated from the nozzle end section located in the cylindrical body. SPUTTERING TARGET A S S E M B L Y
U.S. Patent 6,030,514. Feb. 29, 2000 J.A. Dunlop et all., assignors to Sony Corp., Tokyo, and Materials Research Corp., Orangeburg, N.Y.
A method of reducing sputtering burn-in time, minimizing spurtered particulate, and target assembly therefor. F A B R I C A T I N G METAL MICROPATIrERNS
U.S. Patent 6,030,515. Feb. 29, 2000 K. Heyers and B. Elsner, assignors to Robert Bosch GmbH, Stuttgart, Germany
A method for creating a metal micropattern comprising creating a plurality of trenches in a polymer layer; producing an insulating layer only on each of the side walls of the plurality of trenches; after the producing step, filling each of the plurality of trenches with the metal micropattern using an electroplating process; and after the filling step, removing the polymer layer without removing the insulating layer on the respective side walls of each of the plurality of trenches. TIN P L A T I N G ELECTROLYTE COMPOSITION
U.S. Patent 6,030,516. Feb. 29, 2000 C.H. O'Driscoll, Selby, North Yorkshire, U.K.
A composition suitable for use in a April 2001
I N D U S TRIES, INC. 115 East Main Street, Belding MI 48809 • 616-794-0410 or 616-691-8195 Fax: 616-794-3424 • E-mail: [email protected] • www.belcoind.com Circle 016 on reader information card
process for electroplating surfaces with tin comprising an unsubstituted or substituted para alkyl benzene sulfonic acid; sulfuric acid or sulfamic acid or both; one or more additional agents; a tin source; and water. DEBONDING P A I N T FROM A METAL
U.S. Patent 6,030,519. Feb. 29, 2000 R. Keller et al., Export, Pa.
In an improved method for electrolytically debonding a paint coating from a metal member w h e r e i n the paint coating is bonded to a surface of the metal member, the improvement comprising providing an electrode blanket on said paint coating; applying an aqueous-based electrotyte solution to the electrode blanket; and passing an electric current for a time sufficient to cause the paint coating to debond from the surface without substantially chemically altering the paint coatings.
UV-CURED C O A T I N G
U.S. Patent 6,030,703. Feb. 29, 2000 M. Fan et al., assignors to Sartomer Co. Inc., Exton, Pa.
A radiation-curable polyester. HOT-DIP COATED STEEL
U.S. Patent 6,030,714. Feb. 29, 2000 N. Fujibayashi et al., assignors to Kawasaki Steel Corp., Hgoyo, Japan
A zinc and zinc-alloy hot-dipcoated steel sheet having decreased bare spots and excellent coating adhesion. GOLD PLATING PROCESS
U.S. Patent 6,030,877. Feb. 29, 2000 C.Y. Lee and T.H. Huang, assignors to Industrial Technology Research Institute, Hsin-Chu, Taiwan
An electroless gold plating method for forming i n d u c t o r structures. C A T I O N I C ELECTRODEPOSlTION COATING COMPOSITION
U.S. Patent 6,031,028. Feb. 29, 2000
Y. Iino et al., assignors to Kansai 95
U.S. Patent 6,030,514. Feb. 29, 2000 J.A. Dunlop et all., assignors to Sony Corp., Tokyo, and Materials Research Corp., Orangeburg, N.Y.
A method of reducing sputtering burn-in time, minimizing spurtered particulate, and target assembly therefor. F A B R I C A T I N G METAL MICROPATIrERNS
U.S. Patent 6,030,515. Feb. 29, 2000 K. Heyers and B. Elsner, assignors to Robert Bosch GmbH, Stuttgart, Germany
A method for creating a metal micropattern comprising creating a plurality of trenches in a polymer layer; producing an insulating layer only on each of the side walls of the plurality of trenches; after the producing step, filling each of the plurality of trenches with the metal micropattern using an electroplating process; and after the filling step, removing the polymer layer without removing the insulating layer on the respective side walls of each of the plurality of trenches. TIN P L A T I N G ELECTROLYTE COMPOSITION
U.S. Patent 6,030,516. Feb. 29, 2000 C.H. O'Driscoll, Selby, North Yorkshire, U.K.
A composition suitable for use in a April 2001
I N D U S TRIES, INC. 115 East Main Street, Belding MI 48809 • 616-794-0410 or 616-691-8195 Fax: 616-794-3424 • E-mail: [email protected] • www.belcoind.com Circle 016 on reader information card
process for electroplating surfaces with tin comprising an unsubstituted or substituted para alkyl benzene sulfonic acid; sulfuric acid or sulfamic acid or both; one or more additional agents; a tin source; and water. DEBONDING P A I N T FROM A METAL
U.S. Patent 6,030,519. Feb. 29, 2000 R. Keller et al., Export, Pa.
In an improved method for electrolytically debonding a paint coating from a metal member w h e r e i n the paint coating is bonded to a surface of the metal member, the improvement comprising providing an electrode blanket on said paint coating; applying an aqueous-based electrotyte solution to the electrode blanket; and passing an electric current for a time sufficient to cause the paint coating to debond from the surface without substantially chemically altering the paint coatings.
UV-CURED C O A T I N G
U.S. Patent 6,030,703. Feb. 29, 2000 M. Fan et al., assignors to Sartomer Co. Inc., Exton, Pa.
A radiation-curable polyester. HOT-DIP COATED STEEL
U.S. Patent 6,030,714. Feb. 29, 2000 N. Fujibayashi et al., assignors to Kawasaki Steel Corp., Hgoyo, Japan
A zinc and zinc-alloy hot-dipcoated steel sheet having decreased bare spots and excellent coating adhesion. GOLD PLATING PROCESS
U.S. Patent 6,030,877. Feb. 29, 2000 C.Y. Lee and T.H. Huang, assignors to Industrial Technology Research Institute, Hsin-Chu, Taiwan
An electroless gold plating method for forming i n d u c t o r structures. C A T I O N I C ELECTRODEPOSlTION COATING COMPOSITION
U.S. Patent 6,031,028. Feb. 29, 2000
Y. Iino et al., assignors to Kansai 95