4 Grinding Ichiro Inasaki, Hans R. Meyer, Fritz Klocke, Junji Shibata, Gunther Spur, Hans K. Tonshoff, and Hans G. Wobker
1.0
FUNDAMENTALS OF GRINDI...
4 Grinding Ichiro Inasaki, Hans R. Meyer, Fritz Klocke, Junji Shibata, Gunther Spur, Hans K. Tonshoff, and Hans G. Wobker
1.0
FUNDAMENTALS OF GRINDING Ichiro Inasaki
Material Removal Mechanism in Grinding
Grinding is a representative abrasive process in which a grinding wheel made of abrasives and bonding material is used. The grinding wheel is conditioned, i.e., trued and dressed, on the grinding machine before grinding as shown in Figure 4.1. This is very characteristic of grinding because the conditioning process has a decisive influence on the final result. The mechanism of material removal with abrasive cutting edges on the wheel surface is basically the same as that with cutting tools. In metal machining, for example, material is removed mainly through shear deformation in both material removal processes. The size of chips removed in grinding is, however, much smaller than the case of cutting providing better surface finish and machining accuracy. The order of chip thickness in grinding is far less than 0.1 mm, whereas it is larger than 0.1 mm in cutting.