High heat adhesive films

Flame retardant targets high temperature A

applications Pyro-Chek

BROMINATED polystyrene

flame retardant temperature neering

for use in high

glass filled

engi-

resins has been devel-

developed

PBi

was

for use with

high

temperature

68

nylons and nylon-

polyester alloys, but can also be

oped by Ferro Corp, Cleveland,

used in faster compounding

Ohio, USA. Pyre-Chek@ 68 PBi is

nylon

reported to offer improved ther-

extruders.

mal

maintained

at temperatures

to

which

stability

and

colour

for

higher temperature applications. The

product

is currently

being used in injection ing for connectors printed

circuit

mould-

mounted

boards,

on

but is

66

in

larger,

Thermal

350°C

experienced

of

hotter

stability are

is up

briefly

in compounding

and production

cycles.

The product is available in powder

and

compacted

form

also expected to offer benefits

from dedicated

to compounders using larger extruders operating at higher temperatures. Circuit boards are becoming

plants in Hammond, Indiana, USA, and Port-de-Bout, France. A two year field history is said to have demonstrated its pro-

smaller and the components mounted on them have followed

cessibility, dependability consistency.

suit.

Plastic

connectors

must

turization

meet

will continue,

tolerances.

Higher

temperatures are needed in injection moulding to improve flow sufficiently to fill the smaller cavities, and components must not warp under the oven temperatures used in mounting them to circuit board surfaces.

and

“The trend towards minia-

now have very thin walls but still tight

manufacturing

of computer

parts

and the market

will continue to expand,” says Pete Whitman, director of Pyro-Chek sales and marketing. “Circuit boards are used not only in computers but also in cell phones, stereo equipment, cars and appliances.”

High heat adhesive films THE DOW Chemical Co has expanded its Integral adhesive films range by adding high heat meet films designed to increased original equipment

The new Integral high heat adhesive films - Integral 925, Integral 932, and Integral 936 -_ can be pre-applied to foam-

manufacturer (OEM) performance requirements for automo-

for bonding to substrates in moulding operations. Dow says

tive interiors. The new multilayer adhesive films are heat activated, thermally stable and capable of bonding to composites, urethane foam-backed fabrics, paper, nonwovens, rigid urethanes and other substrates.

these new products will allow it to better serve OEMs requiring high heat adhesives for international specifications on vehicles headliners, as well as more rigorous applications, including package trays and other interior components.

backed fabrics and reactivated

November

1999

REINFORCEDplastics

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