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Integrated aluminium connections
WORLD ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
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vt-STRATETM, interconnect system is a three-dimensional interconnect method in contrast to singleplane interconnect methods. Furthermore, the assembly process enhances module repairability during the manufacturing cycle.
Compatibility of glassy materials for monolithic packaging. J. B. FINN, Proc. 1969 Electron. Comport. Conf., Washington D.C., 30 April-2 May (1969), p. 322. This paper discusses the properties of hard glasses and solder glasses and interprets these values as measures of glass seal quality. Emphasis is placed on the glass-to-metal seal with development of a useful model. The glass-to-glass and glassto-ceramic seals are also discussed. A complete typical package assembly involving ceramic-glass-metal seals is finally analyzed in light of the preceding models. The typical package is then modified from basic materials compatibility considerations. A suggested modified package is then shown to be stronger, produce higher yields and process more easily. Integrated aluminium connections. T. NEUHUYS, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 46. Beam leads are probably the most suitable integrated connections for building up complex hybrid integrated circuits. The manufacture of silicon chips provided with aluminium beam leads is a simple process that allows rapid extension of the range of available beamleaded planar devices. All electrical characteristics of each chip are measured before ultrasonic welding upon an aluminized thin film. Reliability test results are given. It is often advisable to mount the silicon chips upon auxiliary substrates. These are also provided with beam leads by means of which they are welded in turn upon thin or thick films. As an example of application of these techniques, modules for a frequency synthesizer are described. Crossovers for interconnections on substrates. H. BASSECHESand A. PFAHNL, Vroe. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 78. Crossovers are an important part of the interconnection pattern of hybrid thin-film circuits. Densities of several hundred crossovers per in 2 are not uncommon in present designs. The present paper discusses the preparation and properties of beam type crossovers. The beam crossover that has been developed has the mechanical and electrical characteristics which meet a wide variety of integrated circuit needs. The preparation process utilizes photolithographic techniques so that batch processing can be used to produce the crossovers economically. It is also fully compatible with the preparation and assembly techniques for tantalum and beam lead silicon integrated circuits. 6. MICROELECTRONICS---COMPONENTS AND EQUIPMENTS Testing linear integrated circuits. M. A. MAcDONELL, Solid-St. Technol., March (1969), p. 45. The largest testing volume of linear integrated circuits involves operational amplifiers. The applications of operational amplifiers demand that individual parameters be screened to assure predictable circuit performance. The important difference between testing digital and analog circuits is in the operating conditions for each type. Digital circuits have no practical linear range between on and off. Unless deliberately saturated, linear circuits are always active. Any change in input, bias or operating point will affect the test result throughout the linear range. These errors can occur even if only d.c. or static tests are being made. Much more care is required to maintain the operating conditions of linear circuits than has been needed for digital circuits. The signal levels associated with digital circuits are relatively large. Operational amplifier parameters are mostly determined from small error signals which demand sensitive instrumentation and special circuit techniques. This article points out the testing requirements of linear circuits and the test equipment features necessary to meet them. Filter building blocks using tantalum and silicon integrated circuits. G. S. MOSCHYTZ,D. G. MEDILLand C. J. STEFFEN,Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 100. In order for linear integrated circuits to become economically feasible, a method of network synthesis that provides a high degree of circuit standardization must be used. This has already been proven in the field of digital integrated circuits, where complex systems are broken down into a small family of functional logic building blocks. The resulting high production quantities have resulted in the anticipated reductions in cost. A method of designing linear filter building blocks in which operational
19
vt-STRATETM, interconnect system is a three-dimensional interconnect method in contrast to singleplane interconnect methods. Furthermore, the assembly process enhances module repairability during the manufacturing cycle.
Compatibility of glassy materials for monolithic packaging. J. B. FINN, Proc. 1969 Electron. Comport. Conf., Washington D.C., 30 April-2 May (1969), p. 322. This paper discusses the properties of hard glasses and solder glasses and interprets these values as measures of glass seal quality. Emphasis is placed on the glass-to-metal seal with development of a useful model. The glass-to-glass and glassto-ceramic seals are also discussed. A complete typical package assembly involving ceramic-glass-metal seals is finally analyzed in light of the preceding models. The typical package is then modified from basic materials compatibility considerations. A suggested modified package is then shown to be stronger, produce higher yields and process more easily. Integrated aluminium connections. T. NEUHUYS, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 46. Beam leads are probably the most suitable integrated connections for building up complex hybrid integrated circuits. The manufacture of silicon chips provided with aluminium beam leads is a simple process that allows rapid extension of the range of available beamleaded planar devices. All electrical characteristics of each chip are measured before ultrasonic welding upon an aluminized thin film. Reliability test results are given. It is often advisable to mount the silicon chips upon auxiliary substrates. These are also provided with beam leads by means of which they are welded in turn upon thin or thick films. As an example of application of these techniques, modules for a frequency synthesizer are described. Crossovers for interconnections on substrates. H. BASSECHESand A. PFAHNL, Vroe. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 78. Crossovers are an important part of the interconnection pattern of hybrid thin-film circuits. Densities of several hundred crossovers per in 2 are not uncommon in present designs. The present paper discusses the preparation and properties of beam type crossovers. The beam crossover that has been developed has the mechanical and electrical characteristics which meet a wide variety of integrated circuit needs. The preparation process utilizes photolithographic techniques so that batch processing can be used to produce the crossovers economically. It is also fully compatible with the preparation and assembly techniques for tantalum and beam lead silicon integrated circuits. 6. MICROELECTRONICS---COMPONENTS AND EQUIPMENTS Testing linear integrated circuits. M. A. MAcDONELL, Solid-St. Technol., March (1969), p. 45. The largest testing volume of linear integrated circuits involves operational amplifiers. The applications of operational amplifiers demand that individual parameters be screened to assure predictable circuit performance. The important difference between testing digital and analog circuits is in the operating conditions for each type. Digital circuits have no practical linear range between on and off. Unless deliberately saturated, linear circuits are always active. Any change in input, bias or operating point will affect the test result throughout the linear range. These errors can occur even if only d.c. or static tests are being made. Much more care is required to maintain the operating conditions of linear circuits than has been needed for digital circuits. The signal levels associated with digital circuits are relatively large. Operational amplifier parameters are mostly determined from small error signals which demand sensitive instrumentation and special circuit techniques. This article points out the testing requirements of linear circuits and the test equipment features necessary to meet them. Filter building blocks using tantalum and silicon integrated circuits. G. S. MOSCHYTZ,D. G. MEDILLand C. J. STEFFEN,Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April-2 May (1969), p. 100. In order for linear integrated circuits to become economically feasible, a method of network synthesis that provides a high degree of circuit standardization must be used. This has already been proven in the field of digital integrated circuits, where complex systems are broken down into a small family of functional logic building blocks. The resulting high production quantities have resulted in the anticipated reductions in cost. A method of designing linear filter building blocks in which operational