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Integrated microwave modules—a prospectus
WORLD ABSTRACTS ON M I C R O E L E C T R O N I C S AND R E L I A B I L I T Y
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the circuit. As transistors constitute, generally speaking, the least reliable elements in amplifier circuits, first a redundant form of the transistor is sought after.
Reliability definitions for electronic equipment. F. ASK, Electron. Engng, June (1969), p. 13. The author explains some of the definitions and expressions which are most frequently encountered in quantitative reliability analysis. It is not an attempt to introduce certain terminology, ahhough the need for international agreement is stressed in order to avoid confusion. Particular emphasis is placed upon failure rates and mean time between failures. Maintenance and reliability problems in GPO network. T. J. REES and J. F. BAMPTON,Electron. Weekly, July 9 (1969), p. 7. In a telephone network the problems of maintenance and reliability increase as the network grows and becomes more complex. Every new subscriber increases the traffic loading and operating reliability requirements of the whole network. It is, therefore, important to realize that the United Kingdom has the largest telephone network in Europe and the third largest in the world, being exceeded only by the USA and Japan. The Post Office has set itself the target of continuous improvement in the performance of the telephone network, and to achieve in the period 1965-75 a fault rate half that which existed at the start of the 10-yr period. The improved supply of equipment and circuits and the introduction of new testing arrangements outlined in this article are some of the important means which the Post Office is using to achieve this target. 4. MICROELECTRONICS--GENERAL
Evaluation of materials and processes for integrated microwave circuits. F. Z. KEISTER, IEEE J. SC-3, June (1968), p. 131. This paper presents an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits. Substrate materials evaluated included aluminas, beryllias, quartz and glass of varying purities and surface finishes. Conductor materials evaluated included silver, copper, gold and aluminum. Fabrication processes studied included vacuum deposition, sputtering, electroless and electroplating, thick-film screening and firing and photoetching. Sapphire and high-purity alumina (99.5 per cent pure or better) substrates were found superior as substrates for microstrip circuits. Conductor materials and processing methods found best were: (1) vacuum deposited chromium-gold thin film which was gold electroplated and photoetched; (2) thickfilm silver which was photoetched to delineate the microwave pattern. Integrated microwave moduies--a prospectus. W. M. WEBSTER,IEEE Trans. ED-15, July (1968), p. 446. Applications of monolithic and hybrid semiconductor circuit technologies to microwaves are discussed from a semitechnical and economic viewpoint. Technical feasibility of performing nearly all functions through millimeter waves is foreseen. Economic success, however, is less tangible and depends mainly on two factors: the willingness of systems people to trade increased initial cost for greatly decreased maintenance cost and the magnitude of the requirements for electronically steered antennas. The author's estimates of the business potential are discussed. Millimeter-wave integrated circuits. S. MAO,S. JONESand G. D. VENDELIN,IEEE Trans. ED-15, July (1968), p. 517. Monolithic millimeter-wave integrated circuits have been designed and fabricated on semi-insulating GaAs substrates using microstrip transmission lines. Circuits using hybrid techniques have also been constructed on quartz and ceramics. This paper shows that microstrip-line integrated circuits are feasible at millimeter-wave frequencies. Circuit functions have been constructed and tested in the 25- to 100-GHz range. The loss in microstrip line on semi-insulating GaAs was found to be less than 0-3 dB/x. Couplers from waveguide to microstrip have been made with transmission losses less than 0"5 dB. Monolithic integrated detectors showed 5-dB better sensitivity than a 1N53 diode in a Philips detector mount. Monolithic diodes delivered 1.5 r a w at 28 GHz. The results are encouraging and a fully monolithic integrated receiver is under development. Integrated circuits in electronics of the future. F. BERGTOLD,Automatik 14, No. 2, February (1969), p. 37. (In German.) Considers the accuracy of the predictions made in 1960. The assumption
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the circuit. As transistors constitute, generally speaking, the least reliable elements in amplifier circuits, first a redundant form of the transistor is sought after.
Reliability definitions for electronic equipment. F. ASK, Electron. Engng, June (1969), p. 13. The author explains some of the definitions and expressions which are most frequently encountered in quantitative reliability analysis. It is not an attempt to introduce certain terminology, ahhough the need for international agreement is stressed in order to avoid confusion. Particular emphasis is placed upon failure rates and mean time between failures. Maintenance and reliability problems in GPO network. T. J. REES and J. F. BAMPTON,Electron. Weekly, July 9 (1969), p. 7. In a telephone network the problems of maintenance and reliability increase as the network grows and becomes more complex. Every new subscriber increases the traffic loading and operating reliability requirements of the whole network. It is, therefore, important to realize that the United Kingdom has the largest telephone network in Europe and the third largest in the world, being exceeded only by the USA and Japan. The Post Office has set itself the target of continuous improvement in the performance of the telephone network, and to achieve in the period 1965-75 a fault rate half that which existed at the start of the 10-yr period. The improved supply of equipment and circuits and the introduction of new testing arrangements outlined in this article are some of the important means which the Post Office is using to achieve this target. 4. MICROELECTRONICS--GENERAL
Evaluation of materials and processes for integrated microwave circuits. F. Z. KEISTER, IEEE J. SC-3, June (1968), p. 131. This paper presents an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits. Substrate materials evaluated included aluminas, beryllias, quartz and glass of varying purities and surface finishes. Conductor materials evaluated included silver, copper, gold and aluminum. Fabrication processes studied included vacuum deposition, sputtering, electroless and electroplating, thick-film screening and firing and photoetching. Sapphire and high-purity alumina (99.5 per cent pure or better) substrates were found superior as substrates for microstrip circuits. Conductor materials and processing methods found best were: (1) vacuum deposited chromium-gold thin film which was gold electroplated and photoetched; (2) thickfilm silver which was photoetched to delineate the microwave pattern. Integrated microwave moduies--a prospectus. W. M. WEBSTER,IEEE Trans. ED-15, July (1968), p. 446. Applications of monolithic and hybrid semiconductor circuit technologies to microwaves are discussed from a semitechnical and economic viewpoint. Technical feasibility of performing nearly all functions through millimeter waves is foreseen. Economic success, however, is less tangible and depends mainly on two factors: the willingness of systems people to trade increased initial cost for greatly decreased maintenance cost and the magnitude of the requirements for electronically steered antennas. The author's estimates of the business potential are discussed. Millimeter-wave integrated circuits. S. MAO,S. JONESand G. D. VENDELIN,IEEE Trans. ED-15, July (1968), p. 517. Monolithic millimeter-wave integrated circuits have been designed and fabricated on semi-insulating GaAs substrates using microstrip transmission lines. Circuits using hybrid techniques have also been constructed on quartz and ceramics. This paper shows that microstrip-line integrated circuits are feasible at millimeter-wave frequencies. Circuit functions have been constructed and tested in the 25- to 100-GHz range. The loss in microstrip line on semi-insulating GaAs was found to be less than 0-3 dB/x. Couplers from waveguide to microstrip have been made with transmission losses less than 0"5 dB. Monolithic integrated detectors showed 5-dB better sensitivity than a 1N53 diode in a Philips detector mount. Monolithic diodes delivered 1.5 r a w at 28 GHz. The results are encouraging and a fully monolithic integrated receiver is under development. Integrated circuits in electronics of the future. F. BERGTOLD,Automatik 14, No. 2, February (1969), p. 37. (In German.) Considers the accuracy of the predictions made in 1960. The assumption