S C I E N C E A N D TECHNOLOGY OF
Science and Technology of Advanced Materials 2 (2001) VI±VII
ADVANCED MATERIALS
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Keyword Index a -acetal-poly(ethylene glycol)/ polylactide block co-polymers, 21 Acoustic emission, 157 Activation energy, 237 Al2O3, 187 Amorphous silicon, 187 Anomalous X-ray scattering, 37 Antiphase domain, 173 Anti-site atoms, 237 Arti®cial organs, 131 Athermal process, 63 Atomic density, 227 Binary dilute alloy, 43 Biocompatibility, 131 Biomaterials, 131 Blood compatibility, 131 Bottom dross, 251 Boundaries, 97 Bulk amorphous alloy, 73 Bulk nanostructure alloy, 73 Carbon ®bers, 191 Chemical lattice image, 11 CO2 emission, 105 Coarsening kinetics, 51 Coherency strains, 51 Cold model, 251 Combinatorial chemistry, 1 Compound semiconductor, 173 Compression waves, 191 Copper concentration, 105 Covalency of Er±O bonding, 139 Crystal grain boundary, 11 Crystal orientation, 191 Crystallization, 73 CSL model, 11 Cu-SiO2 alloy, 125 Cubic boron nitride ®lms, 219 Dangling bond, 11 Dark-®eld image, 117 Deformation and solidi®cation, 147 Density functional calculation, 167 Diamond grain boundary, 11 Dielectric breakdown, 181 Diffuse scattering, 117 Diffusion, 237 Dispersed particles, 125 Divacancy, 237 Domain inversion, 173 EDS, 97
Electric and magnetic ®elds, 191 Electrodeposition, 191 Electronic structure, 63 Electromagnetic force, 191 Electromagnetic processing of materials, 191 Electromagnetic-wave radiation, 211 Energy ®ltering, 117 Extended X-ray absorption ®ne structure spectroscopy, 139 Fatigue, 125 Fe±Si alloy, 87 Frequency conversion, 173 Frequency factor, 237 Froude number, 251 GaAs/AlAs interface, 11 Germanium oxide, 37 Gold grain boundary, 11 Grain boundary, 87 Grain-boundary character, 87 Grain growth, 97 Growth models, 219 High magnetic ®eld, 191 High-resolution electron microscopy, 11 Hot dip plating bath, 251 HRTEM, 97 Hydrogel, 201 Hydrostatic pressure, 63 Icosahedral cluster, 227 Intermetallic compound, 237 Intermetallic compounds, 51 Inverse analysis, 157 Iron±nickel, 63 Iron±nickel±chromium, 63 Isothermal dendrite, 43 Isothermal process, 63 Laser interferometer, 157 Lifetime distribution, 105 Local structure, 37, 139 Localized deformation mode, 73 Long alkyl moiety, 201 Low temperature synthesis, 211 Magnetic ®eld, 63 Magnetization force, 191 Martensite, 117 Martensitic transformation, 63 Materials processing, 191
Mechanical property, 73 MEM/Rietveld method, 227 Mesogenic moiety, 201 Metal-oxide semiconductor, 181 Metallic-covalent bonding conversion, 227 MgO, 187 Microfracture, 157 Microstructure, 87, 97 Mirror-con®nement-type ECR plasma sputtering, 211 Modelling, 147 Molecular orbital calculation, 227 Monodisperse polystyrene ®lms, 31 Multiple-shell structure, 227 Nanoscale compound, 73 Nanoscale quasicrystalline phase, 73 Nearest neighbor jumps, 237 Nesting vector, 63 Next nearest neighbor jumps, 237 NiAl, 237 Ni-based superalloys, 51 Nonlinear optics, 173 Non-speci®c bio-fouling, 21 O-lattice model, 11 One by one approach, 1 Optical conductivity, 227 Order±disorder transition, 201 Ordering, 237 Ostwald ripening, 43 Particle frequency, 251 Particle holdup, 251 Particle/interface problem, 43 Phase-®eld model, 43 Phospholipid polymer, 131 Photoconductivity, 227 Plasma enhanced chemical vapor deposition, 187 Plasma spraying, 147 Platinum, 237 Population balance model, 105 Post-annealing, 211 Post-breakdown resistance, 181 Pulsed laser deposition, 187 Quasi phase matching, 173 Quasicrystal, 227 R-phase, 117
Keyword Index / Science and Technology of Advanced Materials 2 (2001) VI±VII
Rare earth ions in oxide glasses, 139 Rate limiting step, 1 Recycling, 105 Scanning force microscopy, 31 SiC grain boundary, 11 Silicon surface, 167 Silicon±silver, 167 Silver bromide, 37 Silver oxide, 37 Single crystal, 125 Small-angle neutron scattering, 51 Soft magnetic steel, 87 Source characterization, 157 Spontaneous emission probability, 139
SrTiO3, 211 Steel usage, 105 Streak line, 251 Stream line, 251 Strip, 251 Sublattice reversal, 173 Super-cooling effect, 147 Superionic conducting glass, 37 Surface electronic states, 167 Surface glass transition, 31 Surface modi®ers, 21 Surface structure, 167 Texture, 87 Thermoelectric conversion material, 227
Thin-®lm transistor, 187 Thin interface limit, 43 TiNi, 117 Top dross, 251 Triple defects, 237 Turbostratic boron nitride, 219 Vacancies, 237 Vapordeposition, 191 WC-CO, 97
VII