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Magnetic handling of beam lead integrated circuits
118
W O R L DABSTRACTS ON MICROELECTRONICS AND RELIABILITY
methods of application and some general aspects of material selection are summarized. References are made to papers discussing the thermomechanicxl effects of plastics and the corrosion which can occur inside the package. S t r e s s e s and strains in a plate bonded to a substrate: s e m i c o n d u c t o r devices. R. ZEYFANG. Solid ,St. Electron. 14 (1971), p. 1035. T h e thermoelastic stresses in an elastic plate of finite length bonded to a rigid substrate have been calculated using the energy minimization method developed by Aleck. T h e strain and displacement fields have been derived and the inclination of the plate surface with respect to the interface has been given for different ratios of coefficients of thermal expansion. A major step in power h y b r i d s . W. SCHULTZ. Prec. 21st Electron. Compon. Conf., Washington D.C., U.S.A., 10-12 May (1971), p. 159. Power microelectronic techniques have been developed which allow hybrid circuit power dissipations in excess of 100 W. These techniques are discussed in terms of a 10 amp series regulator. Application of these new techniques has resulted in a package occupying roughly the same volume as a TO-63 power transistor package, yet containing two 30 amp power transistors and associated voltage regulator circuitry. C o n t r o l M O S / L S I yield by d e ~ a . M. PHELPS. EDN/EEE, 15 October (1971), p. 21. T o gain an edge in today's competitive marketplace, many firms are converting their system designs into M O S / L S I . Consequently, today's designer must understand M O S / L S I yields as well as he does O h m ' s law. Equipment manufacturers must go a step f u r t h e r - - t h e y must develop an understanding of topological designs within their engineering ranks.
Another s e l f - a l l g n l n g M O S p r o c e s s h a s interconnecting advantages. R. H. WAKEFIELD,Jr., E. R. WARD and J. A. CUNNINGHAM. Electronics, 3 January (1972), p. 89. Self-aligned thick-oxide process cuts the gate-to-drain capacitance of M O S transistors, using standard M O S masks; unlike other self-aligning methods, it easily produces devices with three interconnection levels. M a g n e t i c h a n d l i n g o f b e a m l e a d integrated circuits. H. E. HUGHES and M. H. WACHS. Prec. 21st Electron. Corapon. Conf., Washington D.C., U.S.A. 10-12 May (1971), p. 417. Using beam lead devices containing magnetically responsive material in conjunc-
tion with appropriately shaped magnetic fields, functions of hold-down, pick-up, orientation and directed motion along pre-determined paths have been demonstrated Processes for making integrated circuits magnetically responsive have been developed. Ferromagnetic material has been electrodeposited on the inactive surface of beam lead integrated circuits. Ferromagnetic material has also been electrodeposited as an intermediate layer in the leads of beam lead integrated circuits. Magnetic process and shipping carriers have been designed. Techniques for generating precise interdigitated arrays of beam lead integrated circuits on barium ferrite magnetic carriers have been developed. Magnetic hold-down forces of 400--600 times the weight of an individual chip are developed between typical integrated circuits and magnetic carriers. Since a typical vacuum probe pick-up force is orders of magnitude greater, chip pick-up from magnetic carriers is reproducible and precise. Magnetic carriers allow the shipment of clean devices since no organic media is required to hold devices in position.
N e w test target helps microphotographers find l i m i t s of photographic s y s t e m s . S. H. GOLDSMITH and H. D. LYDICK. ,Solid ,St. TechnoL, November (197t), p. 3. A new test pattern to aid in evaluation of microimages is described. T h e aim for microelectronies is maximum useful resolution with good image quality, not limiting resolution. T h u s this pattern is designed to yield more information than the conventional bar chart used for resolution tests. Ordinary resolution tests that express reproduction capabilities in lines per millimeter are of hmited practical value to the microphotographer, as the quality of images for microelectronic mask-making and similar operations bears no fixed relationship to limiting resolution. T h e new target can be used not only to obtain the same information previously obtainable, but also to provide information about exposure, corner qualit3", focus and adjacency effects, and other factors bearing on image utility. ICs can s i m p l i f y conversion between binary and b . c . d . J . LINFORD. Electron. Engng, November (t971), p.. 48. Decimal-to-b.c.d. and b.c.d.-to-decimal conversions are straightforward and several IC manufacturers produce monolithic units for this purpose. Conversion between b.c.d, and binary is far more complicated, but the hardware required to achieve it can be simplified with the use of complex-function ICs such as monolithic counters, adders and read-only memories. Four methods of binary-to-b.c.d, conversion, and the corresponding b.c.d.-to-binary conversions, are covered: "count comparison", " A D D - 3 algorithm", "table look-up" and "b.c.d. adders array".
6. M I C R O E L E C T R O N I C S - - - C O M P O N E N T S , C / M O S u n i t e s w i t h s i l i c o n g a t e to y i e l d m i c r o p o w e r technology. R. R. BURGESSand R. G. DANmLS. Electronics, 30 August (1971), p. 38. Logic circuits that dissipate 99 per cent less power than standard M O S at low frequencies are ideal for watches, portable com-
SYSTEMS
AND
EQUIPMENTS
munications systems and battery-powered calculators, which all need low-voltage power supplies.
The A-6 channel bank: putting n e w t e c h n o l o g i e s to w o r k . G. W. BLmSCH and W. P. M m u ^ u v , Jr. Bell
W O R L DABSTRACTS ON MICROELECTRONICS AND RELIABILITY
methods of application and some general aspects of material selection are summarized. References are made to papers discussing the thermomechanicxl effects of plastics and the corrosion which can occur inside the package. S t r e s s e s and strains in a plate bonded to a substrate: s e m i c o n d u c t o r devices. R. ZEYFANG. Solid ,St. Electron. 14 (1971), p. 1035. T h e thermoelastic stresses in an elastic plate of finite length bonded to a rigid substrate have been calculated using the energy minimization method developed by Aleck. T h e strain and displacement fields have been derived and the inclination of the plate surface with respect to the interface has been given for different ratios of coefficients of thermal expansion. A major step in power h y b r i d s . W. SCHULTZ. Prec. 21st Electron. Compon. Conf., Washington D.C., U.S.A., 10-12 May (1971), p. 159. Power microelectronic techniques have been developed which allow hybrid circuit power dissipations in excess of 100 W. These techniques are discussed in terms of a 10 amp series regulator. Application of these new techniques has resulted in a package occupying roughly the same volume as a TO-63 power transistor package, yet containing two 30 amp power transistors and associated voltage regulator circuitry. C o n t r o l M O S / L S I yield by d e ~ a . M. PHELPS. EDN/EEE, 15 October (1971), p. 21. T o gain an edge in today's competitive marketplace, many firms are converting their system designs into M O S / L S I . Consequently, today's designer must understand M O S / L S I yields as well as he does O h m ' s law. Equipment manufacturers must go a step f u r t h e r - - t h e y must develop an understanding of topological designs within their engineering ranks.
Another s e l f - a l l g n l n g M O S p r o c e s s h a s interconnecting advantages. R. H. WAKEFIELD,Jr., E. R. WARD and J. A. CUNNINGHAM. Electronics, 3 January (1972), p. 89. Self-aligned thick-oxide process cuts the gate-to-drain capacitance of M O S transistors, using standard M O S masks; unlike other self-aligning methods, it easily produces devices with three interconnection levels. M a g n e t i c h a n d l i n g o f b e a m l e a d integrated circuits. H. E. HUGHES and M. H. WACHS. Prec. 21st Electron. Corapon. Conf., Washington D.C., U.S.A. 10-12 May (1971), p. 417. Using beam lead devices containing magnetically responsive material in conjunc-
tion with appropriately shaped magnetic fields, functions of hold-down, pick-up, orientation and directed motion along pre-determined paths have been demonstrated Processes for making integrated circuits magnetically responsive have been developed. Ferromagnetic material has been electrodeposited on the inactive surface of beam lead integrated circuits. Ferromagnetic material has also been electrodeposited as an intermediate layer in the leads of beam lead integrated circuits. Magnetic process and shipping carriers have been designed. Techniques for generating precise interdigitated arrays of beam lead integrated circuits on barium ferrite magnetic carriers have been developed. Magnetic hold-down forces of 400--600 times the weight of an individual chip are developed between typical integrated circuits and magnetic carriers. Since a typical vacuum probe pick-up force is orders of magnitude greater, chip pick-up from magnetic carriers is reproducible and precise. Magnetic carriers allow the shipment of clean devices since no organic media is required to hold devices in position.
N e w test target helps microphotographers find l i m i t s of photographic s y s t e m s . S. H. GOLDSMITH and H. D. LYDICK. ,Solid ,St. TechnoL, November (197t), p. 3. A new test pattern to aid in evaluation of microimages is described. T h e aim for microelectronies is maximum useful resolution with good image quality, not limiting resolution. T h u s this pattern is designed to yield more information than the conventional bar chart used for resolution tests. Ordinary resolution tests that express reproduction capabilities in lines per millimeter are of hmited practical value to the microphotographer, as the quality of images for microelectronic mask-making and similar operations bears no fixed relationship to limiting resolution. T h e new target can be used not only to obtain the same information previously obtainable, but also to provide information about exposure, corner qualit3", focus and adjacency effects, and other factors bearing on image utility. ICs can s i m p l i f y conversion between binary and b . c . d . J . LINFORD. Electron. Engng, November (t971), p.. 48. Decimal-to-b.c.d. and b.c.d.-to-decimal conversions are straightforward and several IC manufacturers produce monolithic units for this purpose. Conversion between b.c.d, and binary is far more complicated, but the hardware required to achieve it can be simplified with the use of complex-function ICs such as monolithic counters, adders and read-only memories. Four methods of binary-to-b.c.d, conversion, and the corresponding b.c.d.-to-binary conversions, are covered: "count comparison", " A D D - 3 algorithm", "table look-up" and "b.c.d. adders array".
6. M I C R O E L E C T R O N I C S - - - C O M P O N E N T S , C / M O S u n i t e s w i t h s i l i c o n g a t e to y i e l d m i c r o p o w e r technology. R. R. BURGESSand R. G. DANmLS. Electronics, 30 August (1971), p. 38. Logic circuits that dissipate 99 per cent less power than standard M O S at low frequencies are ideal for watches, portable com-
SYSTEMS
AND
EQUIPMENTS
munications systems and battery-powered calculators, which all need low-voltage power supplies.
The A-6 channel bank: putting n e w t e c h n o l o g i e s to w o r k . G. W. BLmSCH and W. P. M m u ^ u v , Jr. Bell