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Management benefits and burdens in regulatory legalisms
Microelectron.Reliab., Vol. 20, pp. 894--917.
0026-2714/80/1201-0897502.00/0
Pergamon Press 1980. Printed in Great Britain
WORLD ABSTRACTS ON MICROELECTRONICS AND RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the axticle. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects
1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability--General. Reliability of Components, Tubes, Transistors and.ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Micr oelectronics --.General. Microelectronics--Desigu and Construction. Microelectrouics--Components, Systems and Equipments. Semiconductor Integrated Circuits, Devices and Materials. Thick- and Thin-Film Components, Hybrid Circuits and Materials. Electron, Ion and Laser Beams.
1. R E L I A B I L I T Y - - G E N E R A L The respomibility of the consumer. The podnlam has swung too far. IRVING DELvrSCH. Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 468 (22-24 January 1980). This paper is a review of the question of how far our society and laws should go, and have gone, toward the protection of consumers and emPloYeeS. Examples of overproteetion that have caused accidents are given. It is concluded that the consumer, operator, user and overseer must assume more responsibility, and exercise greater care, but we do not want to return, to the old buyer-beware policies of years gone by. Products liability: defective conditions. C. O. SMITH. Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 470 (22-24 January 1980). Developments in products liability litigation require increasing emphasis on safety in design. Some legal criteria now exist for defining design and manufacturing defects. This paper discusses these, applies them in analyzing three specific products, and indicates some implications for engineering design. Management benefits and burdens in regulatory legalisms. HERMAN D. RUE. Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 11 (22-24 January 1980). This paper relates essential aspects of the engineering-law interface to realistic assessment of product design, reliability, safety and quality. Fundamental principles of regulatory legalisms and judicial opinions affecting industry are reviewed. A more equitable balance between assumed benefits and the often untenable burdens to industrial managements is advocated. To avoid company
2. R E L I A B I L I T Y
OF
COMPONENTS,
Preliminary evaluation of DIP/socket connection reliability. GOICaONW. MILLS.IEEE Trans. Components, Hybrids, Mfo Technol. Chmt-2 (4) 476 (December 1979). The availability and recent use of large-scale integration and field programmable memory dual in-line packages (DIP's) has resulted in increased use of DIP sockets and also increased need for reliability data on DIP/socket connections. This experimental study was implemented to explore the reliability of various DiP/socket combinations in terms of MR
~0:8
- I
financial risk exposure, managers and engineers must acquire the basic knowledge regarding current regulations and judicial decisions: the assessment of the engineeringlaw interface cannot be wholly delegated to corporate attorneys. The acquisition of the requisite knowledge is shown to be ieadily obtainable, requiring only personal motivation for the company's economic "well being',. Japanese make qmUty-control pitch. RAY CONNOLLY. Electronics, ! 0 (April 1980). EIA-J tells Washington seminar that secret is no secret, and that IC makers would like to share know-how with US rivals` Draft DoD directive: 5000.xx, Reliability and Malntalnabifity. BL~ H i SWETT,Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 19 (22-24 January 1980). Following the introduction of some major questions involved in the development of DoD policy on R and M, the text of the 17 May 1979 draft directive is presented in its entirety. That draft was the basis for a session on "New DoD RAM Policy" at the 1980 RAM Symposium. Points of discussion for alld against the various provisions of that draft have not been included here, because the DoD participants had to be free to express a mix of official comments and personal opinions. Product liability prevention--an engineer's viewpoint. RAYMOND GOLDSTerN, Quality Prog. p. 24 (April 1980). Inadequacies in the academic training of the engineer and in personnel motivation may be key contributors to the product liability problem.
TUBES, TRANSISTORS
AND
ICs
contact resistance performance after being subjected to various environmental tests. The parameters explored were (1) DIP lead material and finishes, (2) socket contact finishes and configurations, and (3) insertion levels of 1, 5 and 15 insertions of the DIP's into the sockets. Three different DIP/socket interfaces were Studied: Au/Au, Au/solder, and solder/solder. These were distributed over 20 combinations of 5 DIP's and 4 sockets. Thermal aging, temperature cycling, temperature cycling with high humidity, an 897
0026-2714/80/1201-0897502.00/0
Pergamon Press 1980. Printed in Great Britain
WORLD ABSTRACTS ON MICROELECTRONICS AND RELIABILITY The abstracts below are given in reasonable detail where necessary so that an appreciation can be made of the coverage of the axticle. They are probably the most comprehensive detailed abstracts published in these two fields and in general are all of articles published within the last 12 months. They are classified into the following sections. Subjects
1. 2. 3. 4. 5. 6. 7. 8. 9.
Reliability--General. Reliability of Components, Tubes, Transistors and.ICs. Circuit and Systems Reliability, Maintenance and Redundancy. Micr oelectronics --.General. Microelectronics--Desigu and Construction. Microelectrouics--Components, Systems and Equipments. Semiconductor Integrated Circuits, Devices and Materials. Thick- and Thin-Film Components, Hybrid Circuits and Materials. Electron, Ion and Laser Beams.
1. R E L I A B I L I T Y - - G E N E R A L The respomibility of the consumer. The podnlam has swung too far. IRVING DELvrSCH. Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 468 (22-24 January 1980). This paper is a review of the question of how far our society and laws should go, and have gone, toward the protection of consumers and emPloYeeS. Examples of overproteetion that have caused accidents are given. It is concluded that the consumer, operator, user and overseer must assume more responsibility, and exercise greater care, but we do not want to return, to the old buyer-beware policies of years gone by. Products liability: defective conditions. C. O. SMITH. Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 470 (22-24 January 1980). Developments in products liability litigation require increasing emphasis on safety in design. Some legal criteria now exist for defining design and manufacturing defects. This paper discusses these, applies them in analyzing three specific products, and indicates some implications for engineering design. Management benefits and burdens in regulatory legalisms. HERMAN D. RUE. Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 11 (22-24 January 1980). This paper relates essential aspects of the engineering-law interface to realistic assessment of product design, reliability, safety and quality. Fundamental principles of regulatory legalisms and judicial opinions affecting industry are reviewed. A more equitable balance between assumed benefits and the often untenable burdens to industrial managements is advocated. To avoid company
2. R E L I A B I L I T Y
OF
COMPONENTS,
Preliminary evaluation of DIP/socket connection reliability. GOICaONW. MILLS.IEEE Trans. Components, Hybrids, Mfo Technol. Chmt-2 (4) 476 (December 1979). The availability and recent use of large-scale integration and field programmable memory dual in-line packages (DIP's) has resulted in increased use of DIP sockets and also increased need for reliability data on DIP/socket connections. This experimental study was implemented to explore the reliability of various DiP/socket combinations in terms of MR
~0:8
- I
financial risk exposure, managers and engineers must acquire the basic knowledge regarding current regulations and judicial decisions: the assessment of the engineeringlaw interface cannot be wholly delegated to corporate attorneys. The acquisition of the requisite knowledge is shown to be ieadily obtainable, requiring only personal motivation for the company's economic "well being',. Japanese make qmUty-control pitch. RAY CONNOLLY. Electronics, ! 0 (April 1980). EIA-J tells Washington seminar that secret is no secret, and that IC makers would like to share know-how with US rivals` Draft DoD directive: 5000.xx, Reliability and Malntalnabifity. BL~ H i SWETT,Proc. Annual Reliability and Maintainability Symposium, San Francisco, p. 19 (22-24 January 1980). Following the introduction of some major questions involved in the development of DoD policy on R and M, the text of the 17 May 1979 draft directive is presented in its entirety. That draft was the basis for a session on "New DoD RAM Policy" at the 1980 RAM Symposium. Points of discussion for alld against the various provisions of that draft have not been included here, because the DoD participants had to be free to express a mix of official comments and personal opinions. Product liability prevention--an engineer's viewpoint. RAYMOND GOLDSTerN, Quality Prog. p. 24 (April 1980). Inadequacies in the academic training of the engineer and in personnel motivation may be key contributors to the product liability problem.
TUBES, TRANSISTORS
AND
ICs
contact resistance performance after being subjected to various environmental tests. The parameters explored were (1) DIP lead material and finishes, (2) socket contact finishes and configurations, and (3) insertion levels of 1, 5 and 15 insertions of the DIP's into the sockets. Three different DIP/socket interfaces were Studied: Au/Au, Au/solder, and solder/solder. These were distributed over 20 combinations of 5 DIP's and 4 sockets. Thermal aging, temperature cycling, temperature cycling with high humidity, an 897