Methods of chemical vapor deposition and powder formation

Methods of chemical vapor deposition and powder formation

relatively low average voltage is preferably used. tions are useful for high-speed tin plating. Method of Forming Coating Films and Coated Article ...

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relatively low average voltage is preferably used.

tions are useful for high-speed tin plating.

Method of Forming Coating Films and Coated Article

Apparatus for Plating and Polishing a Semiconductor Workpiece

US.

6790329

(Nippon

Paint

Ltd.) Sakamoto,

H.; Fuijii,

M., et al.

Electrocoating of paint (electrophoretic) such as automotive inner or outer panels to give rust protection. Graph plots time versus. thickness and potential. Tin Plating

U.S. Patent 6797142 (Shipley Co. LLC) Crosby, J.N. Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are given, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte composi-

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Reader queries relating to patents published in

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US. Patent 6797131 (Applied Materials Inc.) Tzou, C.S.; Tsung, J., et al. Apparatus for forming coating on

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US. Patent 6793975 (Micro Coating Technologies Inc.) Hunt, A.T; Hornis, H.G., et al. Powder is formed by CVD or using plasma or flame torch.

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Design of Hardware Features to Facilitate Arc-Spray Coating Applications and Functions

Jim Thomas Supervisor of Maintenance, Waste Treatmentand Electroplating

Deposition and P o w d e r Formation

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M e t h o d s of Chemical Vapor

US. Patent 6797132 (Nutool Inc.) Talieh, H.; Uzoh, C.E. Multi-chamber device, with one plating and one polishing chamber. Plating can be brush plating or e l e c t r o c h e m i c a l - m e c h a n i c a l deposition. Polishing process can be electropolishing or CMP. Claims to offer improved electrolyte m a s s - t r a n s f e r and t h u s allow higher c u r r e n t densities.

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sputter-coating workpiece; this usually has one or more trenches to define arc-spray coating region.

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