least
an
electromagnetic
generating of magnetic manner
material that
induction be
it
in
exciting
which
the
magnetic
field
electromagnetic A movable relative
which
which
to the
which
is capable
object
the intensity
of the fluctuation
penetrates
the
heat generating
least
portion
Furthermore, constructed
an
image that
heating
object
to be heated
device
is disposed
recording the
device
that forms
etching.
and
integrated accelerometer
core.
capacitive
device
is
an
control
to the
having
active
anti-lock
systems
that
S.r.I., Italy has a stator
which
has a circular
extension
arms. These
arms support
electrodes
is
then
grown.
components are
substrate
and beneath
removed,
is excavated another sacrificial mobile
The
the rotor region structures
extending
direction
circuitry
the
sacrificial
an
aperture
substrate. and
USA, Kionix,
or
for
micro-mirror
micro-mirror
is
is useful in
such as in biaxial scanner
or
systems.
Publication date: 13 March R.W.
200 1
McClelland,
N.M.
Rensing,
PM. Zavracky
N.C.
assemblies
released
mirror
are dried
assemblies
and the dried
of separated
mirror
Patent number: US 6200882
of discrete
from a single silicon
wafer. The basic
structure
of the micromechanical
accelerometer
is etched
in the wafer to form a released portion
mounted
assemblies,
which
tape to produce
assemblies.
200 1
Torsional micromechanical system
mirror
A torsional
micromechanical
a mirror
mirror
mirror
structure
rotation a
Technical developments Industry trends
news
industries
Features Technical articles on
Research Trends mirror
rotatably
support
assembly
over and within
of the mirror
includes
a support layer.
system supported for
The latest research results published
in
the key journals
a cavity in
is sized sufficiently
reflecrive
is coplanar
In Brief Breaking
projects and developments
USA
assembly
movement
assembly
supporting
News Business activities
Corporation,
University,
unimpeded
month
around the world
MicroOptical
Northeastern
rotational
Next
Related
K.J. Jackson
a base. The cavity
provided
mirror
Publication date: 13 March
by a torsional
is
are
Inventors: J.D. Drake, J.H. Jerman,
includes
accelerometer
mirror
to produce
The
from the mounting
Applicant:
ulletin
are diced or scribed to produce
the
Inc.,
mirror
assemblies
tape
assemblies.
and
to produce
dried
mirror
the
Foundation
assemblies
The washed
and finally
of the
entails
to an acid release
to produce
to
release
together
method
assemblies
a mounting
assemblies
are separated
for processing formed
mirror
assemblies.
assemblies
of
Inc., USA
The
a plurality
B. Vigna
Smart Materials Bulletin
are
Patent number: US 6201629
and
Davis,
a method
the released mirror
a plurality
2001
capacitive
rinsing
mirror
Inc., USA
A micromechanical
T.J.
one
the remainder
Research
etch to produce
is
Microelectromechanical accelerometer for automotive applications Applicant: Cornell
assembly
and the base. A process
M.B. Spitzer, ED. Aquilino,
assemblies
the mirror
mirror
Patent number: US 6198145 Inventors: I? Ferrari,
mirror
200 1
wafer.
onto
layer
from
a silicon
mounted
chip. Publication date: 6 March
accuracy
actuator the
assemblies
torsional
applications
Inventors:
Technology,
of mirror
mounted
extending
separare
is removed
video display
accelerometers
extreme
presents
of
region
The epitaxial
and the stator,
from
regions
a portion
from
washed
layer
electronic
conductive
a plurality
exposing
and
An epiraxial
subsequently
to define
with radial
is to form a sacrificial
substrate.
forming the entire
and a
The first stage in
and the biasing
formed,
through
circumferential
process
various
drive
spaced across the gap between
The torsional
other
Method for processing a plurality micromachined mirror assemblies This invenrion
on a silicon
electrodes
active
and
a magnetic to
MacDonald
Applicant: Seagate
region
control,
braking
Galvin,
Applicant: STMicroelectronics,
with one another.
provide
assembly
on the mirror
provided.
Publication date: 13 March G.J.
to push
can be used for airbag
to out of plane forces.
Inventors:
microactuator
the
operative
torsional
assembly.
actuator
rhe
Patent number: US 6 199874
2001
which
Other
mirror
means, support
provided
assembly.
An
of the mirror
embodiment, is
metal.
the torsional
mirror
motion
assembly
at the downstream device.
of the torsional
causes rotational
mirror
to apply a driving
By this
the mirror
resistance
heating
be
drive
assembly.
fabricating
require
sensitivity,
may
is operative
to torsionally
In another
torsional
at least one torsion
of an electroplated
assembly
assembly
is provided
includes
The micromechanical
and fixing unit or a pressure of the
may also
from
formed
motion is
the accelerometer
suspension
control,
high
although
accelerometer
wafer
is formed.
deployment,
support
electronics
acceleromerer
steering
for
VLSI
spring
force
in the
as the base. The
assembly
actuator
step
circuitry
on the same
to at
a The
reactive-ion
The accelerometer
signal-conditioning
formed,
form
all etching
a signal-conditioned
Manufacturing a semiconductor material integrated microactuator
the manufacturing
embodiment,
is
Inventor: R. Maeyama
interleaved
etch
magnetic
corresponds
induction
in a substantially
using
on the same wafer from which
is provided
Publication date: 27 February
rotor
etched the first
so as to
electromagnetic
to
accelerometer.
wafer
support
with metal
the basic structure,
preferred
reactive-ion
wherein
Patent number: US 6195525
The integrated
sufficient
is preferably
comprise
are coated
capacitive
for ar least
in another
the
magnetic
body which
electromagnetic
process
electromagneric
the
such
carrying
the
layer.
layer is provided
of
image
etching
of moving
to be heated
induction
induction
penetrates
conditions
substrate
a fluctuation
heat generating
under
to
same
and the released and remaining
of the substrate
an
and
around
generates
induction core
a
manner,
in the substrate, portions
micromechanical
layer of the object
is wound
and
in such a
electromagnetic
opposed
which
core
heat
core made
is disposed
faces
an
coil
magnetic
field
a magnetic
heat generating
heated
change
induction
layer includes
to allow
assembly.
The
structure
for
The
with and formed
Patents Recently published US and WO patents
support from the
May 2001