- Email: [email protected]
Miscellaneous methods and equipment
Bhalla, V., et al., PIufirl~ and Sur@ce Finishing, 82( 11):58; 1995 Dixon, D.S., et al., U.S. Patent 5,413,694; assignors to U.S.A. (Secretary of the Navy) Furukawa, N., et al., AESF SUR/FIN ‘95, Baltimore, June 1995, Session G, p. 211 Popova, S.N., et al., AESF SUR/FIN ‘95, Baltimore, June 1995, Session C, p. 63 Pujhpavanam, M., and S.R. Natarajan, Metal Finishing, 93(6):97; 1995 Ramesh Bapu, G.N.K., Plating and Swface Finishing, 82(7):70; 1995 Ramesh Bapu, G.N.K., and S. Mohan, P/a@
STRIP AND SELECTIVE ELECTRODEPOSITION A surface-treated steel strip comprising an iron-plated layer, and a zinc or zinc-plated layer garnered a patent for Tobiyama et al. Ando et al. recelved a patent for a zinc-chromium composite plated steel sheet. A method for preparation of a blackened steel strip, consisting of an anodized zincalloy plate with an acrylic resin chromate, was patented by Kikuchi et al. Defer and Walter obtained a patent for a method of regulating the electroplating current for deposition onto a metal strip. A method for subjecting an elongated workpiece to turbulent fluid during electroplating, consisting of generating ultrasonic waves converging at a point on the path of travel, was patented by Al-Jiboory and Timewell. Kawachi et al. patented a strip plating apparatus. The benefits of converting to the use of anode baskets to replace bars for strip plating of copper were noted by Panagiotakis and Meth. Techniques for saving precious metals through use of selective reel-to-reel plating were described by Wingenfeld. Abbott and Fritzsche obtained a patent for a method of spot plating silver onto leadframes. Devices featuring masks for selective electrodeposition onto strip materials were the subject of patents granted to Rischke and Thomassen, to Herzog et al., and to Jolly et al. Zwemer received a patent for a device for forming a coating in a longitudinal track on a band of metal substrate. Moffat and Yang described a method for patterned metal electrodeposition using an alkanethiolate mask capable of micrometer dimensions. A method for partial plating of a part using a masking jig won a patent for Owada. Loechel reported on a miMETAL FINISHING
9 FEBRUARY
1996
cromachining process using ultraviolet lithography and electrodeposition as a microforming technique to produce items such as microswitches. A method for selective deposition of gold onto the inside surface of bushtype connectors garnered a patent for Pilorge and Roussel. Tombers et al. patented a method for crown plating a camplate. A precision high-rate jet electroplating cell earned a patent for Tzanavaras and Cohen. Tsurushima patented an injection plating apparatus featuring a mask for processing of semiconductors. Methods for plating of solder bumps were patented by Dautartas, and by Lytle et al. Poris obtained a patent for a selective metal deposition apparatus for semiconductors. A tape automated bonding technique for semiconductor manufacture won a patent for Yumoto et al. Chen received a patent for a method for making circular diode chips incorporating a nickel-plated wafer. The structure and wear resistance of brush-plated nickel were reported by Gering et al. Hutchinson described a trivalent brush-plated chromium deposit. A method and apparatus for depositing hard chromium coatings by brush plating was patented by Van Anglen and Keeney. Cracker and Hurrell reviewed applications for shaft repair using selective brush plating. Applications for brush plating were also discussed by Rodgers. Moskowitz patented a method for selective plating using soluble anodes. A method for the application of an abrasive tip to gas turbine blades won a patent for Long et al. McLaughlin obtained a patent for a mobile electroplating unit mounted on wheels. An electroplating pen garnered a patent for Gershin.
Defer, M.. and J-M. Walter, U.S. Patent 5,421,986; assignors to Sollac Gering, J., et al., Transactions of the Institute qf Metal Finishing, 73(3):X2; 1995 Gershin, M-M., U.S. Patent 5,401,369 Herzog, H., et al., U.S. Patent 5,389,220; assignors to Doduco GmbH & Co. Hutchinson, B., AESF SUR/FIN ‘95, Baltimore, June 1995, Session D, p. 121 Jolly, R., et al., U.S. Patent 5,395,508; assignors to Commissariat A L’Energie Atomique Kawachi, N., et al., U.S. Patent 5,441,619; assignors to Ebara-Udylite Co. Ltd. Kikuchi, K., et al., U.S. Patent 5,395.510; assignors to Kawasaki Steel Corp. Loechel, B., Interface, 4(3):43; 1995 Long, K.C., et al., U.S. Patent 5,389,228; assignors to United Technologies Corp. Lytle, W.H., et al., U.S. Patent 5,391,285; assignors to Motorola Inc. McLaughlin, D.A., U.S. Patent 5,391,279; assignor to Gold Effects Inc. Moffat, T.P., and H. Yang, Jour-nal of the Electrochemical Society, 142( 1l):L220; 1995 Moskowitz, M., U.S. Patent 5,409,593; assignor to Sifco Industries Inc. Owada, H., U.S. Patent 5,374,345 Panagiotakis, G., and D. Meth, Products Finishing, 60(2):74; 1995 Pilorge, Y., and R. Roussel, U.S. Patent 5,372,700; assignors to Framatome Connectors Intl. Poris, J., U.S. Patent 5,368,711 Rischke, J.W., and T. Thomassen, U.S. Patent 5.372.699; assignors to Meco Equipment Engineers B.V. Rodgers, J.M., AESF SUR/FIN ‘9.5, Baltimore, June 199.5, Session D, p. 125 Tobiyama, Y., et al., U.S. Patent 5,447,802; assignors to Kawasaki Steel Corp. Tombers, M.D., et al., U.S. Patent 5,398,791; assignors to General Motors Corp. Tsurushima, K., U.S. Patent 5,417,830; assignor to KK Toshiba Tzanavaras, G., and U. Cohen, U.S. Patent 5.42 1,987 Van Anglen, ES., and H.M. Keeney, U.S. Patent 5,453,174; assignors to Electroplating Technologies Ltd. Wingenfeld, P., AESF SUR/FIN ‘95, Baltimore, June 1995, Session L, p. 513 Yumoto, K., et al., U.S. Patent 5,384,204; assignors to Shinko Electric Industries Co. Ltd. Zwerner, E., U.S. Patent 5,382,343; assignors to EESA Electroplating Engineers S.A.
MISCELLANEOUS AND EQUIPMENT References Abbott, D.C., and R.M. Fritzsche, U.S. Patent 5,384,155; assignors to Texas Instruments Inc. Al-Jiboory, M.M., and R.R. Timewell, U.S. Patent 5,409,594; assignors to Dynamotive Corp. Ando, S., et al., U.S. Patent 5,421,988; assignors to NKK Corp. Chen, C-C., U.S. Patent 5,401,690; assignor to Coodark Electronic Corp. Cracker, D., and J. Hurrell, AESF SUR/FIN ‘95, Baltimore, June 1995, Session D, p. 109 Dautartas, M.F., U.S. Patent 5,396,702; assignor to AT&T Corp.
METHODS
The electrodeposition of nanoscale architectures was reviewed by Switzer and Sheppard. Zhou and Chin investigated mass transfer and particle motion in a plating barrel. The effects of additives and extrapolation of laboratory results in pulse plating were addressed by Baldwin. Aroyo studied the synergistic effect of pulse plating frequency and hydrodynamically active additives on leveling. A process for applying a structured surface coating incorporat39
ing an initial pulse having a trapezoidal shape was patented by Mull. Averill and Anisi used a probalistic method to evaluate primary current distribution in electrodeposition cells. A general model of electrochemical hydrogen absorption into metals was proposed by Lasia and Gregoire. Plating hydrogen was the subject of a paper by Wasserman, who investigated the cathodic activation of hydrogen and found the energy input was less than that theoretically required to reduce the oxide. A method of removing carbonates from cyanide plating baths by cooling and crystallization won a patent for Leutwyler. DeNuccio obtained a patent for a method to control the adverse effects of silica during metal deposition. Compositions for forming protecti1.e coatings on metal surfaces based on benzimidazoles were the subject of patents granted to Adams et al., and to Kukanskis. A method of electroplating half sliding bearings using vertical conveyors was patented by Tanaka et al. Morishita received a patent for a method of photoplating a semiconductor. A multilevel metallization process combining electrodeposition and mechanical polishing garnered a patent for Krishnan and Kumar. Sellitto obtained a patent for a method of coating a ferrous substrate with zinc, consisting of electrostatically depositing a zinc powder in an inert atmosphere, then liquefying and reflowing to create a zinciron interface. Printed circuit board fabrication techniques were the subject of patents granted to Sutcliffe and Conrod, to Kato, to Horikoshi et al., to Crumly et al.. to Hupe and Kronenberg, to Gall and Wilcox, to Gulla, to Jonas and Wolf, to Bladon et al., and to Beyerle and Plascak. Copper foils for the manufacture of printed circuit boards garnered patents for Fukuda et al., and for Wolski et al. Sergio obtained a patent for an apparatus for plating flat components such as circuit boards. Enclosed plating devices featuring the use of an inert atmosphere were the subject of patents granted to Nishimura et al. (I), and to Kosaki. Hartmann et al. (I) obtained a patent for an apparatus for electroplating of thin plastic films. An electrolyte distribution channel for a plating apparatus won a patent for Langenskiold et al. Gerdon and METAL FINISHING
??
FEBRUARY
1996
Worth obtained a patent for a plating apparatus using a single, stagnant rinse bath. An apparatus for electroplating the main surface of a semiconductor substrate won a patent for Mori. Ishida (I and II) received two patents relating to equipment for plating semiconductor wafers. An apparatus for plating of a semiconductor product garnered a patent for Imori. Rezabek offered guidelines for safe selection of electric immersion heaters. Filtration and agitation techniques for improving quality were addressed by Berg. Rodriguez patented a current generation and control system for electrolytic processes. A switching unit for an electroplating apparatus garnered a patent for Nishimura et al. (II). Kauper and Wilhelm patented an apparatus for masking field lines in an electroplating line for planar workpieces. An update on the performance of open-top tumblers as replacements for conventional barrels was provided by Zecher. Lazaro et al. described a system for delivery of solution and rinse water to the inside of plating barrels. A barrel electroplating device featuring spray means was the subject of a patent granted to Lazaro and Yates. Weng patented an electroplating barrel structure incorporating an impeller vane pump driven by the barrel to pump solution out of the barrel interior. The benefits of plastic anode baskets were noted by Mehler. Sitges Menendez et al. obtained a patent for a cathode for electrodeposition of nonferrous metals. A rack bar for releasably holding plate-shaped parts garnered a patent for Strecker. Ettelbruck and Hofmann received a patent for a clamping device for plating of gravure printing cylinders. A “rackless” rack for electroplating incorporating a rotational device won a patent for Ribitch. References Adams, W., et al., U.S. Patent 5,362,334; assignors to MacDermid Inc. Aroyo, MS., Plating and Surface Finishing. 82(11):53;
1995
Averill, A.F., and A. Anisi, Tramactions Institute
ofMetal
Finishing, P.C., Mefal Finishing,
of the 73( 1):26; 1995 93(6):84; 1995
Baldwin, Berg, J., AESF SUR/FIN ‘95, Baltimore, June 1995, Session Z, p. 943 Beyerle, R.A., and R.J. Plascak, U.S. Patent 5.429,738; assignors to Gould Inc. Bladon, J.J., et al., U.S. Patent 5,425,873: assignors to Shipley Co. LLC Crumly, W.R., et al., U.S. Patent 5,364,277; assignors to Hughes Aircraft Co.
DeNuccio, R.J., U.S. Patent 5,429,672; assignor to Hilemn Laboratories Inc. Ettelbruck, R., and K. Hofmann, U.S. Patent 5,399,248; assignors to Maschinenfabrik Kaspar Walter GmbH & Co. Fukuda, K., et al., U.S. Patent 5,356,528; assignors to Fukuda Metal Foil & Powder Co. Ltd. Gall, T.P., and J. Wilcox, US. Patent 5,374,344; assignors to IBM Inc. Gerdon, L.J., and J.R. Worth, U.S. Patent 5,372,701 Gulla, M., U.S. Patent 5,391,421; assignor to Shipley Co. Inc. Hartmann, B., et al., U.S. Patent 5,425,862; assignors to Hans Hollmuller Maschinenbau GmbH & Co. Horikoshi, E., et al., U.S. Patent 5,362,359; assignors to Fujitsu Limited Hupe, J.. and W. Kronenberg, U.S. Patent 5,373,629: assignors to Blasbeg-Oberflachentechnik GmbH Imori, Y., U.S. Patent 5,397,453; assignor to KK Toshiba Ishida, H. (I), U.S. Patent 5.429,733; assignor to Electroplating Engineers of Japan Ltd. Ishida, H. (II), U.S. Patent 5.447,615; assignor to Electroplating Engineers of Japan Ltd. Jonas, E, and G-D. Wolf, U.S. Patent 5,403,467; assignors to Bayer AG Kato, Y., U.S. Patent 5,352,325; assignor to Eastern Co. Ltd. Kauper, R., and G. Wilhelm, U.S. Patent 5.401,370; assignors to Atotech Deutschland GmbH Kosaki, K., U.S. Patent 5,441,629; assignor to Mitsubishi Denki KK Krishnan, A., and N. Kumar. U.S. Patent 5,45 1,55 1 Kukanskis, P.E., U.S. Patent 5,376,189; assignor to MacDetmid Inc. Langenskiold, C.G., et al., U.S. Patent 5.427,674; assignors to Cinram Ltd. Lasia, A., and D. Gregoire, Jownal qf the Electrochemical
Sociery. 142(10):3393;
1995
Lazaro, A.E., and W. Yates, U.S. Patent 5,419,X23; assignors to Hardwood Line Mfg. co. Lazaro, A.E., et al., 16th AESF/EPA Pollution Prevention and Control Conference, Kissimmee, Fla., Feb. 1995. p. 353 Leutwyler, R., U.S. Patent 5,376,256 Mehler, V., Products Finishing, 59(6):74; 1995 Mori, H., US. Patent 5,443,707; assignor to NEC Corp. Morishita, S., U.S. Patent 5,424,252; assignor to KK Toyota Chuo Kenkyusho Mull, K., U.S. Patent 5,415,761; assignor to Heidelberger Druckmaschinen AG Nishimura, S., et al. (I), U.S. Patent 5,431,801; assignors to Yamaha Corp. Nishimura, S., et al. (II), U.S. Patent 5,441,620; assignors to Yamaha Corp. Rezabek, D.J., Pwducrs Finishing. 59(8):65: 1995
Ribitch, R.W., U.S. Patent 5360,527; assignor to Hitachi Magnetics Corp. Rodriguez, D., U.S. Patent 5,352,346; assignor to Novamax Technologies Holdings Inc. Sellitto, T.A.. U.S. Patent 5,384,165; assignor to SMS Engineering Inc. Sergio. S., U.S. Patent 5,417,828 Sitges Menendea, F.J., et al., U.S. Patent 5,443,708; assignors to Auturiana De Zinc Strecker, G., U.S. Patent 5,380,418
41
STRIP AND SELECTIVE ELECTRODEPOSITION A surface-treated steel strip comprising an iron-plated layer, and a zinc or zinc-plated layer garnered a patent for Tobiyama et al. Ando et al. recelved a patent for a zinc-chromium composite plated steel sheet. A method for preparation of a blackened steel strip, consisting of an anodized zincalloy plate with an acrylic resin chromate, was patented by Kikuchi et al. Defer and Walter obtained a patent for a method of regulating the electroplating current for deposition onto a metal strip. A method for subjecting an elongated workpiece to turbulent fluid during electroplating, consisting of generating ultrasonic waves converging at a point on the path of travel, was patented by Al-Jiboory and Timewell. Kawachi et al. patented a strip plating apparatus. The benefits of converting to the use of anode baskets to replace bars for strip plating of copper were noted by Panagiotakis and Meth. Techniques for saving precious metals through use of selective reel-to-reel plating were described by Wingenfeld. Abbott and Fritzsche obtained a patent for a method of spot plating silver onto leadframes. Devices featuring masks for selective electrodeposition onto strip materials were the subject of patents granted to Rischke and Thomassen, to Herzog et al., and to Jolly et al. Zwemer received a patent for a device for forming a coating in a longitudinal track on a band of metal substrate. Moffat and Yang described a method for patterned metal electrodeposition using an alkanethiolate mask capable of micrometer dimensions. A method for partial plating of a part using a masking jig won a patent for Owada. Loechel reported on a miMETAL FINISHING
9 FEBRUARY
1996
cromachining process using ultraviolet lithography and electrodeposition as a microforming technique to produce items such as microswitches. A method for selective deposition of gold onto the inside surface of bushtype connectors garnered a patent for Pilorge and Roussel. Tombers et al. patented a method for crown plating a camplate. A precision high-rate jet electroplating cell earned a patent for Tzanavaras and Cohen. Tsurushima patented an injection plating apparatus featuring a mask for processing of semiconductors. Methods for plating of solder bumps were patented by Dautartas, and by Lytle et al. Poris obtained a patent for a selective metal deposition apparatus for semiconductors. A tape automated bonding technique for semiconductor manufacture won a patent for Yumoto et al. Chen received a patent for a method for making circular diode chips incorporating a nickel-plated wafer. The structure and wear resistance of brush-plated nickel were reported by Gering et al. Hutchinson described a trivalent brush-plated chromium deposit. A method and apparatus for depositing hard chromium coatings by brush plating was patented by Van Anglen and Keeney. Cracker and Hurrell reviewed applications for shaft repair using selective brush plating. Applications for brush plating were also discussed by Rodgers. Moskowitz patented a method for selective plating using soluble anodes. A method for the application of an abrasive tip to gas turbine blades won a patent for Long et al. McLaughlin obtained a patent for a mobile electroplating unit mounted on wheels. An electroplating pen garnered a patent for Gershin.
Defer, M.. and J-M. Walter, U.S. Patent 5,421,986; assignors to Sollac Gering, J., et al., Transactions of the Institute qf Metal Finishing, 73(3):X2; 1995 Gershin, M-M., U.S. Patent 5,401,369 Herzog, H., et al., U.S. Patent 5,389,220; assignors to Doduco GmbH & Co. Hutchinson, B., AESF SUR/FIN ‘95, Baltimore, June 1995, Session D, p. 121 Jolly, R., et al., U.S. Patent 5,395,508; assignors to Commissariat A L’Energie Atomique Kawachi, N., et al., U.S. Patent 5,441,619; assignors to Ebara-Udylite Co. Ltd. Kikuchi, K., et al., U.S. Patent 5,395.510; assignors to Kawasaki Steel Corp. Loechel, B., Interface, 4(3):43; 1995 Long, K.C., et al., U.S. Patent 5,389,228; assignors to United Technologies Corp. Lytle, W.H., et al., U.S. Patent 5,391,285; assignors to Motorola Inc. McLaughlin, D.A., U.S. Patent 5,391,279; assignor to Gold Effects Inc. Moffat, T.P., and H. Yang, Jour-nal of the Electrochemical Society, 142( 1l):L220; 1995 Moskowitz, M., U.S. Patent 5,409,593; assignor to Sifco Industries Inc. Owada, H., U.S. Patent 5,374,345 Panagiotakis, G., and D. Meth, Products Finishing, 60(2):74; 1995 Pilorge, Y., and R. Roussel, U.S. Patent 5,372,700; assignors to Framatome Connectors Intl. Poris, J., U.S. Patent 5,368,711 Rischke, J.W., and T. Thomassen, U.S. Patent 5.372.699; assignors to Meco Equipment Engineers B.V. Rodgers, J.M., AESF SUR/FIN ‘9.5, Baltimore, June 199.5, Session D, p. 125 Tobiyama, Y., et al., U.S. Patent 5,447,802; assignors to Kawasaki Steel Corp. Tombers, M.D., et al., U.S. Patent 5,398,791; assignors to General Motors Corp. Tsurushima, K., U.S. Patent 5,417,830; assignor to KK Toshiba Tzanavaras, G., and U. Cohen, U.S. Patent 5.42 1,987 Van Anglen, ES., and H.M. Keeney, U.S. Patent 5,453,174; assignors to Electroplating Technologies Ltd. Wingenfeld, P., AESF SUR/FIN ‘95, Baltimore, June 1995, Session L, p. 513 Yumoto, K., et al., U.S. Patent 5,384,204; assignors to Shinko Electric Industries Co. Ltd. Zwerner, E., U.S. Patent 5,382,343; assignors to EESA Electroplating Engineers S.A.
MISCELLANEOUS AND EQUIPMENT References Abbott, D.C., and R.M. Fritzsche, U.S. Patent 5,384,155; assignors to Texas Instruments Inc. Al-Jiboory, M.M., and R.R. Timewell, U.S. Patent 5,409,594; assignors to Dynamotive Corp. Ando, S., et al., U.S. Patent 5,421,988; assignors to NKK Corp. Chen, C-C., U.S. Patent 5,401,690; assignor to Coodark Electronic Corp. Cracker, D., and J. Hurrell, AESF SUR/FIN ‘95, Baltimore, June 1995, Session D, p. 109 Dautartas, M.F., U.S. Patent 5,396,702; assignor to AT&T Corp.
METHODS
The electrodeposition of nanoscale architectures was reviewed by Switzer and Sheppard. Zhou and Chin investigated mass transfer and particle motion in a plating barrel. The effects of additives and extrapolation of laboratory results in pulse plating were addressed by Baldwin. Aroyo studied the synergistic effect of pulse plating frequency and hydrodynamically active additives on leveling. A process for applying a structured surface coating incorporat39
ing an initial pulse having a trapezoidal shape was patented by Mull. Averill and Anisi used a probalistic method to evaluate primary current distribution in electrodeposition cells. A general model of electrochemical hydrogen absorption into metals was proposed by Lasia and Gregoire. Plating hydrogen was the subject of a paper by Wasserman, who investigated the cathodic activation of hydrogen and found the energy input was less than that theoretically required to reduce the oxide. A method of removing carbonates from cyanide plating baths by cooling and crystallization won a patent for Leutwyler. DeNuccio obtained a patent for a method to control the adverse effects of silica during metal deposition. Compositions for forming protecti1.e coatings on metal surfaces based on benzimidazoles were the subject of patents granted to Adams et al., and to Kukanskis. A method of electroplating half sliding bearings using vertical conveyors was patented by Tanaka et al. Morishita received a patent for a method of photoplating a semiconductor. A multilevel metallization process combining electrodeposition and mechanical polishing garnered a patent for Krishnan and Kumar. Sellitto obtained a patent for a method of coating a ferrous substrate with zinc, consisting of electrostatically depositing a zinc powder in an inert atmosphere, then liquefying and reflowing to create a zinciron interface. Printed circuit board fabrication techniques were the subject of patents granted to Sutcliffe and Conrod, to Kato, to Horikoshi et al., to Crumly et al.. to Hupe and Kronenberg, to Gall and Wilcox, to Gulla, to Jonas and Wolf, to Bladon et al., and to Beyerle and Plascak. Copper foils for the manufacture of printed circuit boards garnered patents for Fukuda et al., and for Wolski et al. Sergio obtained a patent for an apparatus for plating flat components such as circuit boards. Enclosed plating devices featuring the use of an inert atmosphere were the subject of patents granted to Nishimura et al. (I), and to Kosaki. Hartmann et al. (I) obtained a patent for an apparatus for electroplating of thin plastic films. An electrolyte distribution channel for a plating apparatus won a patent for Langenskiold et al. Gerdon and METAL FINISHING
??
FEBRUARY
1996
Worth obtained a patent for a plating apparatus using a single, stagnant rinse bath. An apparatus for electroplating the main surface of a semiconductor substrate won a patent for Mori. Ishida (I and II) received two patents relating to equipment for plating semiconductor wafers. An apparatus for plating of a semiconductor product garnered a patent for Imori. Rezabek offered guidelines for safe selection of electric immersion heaters. Filtration and agitation techniques for improving quality were addressed by Berg. Rodriguez patented a current generation and control system for electrolytic processes. A switching unit for an electroplating apparatus garnered a patent for Nishimura et al. (II). Kauper and Wilhelm patented an apparatus for masking field lines in an electroplating line for planar workpieces. An update on the performance of open-top tumblers as replacements for conventional barrels was provided by Zecher. Lazaro et al. described a system for delivery of solution and rinse water to the inside of plating barrels. A barrel electroplating device featuring spray means was the subject of a patent granted to Lazaro and Yates. Weng patented an electroplating barrel structure incorporating an impeller vane pump driven by the barrel to pump solution out of the barrel interior. The benefits of plastic anode baskets were noted by Mehler. Sitges Menendez et al. obtained a patent for a cathode for electrodeposition of nonferrous metals. A rack bar for releasably holding plate-shaped parts garnered a patent for Strecker. Ettelbruck and Hofmann received a patent for a clamping device for plating of gravure printing cylinders. A “rackless” rack for electroplating incorporating a rotational device won a patent for Ribitch. References Adams, W., et al., U.S. Patent 5,362,334; assignors to MacDermid Inc. Aroyo, MS., Plating and Surface Finishing. 82(11):53;
1995
Averill, A.F., and A. Anisi, Tramactions Institute
ofMetal
Finishing, P.C., Mefal Finishing,
of the 73( 1):26; 1995 93(6):84; 1995
Baldwin, Berg, J., AESF SUR/FIN ‘95, Baltimore, June 1995, Session Z, p. 943 Beyerle, R.A., and R.J. Plascak, U.S. Patent 5.429,738; assignors to Gould Inc. Bladon, J.J., et al., U.S. Patent 5,425,873: assignors to Shipley Co. LLC Crumly, W.R., et al., U.S. Patent 5,364,277; assignors to Hughes Aircraft Co.
DeNuccio, R.J., U.S. Patent 5,429,672; assignor to Hilemn Laboratories Inc. Ettelbruck, R., and K. Hofmann, U.S. Patent 5,399,248; assignors to Maschinenfabrik Kaspar Walter GmbH & Co. Fukuda, K., et al., U.S. Patent 5,356,528; assignors to Fukuda Metal Foil & Powder Co. Ltd. Gall, T.P., and J. Wilcox, US. Patent 5,374,344; assignors to IBM Inc. Gerdon, L.J., and J.R. Worth, U.S. Patent 5,372,701 Gulla, M., U.S. Patent 5,391,421; assignor to Shipley Co. Inc. Hartmann, B., et al., U.S. Patent 5,425,862; assignors to Hans Hollmuller Maschinenbau GmbH & Co. Horikoshi, E., et al., U.S. Patent 5,362,359; assignors to Fujitsu Limited Hupe, J.. and W. Kronenberg, U.S. Patent 5,373,629: assignors to Blasbeg-Oberflachentechnik GmbH Imori, Y., U.S. Patent 5,397,453; assignor to KK Toshiba Ishida, H. (I), U.S. Patent 5.429,733; assignor to Electroplating Engineers of Japan Ltd. Ishida, H. (II), U.S. Patent 5.447,615; assignor to Electroplating Engineers of Japan Ltd. Jonas, E, and G-D. Wolf, U.S. Patent 5,403,467; assignors to Bayer AG Kato, Y., U.S. Patent 5,352,325; assignor to Eastern Co. Ltd. Kauper, R., and G. Wilhelm, U.S. Patent 5.401,370; assignors to Atotech Deutschland GmbH Kosaki, K., U.S. Patent 5,441,629; assignor to Mitsubishi Denki KK Krishnan, A., and N. Kumar. U.S. Patent 5,45 1,55 1 Kukanskis, P.E., U.S. Patent 5,376,189; assignor to MacDetmid Inc. Langenskiold, C.G., et al., U.S. Patent 5.427,674; assignors to Cinram Ltd. Lasia, A., and D. Gregoire, Jownal qf the Electrochemical
Sociery. 142(10):3393;
1995
Lazaro, A.E., and W. Yates, U.S. Patent 5,419,X23; assignors to Hardwood Line Mfg. co. Lazaro, A.E., et al., 16th AESF/EPA Pollution Prevention and Control Conference, Kissimmee, Fla., Feb. 1995. p. 353 Leutwyler, R., U.S. Patent 5,376,256 Mehler, V., Products Finishing, 59(6):74; 1995 Mori, H., US. Patent 5,443,707; assignor to NEC Corp. Morishita, S., U.S. Patent 5,424,252; assignor to KK Toyota Chuo Kenkyusho Mull, K., U.S. Patent 5,415,761; assignor to Heidelberger Druckmaschinen AG Nishimura, S., et al. (I), U.S. Patent 5,431,801; assignors to Yamaha Corp. Nishimura, S., et al. (II), U.S. Patent 5,441,620; assignors to Yamaha Corp. Rezabek, D.J., Pwducrs Finishing. 59(8):65: 1995
Ribitch, R.W., U.S. Patent 5360,527; assignor to Hitachi Magnetics Corp. Rodriguez, D., U.S. Patent 5,352,346; assignor to Novamax Technologies Holdings Inc. Sellitto, T.A.. U.S. Patent 5,384,165; assignor to SMS Engineering Inc. Sergio. S., U.S. Patent 5,417,828 Sitges Menendea, F.J., et al., U.S. Patent 5,443,708; assignors to Auturiana De Zinc Strecker, G., U.S. Patent 5,380,418
41