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Nanoelectronics as a technological revolution
World Abstracts on Microelectronics and Reliability
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has resulted in a processor based message switching system capable of integrating both exchange maintenance and network operations and management. The paper describes equipment capable of serving at least 200,000 subscriber lines; 7 different exchange types may be accommodated simultaneously (including existing electromechanical systems that produce fault message outputs).
Computerized fault tree analyses at Duke Power Company. FRED KOHANSEDGH. J. Products Liability 2, 21 (1978). A computer program (COFTAP) has been developed to assist reliability analysts in the evaluation and plotting of large and complex fault trees. The program capabilities include the time dependent reliability evaluation of systems which are comprised of components with constant failure rates.
Development of vendor quality control. Y. R. RAU, QR J. India p. 9. A substantial part of the quality problems in our production shops is known to be of materials origin. Yet, the preventive approach for ensuring quality of incoming materials is not much in evidence. The need for, and advantages of, promoting scientific vendor quality control procedures by the larger manufacturers, after a survey, as a means of ensuring incoming materials quality is explained with examples.
Logic-state and signature analysis combine for fast, easy testing. IRA H. SPECTOR. Electronics p. 141 (8 June 1978). Microprocessor-based tester enhances logic-state analysis with signature-analysis algorithm that operates on stored data to find hardware and software faults quickly.
Board inventories mount. Electronics p. 83 (8 June 1978). Computer makers seek the ideal field tester as way to get off the expensive merry-go-round of replace, repair, and ship.
Processor-based tester goes on site to isolate board faults automatically. ROBERT E. ANDERSON, ROBERT G. FULKS, CHARLES P. FRUSTERIO, ["RANK S. MEAD and DONALD E. PHELPS. Electronics p. III (11 May 1978). Guided-probe technique of finding faults and a data store that uses a simple interactive language make field repair easy and cut the costs of board swapping.
4. M I C R O E L E C T R O N I C S - - G E N E R A L Nanoelectronies as a technological revolution. W. HARTMANN. Nachrichtentechnik Elektronik 28, (5) 180 (I 978) (in German). In spite of great technical-economic successes the development of silicon planar technology based integrated circuits is not founded on a consequent scientific technology. Therefore comprehensive reserves must still be opened up, of which the transition to nanoelectronics with structural elements in the submicron range is under way and will have decisive importance. All fields of the semiconductor theory and components, science of materials, technology and measuring technique must newly be considered, as must be manufacturing processes in general and the use of highly integrated circuits. An update: CCD and bubble memories. DEAN TOOMBS. 1EEL Spectrum p. 22 (April 1978). Last year's emergence of both a single-chip 64-kbit (lk = 1024) charge-coupleddevice (CCD) and a 92-kbit magnetic-bubble memory (MBM) represents a leading edge of new memory-product developments. Already, laboratory design concepts and technologies are being aligned to create the next generation of these solid-state circuits. Concurrently, longer-range advanced laboratory programs are anticipating chargecoupled and magnetic-bubble memories in the multimegabit range by the early 1980s. Several changes occurring in computer architecture are
providing the "market poll" for these memories. In some cases, the changes are made possible by the characteristics of the new products--for example, the comparatively low latency time of ¢¢Ds and the nonvolatility of MBMS. CCD and bubble memories: System implications. DEAN TOOMaS. IEEE Spectrum p. 36 (May 1978). For many years, an "access gap" existed between fast electronic memories (< 1-#s access time) and the slower magnetic serial-access memories (>5X103-fls access time), a gap that was not to be bridged until the mid-1970s with the emergence of viable cost-effective new electronic technologies--electronbeam addressable memories (E/3AMS),charge-coupled-device (COD) memories, and magnetic-bubble memories (MBMS). Now, price/performance tradeoffs for these memory technologies have led to several new options in computer architecture, as will be shown here for the case of ¢CDS and MBMS. Already, both a single-chip 64-kbit teD memory and a 92-kbit M~M have reached the commercial marketplace. Moreover, laboratory design concepts and technologies are being developed for next-generation circuits, as longerrange programs presage charge-coupled-device and magnetic-bubble memories in the multimegabit range by the next decade.
5. M I C R O E L E C T R O N I C S D E S I G N A N D C O N S T R U C T I O N Frequency limitations of transferred electron devices related to quality of contacts. L. F. EASTMANand M. S. SHUR. SolidSt. Electron. 21, 787 (1978). Output power, efficiency and negative resistance of transferred electron generators are estimated in the frame of a simple model. The results are used to analyze how the finite contact resistance and the skin-effect set up a limit for the upper frequency of the generation. Bonding systems for microinterconnect tape technology. A LAN KEIZER and DON BROWN. Solid-St. Technol. p. 59 (March 1978). Microinterconnect tape technology has become an increasingly attractive solution to the problems of micro-
assembly and component fabrication. Massbond equipment and systems have been developed which address the total problem of microassembly. Tooling and equipment systems are described which are feasible for many levels of use, from laboratory and preproduction work to high volume production.
La macrolithographie: Principes generaux, outiis, tendanees. G. PIRCHER. Revue Technique Thomson-CSF 10, (1) 5 (March 1978)(in French). Microlithography is a technology which defines, on a usually semiconductor plane substrate, a transfer of material to produce a microcircuit. It employs extremely complex composition and replica-
229
has resulted in a processor based message switching system capable of integrating both exchange maintenance and network operations and management. The paper describes equipment capable of serving at least 200,000 subscriber lines; 7 different exchange types may be accommodated simultaneously (including existing electromechanical systems that produce fault message outputs).
Computerized fault tree analyses at Duke Power Company. FRED KOHANSEDGH. J. Products Liability 2, 21 (1978). A computer program (COFTAP) has been developed to assist reliability analysts in the evaluation and plotting of large and complex fault trees. The program capabilities include the time dependent reliability evaluation of systems which are comprised of components with constant failure rates.
Development of vendor quality control. Y. R. RAU, QR J. India p. 9. A substantial part of the quality problems in our production shops is known to be of materials origin. Yet, the preventive approach for ensuring quality of incoming materials is not much in evidence. The need for, and advantages of, promoting scientific vendor quality control procedures by the larger manufacturers, after a survey, as a means of ensuring incoming materials quality is explained with examples.
Logic-state and signature analysis combine for fast, easy testing. IRA H. SPECTOR. Electronics p. 141 (8 June 1978). Microprocessor-based tester enhances logic-state analysis with signature-analysis algorithm that operates on stored data to find hardware and software faults quickly.
Board inventories mount. Electronics p. 83 (8 June 1978). Computer makers seek the ideal field tester as way to get off the expensive merry-go-round of replace, repair, and ship.
Processor-based tester goes on site to isolate board faults automatically. ROBERT E. ANDERSON, ROBERT G. FULKS, CHARLES P. FRUSTERIO, ["RANK S. MEAD and DONALD E. PHELPS. Electronics p. III (11 May 1978). Guided-probe technique of finding faults and a data store that uses a simple interactive language make field repair easy and cut the costs of board swapping.
4. M I C R O E L E C T R O N I C S - - G E N E R A L Nanoelectronies as a technological revolution. W. HARTMANN. Nachrichtentechnik Elektronik 28, (5) 180 (I 978) (in German). In spite of great technical-economic successes the development of silicon planar technology based integrated circuits is not founded on a consequent scientific technology. Therefore comprehensive reserves must still be opened up, of which the transition to nanoelectronics with structural elements in the submicron range is under way and will have decisive importance. All fields of the semiconductor theory and components, science of materials, technology and measuring technique must newly be considered, as must be manufacturing processes in general and the use of highly integrated circuits. An update: CCD and bubble memories. DEAN TOOMBS. 1EEL Spectrum p. 22 (April 1978). Last year's emergence of both a single-chip 64-kbit (lk = 1024) charge-coupleddevice (CCD) and a 92-kbit magnetic-bubble memory (MBM) represents a leading edge of new memory-product developments. Already, laboratory design concepts and technologies are being aligned to create the next generation of these solid-state circuits. Concurrently, longer-range advanced laboratory programs are anticipating chargecoupled and magnetic-bubble memories in the multimegabit range by the early 1980s. Several changes occurring in computer architecture are
providing the "market poll" for these memories. In some cases, the changes are made possible by the characteristics of the new products--for example, the comparatively low latency time of ¢¢Ds and the nonvolatility of MBMS. CCD and bubble memories: System implications. DEAN TOOMaS. IEEE Spectrum p. 36 (May 1978). For many years, an "access gap" existed between fast electronic memories (< 1-#s access time) and the slower magnetic serial-access memories (>5X103-fls access time), a gap that was not to be bridged until the mid-1970s with the emergence of viable cost-effective new electronic technologies--electronbeam addressable memories (E/3AMS),charge-coupled-device (COD) memories, and magnetic-bubble memories (MBMS). Now, price/performance tradeoffs for these memory technologies have led to several new options in computer architecture, as will be shown here for the case of ¢CDS and MBMS. Already, both a single-chip 64-kbit teD memory and a 92-kbit M~M have reached the commercial marketplace. Moreover, laboratory design concepts and technologies are being developed for next-generation circuits, as longerrange programs presage charge-coupled-device and magnetic-bubble memories in the multimegabit range by the next decade.
5. M I C R O E L E C T R O N I C S D E S I G N A N D C O N S T R U C T I O N Frequency limitations of transferred electron devices related to quality of contacts. L. F. EASTMANand M. S. SHUR. SolidSt. Electron. 21, 787 (1978). Output power, efficiency and negative resistance of transferred electron generators are estimated in the frame of a simple model. The results are used to analyze how the finite contact resistance and the skin-effect set up a limit for the upper frequency of the generation. Bonding systems for microinterconnect tape technology. A LAN KEIZER and DON BROWN. Solid-St. Technol. p. 59 (March 1978). Microinterconnect tape technology has become an increasingly attractive solution to the problems of micro-
assembly and component fabrication. Massbond equipment and systems have been developed which address the total problem of microassembly. Tooling and equipment systems are described which are feasible for many levels of use, from laboratory and preproduction work to high volume production.
La macrolithographie: Principes generaux, outiis, tendanees. G. PIRCHER. Revue Technique Thomson-CSF 10, (1) 5 (March 1978)(in French). Microlithography is a technology which defines, on a usually semiconductor plane substrate, a transfer of material to produce a microcircuit. It employs extremely complex composition and replica-