Nanotechnology: Research & Perspectives

12. Bloomstein, T. M.; Ehrlich, D. J. Laser Deposition and Etching of Three-dimensional Microetructuree. 1991 International Conference on Solid-State Sensors and Actuators - Transducers '91; 1991 Jun 24. Piscataway, NJ: IEEE Service Center; 1991: 507-511. A patterning machine capable of 5 x 104 pixel per second random access scanning has been developed as a tool for laser microchemical fabrication of three-dimensional parts. The tool is designed to implement precision laser deposition and etching reactions through a direct interface to solid modeling CAD/CAM (computer-aided design and manufacturing) software. Initial results with the machine demonstrate clean etching of germanium and silicon with micrometer depth control and high speeds. High material selectivity has been exploited to write buried flow channels under oxide membranes. Processing of partially fabricated silicon pads, including those with damage-prone electronic devices already in place, should be possible. 1 Ref. 13. Tokarev, Vladimir N.; Konov, Vitaly I. Light-induced Polishing of Evaporating Surface. Proceedings of SPIE Excimer Lasers and Applications III; 1991 Mar 13. Bellingham, WA: Int. Soc. for Optical Engineering; 1991; Vol 1503: 269278. Theoretical model of surface polishing of materials evaporating by light from solid phase is proposed. On the basis of the model the explanation is given for the experimentally observed earlier phenomenon of diamond films surface polishing as a result of their graphitization and vaporization from solid phase under the action of multipulse radiation of excimer XeCI laser. The proposed model of surface polishing by light can be applied also for the case of thermochemical etching by radiation where the rate of etching also has Arrhenius dependence on surface temperature. This new technique has promising possibilities in processing of hard and superhard materials. (Author abstract) 5 Refs. 14. anon. Miniaturization Technologies. Washington, DC: Office of Technology Assessment; 1991 Nov; OTA-TCT-514. 55 pages. The report assesses U.S. and foreign R&D in a wide range of miniaturization technologies including electronics, sensors and micro-mechanical devices. The primary driving force behind miniaturization since WW II has been electronics. Past electronics miniaturization has resulted in massive markets and market advantage in areas such as computers, consumer electronics, defense, aerospace, and automobiles. Future advances in miniaturization will surely be driven by electronics as well, and advances in sensors will begin to have larger impacts than in the past. 15. Crandall, B. C., Editor. Nanotechnology: Research & Perspectives. MIT Press; 1992 Oct. 480 pages. ISBN: 0262-03195-7. 16. Leistner, A. J.; Thwaite, E. G.; Lesha, F.; Bennett, J. M. Polishing Study using Teflon and Pitch Laps to Produce Flat and Supersmooth Surfaces. Applied Optics. 1992 Apr 1; Teflon polishing is compared with pitch polishing as a method for achieving supersmooth and flat optical surfaces. Because a teflon lap wears slowly, it retains its surface shape to produce extremely flat optical surfaces, Z/100, consistently and reliably for extended periods of time, of the order of days. To compare the two methods, the authors polished 50 mm diameter samples of various optical materials, using colloidal suspensions in water on both pitch and Teflon laps under the same polishing conditions. Flatness was maintained to better than ~/10, and roughness less than 10 aa rms was measured on all samples by two Talystep surface-profiling instruments, one in the United States and one in Australia, with excellent agreement between measurements made by the two instruments. It was possible to obtain flat and smooth surfaces (<4 aa rms roughness) on all materials (except for F4, flint glass), but only certain combinations of material, abrasive, and lap could be used to give the correct polishing conditions and surface chemistry. 17. Akhmetzyanov, I. D.; Bedunkevich, V. V.; II'in, V. I. Possibilities and Conditions of Use the Method of Dry Electrostatic Cooling while Cutting Metals. Elektronnaya Obrabotka Materialov. 1991 Sep; 5: 71-74. Method of electrostatic cooling is analyzed in application to metal cutting with tools of superhard materials and metalloceramics. It is shown that the use of dried and ionized air results in increase of cutting tool durability and reliability for 3-4 times with simultaneous decrease of environment pollution. 4 Refs. In Russian. 18. Blau, P. J. Report on the Planning Workshop on Cost-effective Ceramic Machining. Cost Effective Ceramic Machining (CECM) Workshop. Oak Ridge, TN: Oak Ridge National Lab; 1991 Nov; ORNL/M-1745. 75 pages. A workshop on Cost Effective Ceramic Machining (CECM) was held at Oak Ridge Associated Universities Pollard Auditorium, Oak Ridge, Tennessee, May 1991. The purpose of this workshop was to present a preliminary project plan for industry critique and to identify specific components and cost-reduction targets for a new project on Cost Effective Ceramic Machining. The CECM project is an extension of the work on the Ceramic Technology for Advanced Heat Engines (CTAHE) Program sponsored by the Department of Energy, Office of Transportation Materials. The workshop consisted of fifteen invited papers, discussions, a survey of the attendee's opinions, and a tour of the High Temperature Materials Laboratory at ORNL. The total number of registrants was sixty-seven, including thirty-three from industry or private sector organizations, seven from universities, three from industry groups, fourteen from DOE laboratories (including ORNL, Y-12, and Lawrence Livermore National Laboratory), three from trade associations, and three from other government organizations. Forty-one survey forms, which critiqued the proposed project plan, were completed by attendees, and the results are presented in this report. Valves, cam roller followers, water pump seals, and diesel engine head plates were rated highest fro application of ceramic machining concepts to reduce cost. Coarse grinding, abrasives and wheel technology, and fine grinding were most highly rated as regards their impact on cost reduction. Specific cost-reduction targets for given parts varied greatly in the survey results and were not felt to be useful for the purposes for the CECM plan development. A range of individual comments were obtained and are listed in an appendix. As a result of the workshop and subsequent discussions, a modified project plan, different in certain aspects from the original CECM plan, has been developed.

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OCTOBER 1992 VOL 14 NO 4