- Email: [email protected]
No-O-Ring ensures leak-free seal
Static sealing certification issued by the Underwriters Laboratories to the its Tennessee elastomeric O-ring and seal manufacturing facilities. These certifications come as the result of successfully completed reassessment audits to IS0 9002, and include upgrade certification to &S-9000, the quality system defining the fundamental quality expectations of Ford, Chrysler and General Motors for internal and external suppliers in the automotive industry. Contact: Wynn’s Precision, 500 North State College Boulevard, Suite 700, Orange, California 92868, USA. Tel: +l 714 938 3700.
GTC head elected to Fluid Sealing Association board Mr Phil Paino, company president of Greene, Tweed & Co, has joined the board of directors of the Fluid Sealing Association. Mr Paino has been with GTC for 31 years, starting his career with the company in 1966 as a field sales representative. He subsequently held several sales and marketing positions until 1982 when he was elected company president by the board. He is a 1962 graduate of Drexel University with a BS degree in Finance. Contact: The Fluid Sealing Association, 995 Old Eagle Road, Suite 1019, Wayne, PA 19087, USA. Tel: +l 610 971 4850; Fax: +l 610 971 4859: www.fluidsealing.com
Semiconductor sealing handbook published In response to a long-standing need, the first definitive sealing handbook for the semiconductor manufacturing industry has now been created. Greene, Tweed 8r Co. will soon release The Right Seal, a comprehensive guide to seals and sealing in semiconductor fabrication processes. GTC believes the handbook to be the first of its kind in the sealing industry. The Right Seal contains detailed technical information on a wide variety of seal types and materials, specifically for the benefit of those individuals who design equipment and specify seals and sealing materials for the semiconductor fabrication industry. Each of the seal designs and materials discussed in these pages has a proven track
Sealing
Technology
No. 47
record in the complex and unforgiving applications encountered in semiconductor processing. While Greene, Tweed’s products are naturally featured in the publication, the handbook is broad-based and comprehensive. Included are chapters on:
.
Sealing requirements of the semiconductor industry Physical properties of elastomers O-ring seals Dovetail seals MSE seals Specialty applications Seal gland design Glossary of semiconductor Sealing terms
Also included in the fully illustrated handbook is a comprehensive collection of data sheets and technical materials relating to Semiconductor manufacturing sealing. Complimentary copies of The Right Seal will be made available to semiconductor industry professionals upon request. Contact: Greene, Tweed & Co, Semiconductor Division, San Jose, CA, USA. Tel: +l ,408 468 0180; Fax: +l 408 468 0170.
No-O-Ring ensures leak-free seal Furon has developed an innovative PFA union featuring a tongue and groove seal joint that offers reliable, leak-free service without the need for an O-ring. The No-O-Ring union is engineered to join components in welded PFA piping systems for ambient and high temperature wet process tools in the semiconductor industry. In addition to eliminating leakage and contamination issues associated with O-ring connections, the No-O-Ring union is quickly assembled and disassembled. The joint is made from high-purity PFA with a non-wetted ETFE nut, materials which do not introduce contammation into the system or react to the corrosive chemicals used in the semiconductor industry. The tongue and groove desigr. eliminates fluoroelastomeric O-rings, which tend to be a source of contamination, retained chemicals. bacteria, and dead volume in the system, or PFA encapsulated O-rings which take a compression set and leak over time. The union is assembled and double bagged in a Class 100 clean room. Connections made with the No-O-Ring union remain leak-tight over a long working life, with no re-tightening necessary. The union can be hand-tightened, requiring no additional tools and is pressure rated to 120 psi. Contact: Furon Company, 3340 East La Palma Avenue, Anaheim, CA 92806, USA. Tel: +l 714 630 5818; Fax: +l 714 630 6640.
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GTC head elected to Fluid Sealing Association board Mr Phil Paino, company president of Greene, Tweed & Co, has joined the board of directors of the Fluid Sealing Association. Mr Paino has been with GTC for 31 years, starting his career with the company in 1966 as a field sales representative. He subsequently held several sales and marketing positions until 1982 when he was elected company president by the board. He is a 1962 graduate of Drexel University with a BS degree in Finance. Contact: The Fluid Sealing Association, 995 Old Eagle Road, Suite 1019, Wayne, PA 19087, USA. Tel: +l 610 971 4850; Fax: +l 610 971 4859: www.fluidsealing.com
Semiconductor sealing handbook published In response to a long-standing need, the first definitive sealing handbook for the semiconductor manufacturing industry has now been created. Greene, Tweed 8r Co. will soon release The Right Seal, a comprehensive guide to seals and sealing in semiconductor fabrication processes. GTC believes the handbook to be the first of its kind in the sealing industry. The Right Seal contains detailed technical information on a wide variety of seal types and materials, specifically for the benefit of those individuals who design equipment and specify seals and sealing materials for the semiconductor fabrication industry. Each of the seal designs and materials discussed in these pages has a proven track
Sealing
Technology
No. 47
record in the complex and unforgiving applications encountered in semiconductor processing. While Greene, Tweed’s products are naturally featured in the publication, the handbook is broad-based and comprehensive. Included are chapters on:
.
Sealing requirements of the semiconductor industry Physical properties of elastomers O-ring seals Dovetail seals MSE seals Specialty applications Seal gland design Glossary of semiconductor Sealing terms
Also included in the fully illustrated handbook is a comprehensive collection of data sheets and technical materials relating to Semiconductor manufacturing sealing. Complimentary copies of The Right Seal will be made available to semiconductor industry professionals upon request. Contact: Greene, Tweed & Co, Semiconductor Division, San Jose, CA, USA. Tel: +l ,408 468 0180; Fax: +l 408 468 0170.
No-O-Ring ensures leak-free seal Furon has developed an innovative PFA union featuring a tongue and groove seal joint that offers reliable, leak-free service without the need for an O-ring. The No-O-Ring union is engineered to join components in welded PFA piping systems for ambient and high temperature wet process tools in the semiconductor industry. In addition to eliminating leakage and contamination issues associated with O-ring connections, the No-O-Ring union is quickly assembled and disassembled. The joint is made from high-purity PFA with a non-wetted ETFE nut, materials which do not introduce contammation into the system or react to the corrosive chemicals used in the semiconductor industry. The tongue and groove desigr. eliminates fluoroelastomeric O-rings, which tend to be a source of contamination, retained chemicals. bacteria, and dead volume in the system, or PFA encapsulated O-rings which take a compression set and leak over time. The union is assembled and double bagged in a Class 100 clean room. Connections made with the No-O-Ring union remain leak-tight over a long working life, with no re-tightening necessary. The union can be hand-tightened, requiring no additional tools and is pressure rated to 120 psi. Contact: Furon Company, 3340 East La Palma Avenue, Anaheim, CA 92806, USA. Tel: +l 714 630 5818; Fax: +l 714 630 6640.
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